Wholesale Screw Air Compressor Exporter from China VS USA Exporter: Which Brand Delivers Superior Energy Efficiency 2026-10-24 · EIN Presswire · Energy, Food & drink, Industrial, Biotech & pharma, Semiconductors, Chemicals & materials https://www.einpresswire.com/article/951924266/wholesale-screw-air-compressor-exporter-from-china-vs-usa-exporter-which-brand-delivers-superior-energy-efficiency SHANGHAI, SHANGHAI, CHINA, October 25, 2026 / EINPresswire.com / -- Global industrial manufacturing faces double pressure: persistent inflation inflating operational overhead and rising energy costs eating into bottom-line profits. Industrial facilities across general manufacturing, petrochemicals, semiconductor manufacturing, and food and pharmaceutical sectors are actively scrutinizing utility expenditures. Compres ———————————————————————————————————————————————————————————— Semtech Brings 5G Network Slicing, FIPS 140-3 to IACP 2026 2026-10-24 · Business Wire · Finance, AI, Telecom, Semiconductors, Cloud & data centers, Internet & apps https://finance.yahoo.com/technology/articles/semtech-brings-5g-network-slicing-120000374.html AirLink 5G Solutions Keep First Responders Connected During Peak Network Demand CAMARILLO, Calif., October 24, 2026--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things ("IoT") devices ———————————————————————————————————————————————————————————— The Smartphone Power Management Integrated Circuit (IC) Market is Projected to Grow Rapidly at a 7.5% CAGR Until 2030 2026-10-23 · EIN Presswire · Semiconductors, Consumer electronics https://www.einpresswire.com/article/950510368/the-smartphone-power-management-integrated-circuit-ic-market-is-projected-to-grow-rapidly-at-a-7-5-cagr-until-2030 Smartphone Power Management Integrated Circuit (IC) Market Trends The Business Research Company The Business Research Company’s Smartphone Power Management Integrated Circuit (IC) Global Market Report 2026 – Market Size, Trends, And Forecast 2026-2035 LONDON, GREATER LONDON, UNITED KINGDOM, October 23, 2026 / EINPresswire.com / -- The smartphone power management integrated circuit (IC) market is experiencing signific ———————————————————————————————————————————————————————————— The Specialized Semiconductor Market is Projected to Reach $212.45 Billion by 2030 Driven by Robust Industry Expansion 2026-10-23 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950134552/the-specialized-semiconductor-market-is-projected-to-reach-212-45-billion-by-2030-driven-by-robust-industry-expansion Specialized Semiconductor Market The Business Research Company The Business Research Company's Specialized Semiconductor Market Report 2026 – Market Size, Trends, And Global Forecast 2026-2035 LONDON, GREATER LONDON, UNITED KINGDOM, October 23, 2026 / EINPresswire.com / -- "The specialized semiconductor market has attracted significant attention due to its rapid expansion and critical role in various advanced technol ———————————————————————————————————————————————————————————— Tradr Announces Liquidation of SKHA and SKHN 2026-10-23 · PR Newswire · Semiconductors, Investing & markets https://www.prnewswire.com/news-releases/tradr-announces-liquidation-of-skha-and-skhn-302918283.html NEW YORK, Oct. 23, 2026 -- Tradr ETFs, a provider of ETFs designed for sophisticated investors and professional traders, today announced that a plan of liquidation has been approved for the following funds: Tradr 2X Long SK hynix Daily ETF (Cboe: SKHA) Tradr 2X Short SK hynix... ———————————————————————————————————————————————————————————— Qualcomm Schedules Fourth Quarter and Fiscal 2026 Earnings Release and Conference Call 2026-10-23 · WebWire · Finance, Semiconductors https://www.webwire.com/ViewPressRel.asp?aId=363259 Qualcomm Incorporated (NASDAQ: QCOM) announced that it will publish the Company's financial results for its fourth quarter and fiscal 2026 on Wednesday, November 4, 2026, after the close of the market on the Company's Investor Relations website, at https://investor.qualcomm.com/financial-information. The earnings release will also be furnished to the Securities and Exchange Commission (SEC) on a Form 8-K, which will be available on the SEC website at http://www.sec.gov. - - Qualcomm will h... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=363259 ———————————————————————————————————————————————————————————— Industrial Technology World Asia by RX to Spotlight AI-Powered Manufacturing in Shenzhen this October 2026-10-23 · PR.com · AI, Automotive, Industrial, Logistics, Semiconductors https://www.pr.com/press-release/981487 ITWA 2026 brings together global leaders in electronics, robotics, automotive, semiconductors, displays, and materials, offering innovation, sourcing, and networking opportunities across the manufacturing supply chain. [PR.com] ———————————————————————————————————————————————————————————— Getac’s Next Generation B360X and B360X Pro Fully Rugged Notebooks Bring the Power of Edge AI to Frontline Professionals 2026-10-23 · EIN Presswire · AI, Semiconductors, Consumer electronics https://www.einpresswire.com/article/951757545/getac-s-next-generation-b360x-and-b360x-pro-fully-rugged-notebooks-bring-the-power-of-edge-ai-to-frontline-professionals Getac launches B360X and Pro fully rugged laptops Getac B360X and Pro fully rugged laptops runs AI workloads on the device itself, so mission-critical applications keep working when connectivity doesn’t. Getac’s latest B360 lineup boast advanced Intel Core Ultra Series 3 processors, 14-inch screen, and enhanced security and extensive connectivity options. TELFORD, UNITED KINGDOM, October 23, 2026 / EINPresswire.com / ———————————————————————————————————————————————————————————— Innovations from a Global Leading Quartz Boat Solution Provider for Wafer Processing 2026-10-23 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/951704214/innovations-from-a-global-leading-quartz-boat-solution-provider-for-wafer-processing LIANYUNGANG, JIANGSU, CHINA, October 23, 2026 / EINPresswire.com / -- Inside high-temperature semiconductor fabrication facilities, furnace operators monitor glow-tube displays as silicon wafers glide smoothly along automated tracks into high-purity glass holding assemblies. During critical thermal processing steps, these specialized carriers—commonly known as a quartz boat —support silicon substrates under intense h ———————————————————————————————————————————————————————————— Small Signal MOSFET Market Size, Share, Trends, Competitive Landscape and Global Forecast 2026-10-23 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950131949/small-signal-mosfet-market-size-share-trends-competitive-landscape-and-global-forecast Small Signal Power Metal-Oxide-Semiconductor Field-Effect Transistor Market Size The Business Research Company's Small Signal MOSFET Market Size, Share, Trends, Competitive Landscape and Global Forecast Expected to grow to $1.68 billion in 2030 at a compound annual growth rate (CAGR) of 6.8%” — The Business Research Company LONDON, GREATER LONDON, UNITED KINGDOM, October 23, 2026 / EINPresswire.com / -- "The small si ———————————————————————————————————————————————————————————— Bulletin from Sivers Semiconductors AB's Extraordinary General Meeting on 22 October 2026 2026-10-22 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/bulletin-from-sivers-semiconductors-abs-extraordinary-general-meeting-on-22-october-2026-302917519.html KISTA, Sweden, Oct. 22, 2026 -- The Extraordinary General Meeting in Sivers Semiconductors AB (the "Company") was held on 22 October 2026 and in particular the following resolutions were resolved. Election of auditor The Extraordinary General Meeting resolved, in accordance... ———————————————————————————————————————————————————————————— Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI 2026-10-22 · Business Wire · AI, SaaS, Semiconductors https://finance.yahoo.com/technology/ai/articles/rambus-chipagents-collaborate-accelerate-chip-210000262.html Strategic partnership combines Rambus deep semiconductor and silicon IP expertise with ChipAgents tool-agnostic, AI-native chip design platform to improve chip design speed and productivity Rambus adopts ChipAgents agentic AI platform to accelerate its own chip and IP design and verification workflows The partnership brin ———————————————————————————————————————————————————————————— Hyperscale Data Announces Suspension of Its At-the-Market Offering 2026-10-22 · PR Newswire · Finance, AI, Semiconductors, Cloud & data centers https://www.prnewswire.com/news-releases/hyperscale-data-announces-suspension-of-its-at-the-market-offering-302917415.html LAS VEGAS, Oct. 22, 2026 -- Hyperscale Data, Inc. (NYSE American: GPUS), an artificial intelligence ("AI") data center company ("Hyperscale Data" or the "Company"), today announced that it has suspended the At-the-Market Offering ("ATM") provided for in the Issuance Sales... ———————————————————————————————————————————————————————————— Forge Nano Lists on NASDAQ, Bringing Atomic-Scale Innovation to American Semiconductor and Battery Manufacturing 2026-10-22 · GlobeNewswire · Finance, AI, Energy, Industrial, Semiconductors, Chemicals & materials https://www.globenewswire.com/news-release/2026/10/22/3386912/0/en/forge-nano-lists-on-nasdaq-bringing-atomic-scale-innovation-to-american-semiconductor-and-battery-manufacturing.html DENVER, Oct. 22, 2026 -- Forge Nano, Inc., a leading U.S.-based semiconductor equipment and advanced materials company pioneering Atomic Layer Deposition (“ALD”) technology for artificial intelligence (“AI”)-era chip manufacturing and defense battery applications, announced today that it has completed its previously announced business combination with Archimedes Tech SPAC Partners II Co. (“Archimedes II”) (NASDAQ: ATII), a publicly traded special purpose acquisition company. ———————————————————————————————————————————————————————————— Reliance Global Group Signs LOI to Acquire a GPU Cloud Provider, Targeting Rapid Growth in AI Infrastructure 2026-10-22 · GlobeNewswire · Finance, AI, SaaS, Semiconductors, Cloud & data centers https://www.globenewswire.com/news-release/2026/10/22/3386743/0/en/reliance-global-group-signs-loi-to-acquire-a-gpu-cloud-provider-targeting-rapid-growth-in-ai-infrastructure.html Acquisition Structured With No Shareholder Dilution; Company Remains Debt-Free With Acquisition Funding Already in Place ———————————————————————————————————————————————————————————— Garrison Ventures' Richard Brook Featured on CBS News' 60 Minutes Examining Global Helium Supply Crisis 2026-10-22 · ACCESS Newswire · AI, Semiconductors https://finance.yahoo.com/energy/articles/garrison-ventures-richard-brook-featured-154500063.html Closure of the Strait of Hormuz threatens global helium supplies as artificial intelligence drives rapidly growing demand from the semiconductor industry AUSTIN, TX / October 22, 2026 / Richard Brook, President of Garrison Ventures and a veteran of the global helium industry, was featured in the October ———————————————————————————————————————————————————————————— GIGABYTE Issues Final Call for Custom GeForce RTX 5080 GPU Sweepstakes 2026-10-22 · PR Newswire · Gaming, Semiconductors, Software & IT, Consumer electronics https://www.prnewswire.com/news-releases/gigabyte-issues-final-call-for-custom-geforce-rtx-5080-gpu-sweepstakes-302916341.html CITY OF INDUSTRY, Calif., Oct. 22, 2026 -- GIGABYTE Technology, a global leader in high-performance PC hardware, is issuing a final call to PC gaming enthusiasts across North America to enter its exclusive sweepstakes celebrating Microsoft's highly anticipated title, Gears of... ———————————————————————————————————————————————————————————— Blackmagic Design Announces Price Increases Due to Rising Memory Costs 2026-10-22 · WebWire · AI, Semiconductors, Cloud & data centers https://www.webwire.com/ViewPressRel.asp?aId=363217 Blackmagic Design announced price increases on 36 products due to the rising cost of memory. - - “These price increases are frustrating,” said Grant Petty, Blackmagic Design CEO. "Over the past year the cost of memory, specifically the DRAM, flash and SSD storage that goes into almost everything we make, has risen several times over. The cause is memory manufacturers shifting their production to supply AI data centers. - - "Our suppliers tell us memory consumption is now running 60% higher t... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=363217 ———————————————————————————————————————————————————————————— Single-Level Cell (SLC) NAND Flash Memory Market Report Covers Key Segments, Developments, and Leading Competitors 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950608436/single-level-cell-slc-nand-flash-memory-market-report-covers-key-segments-developments-and-leading-competitors Single-Level Cell (SLC) NAND Flash Memory Market Report 2026 The Business Research Company The Business Research Company’s Single-Level Cell (SLC) NAND Flash Memory Global Market Report 2026 – Market Size, Trends, And Forecast 2026-2035 LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com / -- The single-level cell (SLC) NAND flash memory market has experienced significant growth in recent year ———————————————————————————————————————————————————————————— Movandi Wins 2026 Mobile Breakthrough Award for Fixed Wireless Solution of the Year 2026-10-22 · Business Wire · SaaS, Telecom, Semiconductors https://finance.yahoo.com/technology/articles/movandi-wins-2026-mobile-breakthrough-140100475.html Recognition honors Movandi's innovation in 60GHz fixed wireless broadband IRVINE, Calif., October 22, 2026--Movandi , the semiconductor and systems innovator powering next-generation wireless communications, today announced that its 60GHz fixed wireless platform was named "Fixed Wireless Solution of t ———————————————————————————————————————————————————————————— The Silicon Radio Frequency (RF) Semiconductor Market is projected to grow to $28.38 billion by 2030 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950623559/the-silicon-radio-frequency-rf-semiconductor-market-is-projected-to-grow-to-28-38-billion-by-2030 Silicon Radio Frequency (RF) Semiconductor Market Report The Business Research Company The Business Research Company’s Silicon Radio Frequency (RF) Semiconductor Global Market Report 2026 – Market Size, Trends, And Forecast 2026-2035 LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com / -- The silicon radio frequency (RF) semiconductor sector has seen rapid expansion recently, driven by the gr ———————————————————————————————————————————————————————————— Silicon Carbide (SIC) Chemical Mechanical Planarization (CMP) Pads Is Expected to Experience Steady Growth 2026-10-22 · EIN Presswire · Semiconductors, Chemicals & materials https://www.einpresswire.com/article/950609512/silicon-carbide-sic-chemical-mechanical-planarization-cmp-pads-is-expected-to-experience-steady-growth Silicon Carbide (SIC) Chemical Mechanical Planarization (CMP) Pads The Business Research Company The Business Research Company’s Silicon Carbide (SIC) Chemical Mechanical Planarization (CMP) Pads Global Market Report 2026 – Trends, And Forecast 2026-2035 LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com / -- The silicon carbide (SiC) chemical mechanical planarization (CMP) pads and slurry ma ———————————————————————————————————————————————————————————— Helion Signs Letter of Intent for $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D to Support Fusion Energy 2026-10-22 · Business Wire · Energy, Industrial, Semiconductors https://finance.yahoo.com/technology/articles/helion-signs-letter-intent-175-130500291.html Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state. Project will also support research and development for domestic next-generation semiconductor tooling. EVERETT, Wash., October 22, 2026 --( BUSIN ———————————————————————————————————————————————————————————— Vertical Semiconductor Signs Letter of Intent with U.S. Department of Commerce for $73 Million in CHIPS Funding to Accelerate R&D of Vertical GaN Power Transistors 2026-10-22 · Business Wire · Finance, AI, Semiconductors, Cloud & data centers https://finance.yahoo.com/technology/ai/articles/vertical-semiconductor-signs-letter-intent-130100325.html Funding through the CHIPS Research and Development Office (CRDO) Will Advance Critical Technology That Unlocks Compute Power for U.S. AI Data Centers BOSTON, October 22, 2026--Vertical Semiconductor , a power semiconductor company, today announced it has signed a letter of intent with the U.S. Departm ———————————————————————————————————————————————————————————— Recent Silicon Carbide (SiC) Wafer Market Analysis by The Business Research Company, Emphasizing Upcoming Industry Trend 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950615982/recent-silicon-carbide-sic-wafer-market-analysis-by-the-business-research-company-emphasizing-upcoming-industry-trend Silicon Carbide (SIC) Wafer Market Report The Business Research Company The Business Research Company’s Recent Silicon Carbide (SiC) Wafer Global Market Report 2026 – Market Size, Trends, And Forecast 2026-2035 LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com / -- The silicon carbide (SiC) wafer market has witnessed remarkable expansion in recent years, driven by technological advancements ———————————————————————————————————————————————————————————— The Global Single-Core Microprocessor Market is Entering a Period of Rapid Growth 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950609875/the-global-single-core-microprocessor-market-is-entering-a-period-of-rapid-growth Single-Core Microprocessor The Business Research Company The Business Research Company’s Global Single-Core Microprocessor Global Market Report 2026 – Market Size, Trends, And Forecast 2026-2035 LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com / -- The single-core microprocessor market has experienced significant growth recently, driven by advancements in various technology sectors. As the ———————————————————————————————————————————————————————————— Innovorbs Technologies Launches AI Data Center Infrastructure Practice for GPU Clusters and Private AI Deployments 2026-10-22 · EIN Presswire · AI, Semiconductors, Software & IT, Cloud & data centers https://www.einpresswire.com/article/950490398/innovorbs-technologies-launches-ai-data-center-infrastructure-practice-for-gpu-clusters-and-private-ai-deployments Tayyab Muhammad, CEO of Innovorbs Technologies, expanding global 24/7 managed IT services and staff augmentation. Houston firm designs, builds, and operates RoCEv2, InfiniBand, and Ultra Ethernet GPU fabrics, NVMe-oF storage, and liquid-cooled GPU pods for enterprise IT An AI cluster is only as fast as its slowest link. We engineer the fabric, the storage path, and the cooling as one system so the GPUs actually run a ———————————————————————————————————————————————————————————— FormFactor Opens Farmers Branch Manufacturing Facility to Support Growing Demand for Advanced Probe Card Technologies 2026-10-22 · GlobeNewswire · Industrial, Semiconductors, Agriculture https://www.globenewswire.com/news-release/2026/10/22/3386406/0/en/formfactor-opens-farmers-branch-manufacturing-facility-to-support-growing-demand-for-advanced-probe-card-technologies.html Strategic investment enhances manufacturing scale, operational flexibility, and customer support as semiconductor test requirements continue to advance Strategic investment enhances manufacturing scale, operational flexibility, and customer support as semiconductor test requirements continue to advance ———————————————————————————————————————————————————————————— Laser Photonics to Host Third Quarter 2026 Earnings Call on November 12, 2026 at 8:00 a.m. Eastern Time 2026-10-22 · Newswire.com · Finance, SaaS, Energy, Industrial, Biotech & pharma, Semiconductors https://www.newswire.com/news/laser-photonics-to-host-third-quarter-2026-earnings-call-on-november-12-2026-at Laser Photonics Corporation (NASDAQ:LASE), an emerging directed energy and laser technology platform developing applications for defense, semiconductor, pharmaceutical and industrial markets (the "Company"), today announced that it will release financial results for the third quarter ended September 30, 2026 before market open on Thursday, November 12, 2026. Management will host an investor conference call at 8:00 a. ———————————————————————————————————————————————————————————— AAEON to Debut New Networking & Cybersecurity Solutions Powered by Intel Xeon 6 Processors at it-sa Expo&Congress 2026 2026-10-22 · PR.com · Cybersecurity, Semiconductors, Government & policy https://www.pr.com/press-release/982374 AAEON’s comprehensive lineup of networking and security platforms will be on show throughout Europe’s leading IT security tradeshow. [PR.com] ———————————————————————————————————————————————————————————— Microchip Adds the LX-820 Quartz Oscillator to its L-Series Timing Portfolio Developed for Low Earth Orbit Applications 2026-10-22 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/10/22/3386249/0/en/microchip-adds-the-lx-820-quartz-oscillator-to-its-l-series-timing-portfolio-developed-for-low-earth-orbit-applications.html The company’s L-Series timing devices are designed to scale between COTS and traditional space-grade solutions, offering shorter lead times at competitive price points The company’s L-Series timing devices are designed to scale between COTS and traditional space-grade solutions, offering shorter lead times at competitive price points ———————————————————————————————————————————————————————————— Lattice Semiconductor Appoints John McCool and Raejeanne Skillern to Board of Directors 2026-10-22 · Business Wire · Finance, SaaS, Semiconductors https://finance.yahoo.com/technology/articles/lattice-semiconductor-appoints-john-mccool-110000336.html HILLSBORO, Ore., October 22, 2026--Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the appointment of John McCool and Raejeanne Skillern to the Company's Board of Directors effective Oct. 21, 2026. Both bring strong experience driving grow ———————————————————————————————————————————————————————————— Noble Gas Market Trends Shaping Semiconductor Manufacturing in 2026 2026-10-22 · Express Press Release · Energy, Industrial, Aerospace & defense, Semiconductors https://express-press-release.net/news/2026/10/22/1778040 The global noble gas market is entering a period of steady expansion as demand rises across healthcare, electronics, aerospace, manufacturing, and scientific applications. The market [read full press release...] ———————————————————————————————————————————————————————————— Burckhardt Compression secures orders for semiconductor hydrogen application 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/951437702/burckhardt-compression-secures-orders-for-semiconductor-hydrogen-application Compressor Skid Semiconductor SYCC, a subsidiary of BC, has secured several orders for diaphragm compressor units supporting hydrogen applications in the semiconductor industry. WINTERTHUR, SWITZERLAND, October 22, 2026 / EINPresswire.com / -- Shenyang Yuanda Compressor Co., Ltd. (SYCC), a subsidiary of Burckhardt Compression , has secured several orders for diaphragm compressor units supporting hydrogen applications ———————————————————————————————————————————————————————————— Supermicro Introduces the NVIDIA Vera CPU Rack, a 256 CPU, 100% Liquid-Cooled Rack-Scale Solution, Complementing the NVIDIA Vera Rubin Platform, for Agentic AI at Scale 2026-10-22 · PR Newswire · AI, SaaS, Energy, Semiconductors https://www.prnewswire.com/news-releases/supermicro-introduces-the-nvidia-vera-cpu-rack-a-256-cpu-100-liquid-cooled-rack-scale-solution-complementing-the-nvidia-vera-rubin-platform-for-agentic-ai-at-scale-302916308.html Delivers dedicated 256 NVIDIA Vera CPU capacity for agent sandboxes, complementing NVIDIA Vera Rubin NVL72 with common DCBBS infrastructure with third-generation NVIDIA MGX racks and battery backup units Integrates NVIDIA Vera CPUs and BlueField™-4 DPUs with the NVIDIA Open Agent Safety... ———————————————————————————————————————————————————————————— VDR.ai Partners with LLM.co to Deliver Custom AI Hardware and Private LLM Deployments for Financial Institutions 2026-10-22 · MarketersMEDIA · AI, SaaS, Semiconductors, Banking, Investing & markets, Software & IT https://news.marketersmedia.com/vdrai-partners-with-llmco-to-deliver-custom-ai-hardware-and-private-llm-deployments-for-financial-institutions/89206875 Strategic partnership combines AI-powered virtual data rooms, dedicated GPU infrastructure, and private large language models for investment banks, private equity firms, and financial services organizations. -- VDR.ai , an AI-powered virtual data room and financial due diligence software platform, today announced a strategic partnership with LLM.co, a provider of private large language model (LLM) infrastructure and ———————————————————————————————————————————————————————————— Sony Semiconductor Solutions Announces 1 mm Square Image Sensor for Medical Single-Use Endoscopes, Featuring Industry's First [*1] 5 m Digital Transmission and High Image Quality 2026-10-22 · PR Newswire · Healthcare, Semiconductors, Consumer electronics https://www.prnewswire.com/news-releases/sony-semiconductor-solutions-announces-1-mm-square-image-sensor-for-medical-single-use-endoscopes-featuring-industrys-first-1-5-m-digital-transmission-and-high-image-quality-302899093.html Providing stable transmission of high-definition images for thin endoscopes ATSUGI, Japan, Oct. 22, 2026 -- Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the IMX742, a CMOS image sensor with approximately 0.51 effective megapixels*2... ———————————————————————————————————————————————————————————— Sony Semiconductor Solutions Announces 1 mm Square Image Sensor for Medical Single-Use Endoscopes, Featuring Industry's First*¹5 m Digital Transmission and High Image Quality 2026-10-22 · PR Newswire · Healthcare, Semiconductors, Consumer electronics https://www.prnewswire.com/news-releases/sony-semiconductor-solutions-announces-1-mm-square-image-sensor-for-medical-single-use-endoscopes-featuring-industrys-first5-m-digital-transmission-and-high-image-quality-302916055.html Providing stable transmission of high-definition images for thin endoscopes ATSUGI, Japan, Oct. 21, 2026 -- Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the IMX742, a CMOS image sensor with approximately 0.51 effective megapixels*2... ———————————————————————————————————————————————————————————— Global RF Power Semiconductor Market Size, Share, Trends and Growth Forecast at 9.3% CAGR 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950106445/global-rf-power-semiconductor-market-size-share-trends-and-growth-forecast-at-9-3-cagr The Business Research Company Radio Frequency (RF) Power Semiconductor Market Overview The Business Research Company's Global RF Power Semiconductor Market Size, Share, Trends and Growth Forecast at 9.3% CAGR Expected to grow to $25.75 billion in 2030 at a compound annual growth rate (CAGR) of 9.3%” — The Business Research Company LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com / -- "The r ———————————————————————————————————————————————————————————— Radio Frequency Gallium Nitride Market Size, Share, Trends and Forecast to Reach $3.49 Billion by 2030 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950105115/radio-frequency-gallium-nitride-market-size-share-trends-and-forecast-to-reach-3-49-billion-by-2030 Radio Frequency (RF) Gallium Nitride Market Overview The Business Research Company's Radio Frequency Gallium Nitride Market Size, Share, Trends and Forecast to Reach $3.49 Billion by 2030 Expected to grow to $3.49 billion in 2030 at a compound annual growth rate (CAGR) of 22%” — The Business Research Company LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com / -- "The radio frequency (RF) gal ———————————————————————————————————————————————————————————— Radio Frequency (RF) Semiconductor Market Size, Share, Trends and Forecast to Reach $42.64 Billion by 2030 2026-10-22 · EIN Presswire · Semiconductors https://www.einpresswire.com/article/950116173/radio-frequency-rf-semiconductor-market-size-share-trends-and-forecast-to-reach-42-64-billion-by-2030 The Business Research Company Radio Frequency (RF) Semiconductor Market Overview The Business Research Company's Radio Frequency (RF) Semiconductor Market Size, Share, Trends and Forecast to Reach $42.64 Billion by 2030 Expected to grow to $42.64 billion in 2030 at a compound annual growth rate (CAGR) of 7.7%” — The Business Research Company LONDON, GREATER LONDON, UNITED KINGDOM, October 22, 2026 / EINPresswire.com ———————————————————————————————————————————————————————————— Gracchus Partners Launches The Growth Sequence, With One Growth Leader in Place of CMO, CRO and CCO 2026-10-21 · Newsworthy.ai · Finance, AI, SaaS, Education, Industrial, Semiconductors https://newsworthy.ai/news/202610212975/gracchus-partners-launches-the-growth-sequence-with-one-growth-leader-in-place-of-cmo-cro-and-cco Houston, Texas Wednesday Oct 21, 2026 @ 5:10 PM Central — Gracchus Partners LLC, a growth company based in Houston, today announced it has completed its pilot phase and launched The Growth Sequence. It is one integrated system that aligns a company's market edge, marketing, sales and operations, in that order. It is built for founders, owners and executive teams who want exponential growth, meaning revenue that grows faster than the cost of getting it. Most companies buy growth in pieces. They hire an agency for marketing and a consultant for sales, then add software for operations. None of them starts from what makes the business hard to copy. Each part works alone, and the owner is left stuck at the same revenue with a bigger bill. The Growth Sequence replaces the pieces with one order: Compelling Market Edge (CME)  →  Marketing  →  Sales  →  Operations Compelling Market Edge: what makes the business hard to copy and what makes a buyer act now. Marketing: product, price, place and promotion, all built on that edge. Sales: turning demand into closed revenue. Operations: delivering so the promise holds as volume grows, without costs growing at the same rate. “Most businesses can achieve growth. They get some by working harder or spending more,” said Brandon Fears, founder and managing partner of Gracchus Partners. “Exponential growth requires a sequence. That means revenue growing faster than what you spend to get it, and it only happens when marketing, sales and operations all run off the same edge. Most businesses have never found theirs, and that's usually why the rest of the plan hasn't worked.” “I've run growth at the speed of tech, and I've run it through the red tape of a conglomerate,” Fears said. “Different speeds, same sequence. Find the edge a competitor can't copy. Then market it, sell it and deliver it, in that order. The order doesn't move. What fills it in does.” The same sequence cuts cost. One growth leader takes the place of three executive hires and the overlap between them. Promotion waits until the foundation is ready, so ad budgets stop draining before they can return anything. In operations, Fears separates a true cost increase from a positioning problem that only shows up as a cost problem. Owners cut what is wasting money and protect what is winning buyers. “Most owners think they have a cost problem,” Fears said. “Often the costs didn't change much. The reason to choose them got less clear, and suddenly every line item hurts. Fix the reason, and you know exactly what to cut and what to keep.” Fears built the method across a 25 year career, including 23 years inside the Fortune 500. He joined Compaq in product marketing in 2001 and stayed through its acquisition by HP and HP's later split, which created Hewlett Packard Enterprise. Over 15 years there, his work included the ProLiant DL360 server line, a $2 billion portfolio. From 2016 to 2021 he was a Global Account Manager at Intel Corporation, where he carried a sales bag. He then led offering management as Senior Director in Honeywell's Performance Materials and Technologies organization, then an $11 billion business. He has worked both sides of the revenue equation: building demand as a marketer and closing it as a seller. That experience is why Gracchus Partners replaces three roles that most growing companies hire separately: the Chief Marketing Officer, the Chief Revenue Officer and the Chief Commercial Officer. One leader owns the sequence from edge to revenue, so nothing is lost in the handoff between departments. “Marketing says the leads were good. Sales says the leads were bad. I've sat in both chairs,” Fears said. “When one person owns both sides of the equation, the argument ends and the revenue shows up.” The sequence doesn't change by industry. Results from the pilot phase: Independent visual artist: sold three original works and now earns ongoing income through Instagram. Commercial cleaning franchise, San Antonio: closed contracts for nine locations in its first 28 days, adding more than $60,000 in annual revenue. Early stage SaaS company: grew to 15,000 paying subscribers after repositioning. With the pilot phase complete, Gracchus Partners is now opening a limited number of engagements to new clients in Houston, San Antonio and Las Vegas, and with companies worldwide. “The pilots had one job: prove the sequence works across businesses that have nothing in common,” Fears said. “An artist, a cleaning franchise and a software company all grew on the same order. The proof is in. Now we grow.” “I've had launches fail,” Fears said. “Anyone who tells you they never have is selling something. Twenty five years of watching what scaled and what didn't is what built this sequence.” Engagements range from a guided growth map that the client's team runs to an embedded growth partner who leads the work. Fears brings the same testing discipline to his brisket rub. “Ask me about the sequence,” he said, “and I might bring you a plate to prove the point.” Business leaders can book a Sequence Snapshot at www.gracchuspartners.com. The Sequence Snapshot is a 30 minute diagnostic call, and its fee is credited toward a full engagement. At a Glance Company: Gracchus Partners LLC, Houston, Texas Founder: Brandon Fears, Founder and Managing Partner. MBA, Rice University Jones Graduate School of Business. BA in Political Science, UNLV. Philosophy: Most businesses can achieve growth, but exponential growth requires a sequence. Method: The Growth Sequence (CME → Marketing → Sales → Operations) Replaces: the separate Chief Marketing Officer, Chief Revenue Officer and Chief Commercial Officer roles, with one growth leader Cuts cost by: consolidating three executive roles into one, holding promotion until the foundation is ready, and separating true cost increases from positioning problems Definition of exponential growth: revenue growing faster than the spend required to produce it Fortune 500 background: Compaq, HP and Hewlett Packard Enterprise; Intel Corporation; Honeywell Serves: founders, owners and executive teams, from early stage companies to established enterprises Status: pilot phase complete; now opening a limited number of engagements Markets: Houston, San Antonio and Las Vegas, with clients worldwide Entry point: Sequence Snapshot, a 30 minute paid diagnostic About Gracchus Partners LLC Gracchus Partners is a growth company, not a marketing agency. Founder Brandon Fears serves as a Fractional Chief Growth Officer, one role in place of the CMO, CRO and CCO. He installs one system across market edge, marketing, sales and operations that grows revenue and cuts cost. The firm reports on one metric: revenue. The firm's philosophy: Most businesses can achieve growth, but exponential growth requires a sequence. Look out for a future episode of The Building Texas Show featuring guest, Brandon Fears. ———————————————————————————————————————————————————————————— 3D Systems Opens New Industrial Technology Center to Expand America's Advanced Manufacturing Capacity 2026-10-21 · GlobeNewswire · Finance, Industrial, Aerospace & defense, Semiconductors https://www.globenewswire.com/news-release/2026/10/21/3385967/8852/en/3d-systems-opens-new-industrial-technology-center-to-expand-america-s-advanced-manufacturing-capacity.html ROCK HILL, S.C., Oct. 21, 2026 -- 3D Systems (NYSE: DDD) today announced the grand opening of its new Industrial Technology Center in Littleton, Colorado, expanding the company's ability to help aerospace, defense, and semiconductor equipment manufacturers accelerate the development, qualification, and production of mission-critical components using 3D printing. ———————————————————————————————————————————————————————————— Forge Nano to Trade on NASDAQ as NANO After Completing Business Combination with Archimedes Tech SPAC Partners II Co. 2026-10-21 · GlobeNewswire · Finance, AI, Energy, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/10/21/3385921/0/en/forge-nano-to-trade-on-nasdaq-as-nano-after-completing-business-combination-with-archimedes-tech-spac-partners-ii-co.html DENVER, Oct. 21, 2026 -- Forge Nano, Inc., a leading U.S.-based semiconductor equipment and advanced materials company pioneering Atomic Layer Deposition (“ALD”) technology for artificial intelligence (“AI”)-era chip manufacturing and defense battery applications, today announced the completion of its previously announced business combination following an extraordinary general meeting of Archimedes Tech SPAC Partners II Co. (“Archimedes II”) (NASDAQ: ATII) on October 16, 2026. The combined company will operate as Forge Nano Holdings, Inc. and its common stock and warrants are expected to commence trading on the NASDAQ under the ticker symbols “NANO” and “NANOW,” respectively, on October 22, 2026. ———————————————————————————————————————————————————————————— Klique Announces Expanded Integrations with NVIDIA to Accelerate Enterprise AI Workflows and Optimize GPU Utilization 2026-10-21 · ACCESS Newswire · AI, SaaS, Semiconductors https://finance.yahoo.com/technology/ai/articles/klique-announces-expanded-integrations-nvidia-183500244.html Klique deepens its collaboration with NVIDIA through platform support for NVIDIA Nemotron 3.5 Super VL, OpenShell, Dynamo, and NeMo Switchyard. SAN FRANCISCO, CA / October 21, 2026 / Klique , an enterprise control plane for AI resource management, governance, and cost visibility, today announced a suite ———————————————————————————————————————————————————————————— Amadeus and NVIDIA Deepen AI Collaboration to Explore Faster Flight Search 2026-10-21 · Travel PR News · AI, SaaS, Travel, Semiconductors https://travelprnews.com/article/amadeus-and-nvidia-deepen-ai-collaboration-to-explore-faster-flight-search/?utm_source=rss&utm_medium=rss&utm_campaign=amadeus-and-nvidia-deepen-ai-collaboration-to-explore-faster-flight-search A new memorandum of understanding expands GPU testing, travel-specific AI research and cloud optimisation as automated travel shopping grows. KEY TAKEAWAYS Amadeus and NVIDIA have signed a memorandum of understanding to deepen research into accelerated flight search and travel-specific AI. Initial benchmarking on NVIDIA Hopper and Blackwell GPUs suggests potential improvements in search response times... Read the full news article ———————————————————————————————————————————————————————————— Qualcomm to Unite Regional V2X Standards Under Global V2X Solution 2026-10-21 · WebWire · SaaS, Semiconductors https://www.webwire.com/ViewPressRel.asp?aId=363129 Highlights: - - - • Qualcomm ® V2X chipsets to support the 760 MHz ITS Connect standard utilized in Japan, further extending a globally interoperable platform across major V2X deployments worldwide. - - • Qualcomm advances globally interoperable V2X solutions to help accelerate deployment of connected safety technologies and help reduce road fatalities. - - • Toyota welcomes Qualcomm's efforts to foster broader industry collaboration toward a Zero-Accident society. - - - - Qualcomm T... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=363129 ———————————————————————————————————————————————————————————— Qualcomm Announces Quarterly Cash Dividend 2026-10-21 · Qualcomm · Finance, Semiconductors, Investing & markets https://www.prnewswire.com/news-releases/qualcomm-announces-quarterly-cash-dividend-302914728.html Qualcomm Incorporated (NASDAQ: QCOM) today announced a quarterly cash dividend of $0.92 per common share, payable on December 17, 2026, to... ———————————————————————————————————————————————————————————— MindWalk Screens 890,634 Antibody Sequences for Immune Risk in Under Five Hours 2026-10-21 · Business Wire · AI, Retail, Biotech & pharma, Semiconductors https://finance.yahoo.com/healthcare/articles/mindwalk-screens-890-634-antibody-120100487.html New white paper shows LensAI™ immunogenicity screening running at up to 43% lower cost per sequence on Amazon EC2 Hpc8a instances powered by AMD EPYC processors, making a critical drug-safety check practical at the scale AI-driven discovery now demands AUSTIN, Texas, October 21, 2026--MindWalk Holdings ———————————————————————————————————————————————————————————— PFN and Tenstorrent Selected for NEDO Project on "xPU Design and Development Incorporating Photonics Electronics Integration Technology" 2026-10-21 · ACN Newswire · AI, SaaS, Energy, Automotive, Education, Telecom, Industrial, Semiconductors https://www.acnnewswire.com/press-release/english/110959/ TOKYO, Oct 21, 2026 - Preferred Networks, Inc. (PFN) and Tenstorrent USA, Inc. (Tenstorrent) have announced today that their joint proposal has been selected by Japan's New Energy and Industrial Technology Development Organization (NEDO) for the theme "xPU Design and Development Incorporating Photonics-Electronics Integration Technology" (*1) under the NEDO-sponsored "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of manufacturing technologies for advanced semiconductors." AI models and workloads continue to increase in size and computational complexity, and are being adopted across a wide range of industries. This rapid growth has further increased the compute needed for model training and inference, driving demand for more scalable and efficient AI infrastructure. Through a joint research and development project, PFN and Tenstorrent aim to develop a system-level integration of AI processors that delivers high performance and high efficiency for both training and inference. The project targets the next wave of AI deployment across diverse industrial and academic fields, including agentic AI, physical AI, and scientific AI. As part of the project, PFN and Tenstorrent will conduct a research and development program for five years based on the division of responsibilities outlined below. The companies will subsequently work to commercialize the research outcomes for applications including AI agents. Development of system integration technologies for AI processors leveraging photonics-electronics integration and advanced packaging technologies (PFN and Tenstorrent) Development of AI chiplets with ultra-high memory bandwidth enabled by 3D memory stacking technologies based on leading-edge semiconductor process technologies (PFN) Development of CPU chiplets built on an open architecture, which support confidential computing (Tenstorrent) The following activities will be carried out in collaboration with subcontractors: Research and development of domain-specific applications toward the realization of scientific AI and physical AI (The University of Tokyo, Kobe University, Toyo University, Japan Agency for Marine-Earth Science and Technology, and Japan Atomic Energy Agency) Design of CPU chiplets and development of software which enable confidential computing (Tenstorrent Japan) (*1) Notification issued on Oct 21, 2026 on the selection for the "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of manufacturing technologies for advanced semiconductors": https://www.nedo.go.jp/koubo/IT3_100387.html About Preferred Networks Guided by its mission to "Make the real world computable and create the future together," Preferred Networks, Inc. (PFN) develops advanced software and hardware technologies through a vertically integrated approach spanning the entire AI value chain-from AI chips and computing infrastructure to generative AI foundation models and solutions across a wide range of industries. Founded in 2014 in Tokyo, PFN currently develops and delivers the MN-Core™ series of AI processors, the PFCP™ cloud platform for AI computing, and the Japan-developed generative AI foundation model PLaMo™. https://www.preferred.jp/en/ About Tenstorrent Tenstorrent is an AI compute company led by CEO Jim Keller - architect of Apple A4/A5, AMD Zen, and Tesla's Full Self-Driving chip. The company builds RISC-V-based AI processors and systems for developers, enterprises, and sovereign infrastructure worldwide. In addition to servers and workstations, Tenstorrent licenses its TT-Ascalon RISC-V CPU and Tensix AI cores to chip designers including Samsung and LG. Backed by Bezos Expeditions, Samsung, LG Electronics, Hyundai Motor Group, Fidelity, and others, Tenstorrent has raised over $1B+ and operates from Santa Clara, Austin, Toronto, Belgrade, Tokyo, and Bangalore. Preferred Networks: Tomoyuki Akiyama or Yumi Sakaguchi pfn-pr@preferred.jp Tenstorrent: Justin Mauldin Salient PR achievemore@salientpr.com 737.234.0936 SOURCE: Tenstorrent ———————————————————————————————————————————————————————————— Cassava Artificial Intelligence (AI) deploys NVIDIA Nemotron to accelerate agentic AI adoption across its markets 2026-10-21 · APO Group · Crypto, AI, Media, Industrial, Cybersecurity, Semiconductors https://www.africa-newsroom.com/press/cassava-artificial-intelligence-ai-deploys-nvidia-nemotron-to-accelerate-agentic-ai-adoption-across-its-markets?lang=en Cassava Technologies (www.CassavaTechnologies.com), a global technology leader, has announced the expansion of its AI Factory capabilities with NVIDIA Nemotron open models, helping enterprises and service providers to grow and innovate with AI more effectively and affordably. Cassava is deploying NVIDIA Nemotron (https://apo-opa.co/4dRrqnx) models as a locally hosted, managed inference service through the Cassava AI Multi-Model Exchange (CAIMEx) (https://apo-opa.co/4i0dw5a). By making open models available as APIs on Cassava’s AI Factory, CAIMEx gives enterprises greater flexibility to choose the right mix of models for their applications without having to build and operate their own model-serving infrastructure. “Expanding our AI Factory across our markets is about creating the capacity and economics needed for businesses to build and deploy AI solutions at scale. By bringing NVIDIA Nemotron into CAIMEx, improving the efficiency of every GPU cycle and introducing flexible token offerings, we are giving enterprises and service providers more choice in how they access and deliver these capabilities to their customers,” said Ahmed El Beheiry, Group Chief Technology & AI Officer, Cassava Technologies.     NVIDIA Nemotron brings efficient reasoning and tool-use capabilities to CAIMEx, helping customers build AI agents that can work through complex tasks and interact with business tools. Its open model weights, training data and recipes also give developers a customizable foundation that they can fine-tune to build specialised agents tailored to their applications. As businesses mature and the AI agents take on longer-running tasks and access business systems, security and guardrails become critical requirements. These need to be built into the infrastructure, and Cassava is using NVIDIA OpenShell to bring model compute, governed agent execution and independent security enforcement together for customers’ agentic workloads to its AI Factory. The CAIMEx Token Optimiser is designed to improve the economics of generative and agentic AI by identifying information that has already been processed and, where appropriate, reusing it rather than processing the same content again. This reduces computing requirements and helps customers use their AI tokens more efficiently. The approach applies to both Cassava-hosted and third-party AI models, helping enterprises reduce unnecessary processing as their AI usage scales. The expansion is the latest step in Cassava’s development of an integrated AI ecosystem, giving businesses access to locally hosted infrastructure, models, and services, fostering trust and confidence in data security and control while supporting their growth.  Distributed by APO Group on behalf of Cassava Technologies. NVIDIA Press Announcement: https://apo-opa.co/4zBBERe About Cassava Technologies: https://www.CassavaTechnologies.com ———————————————————————————————————————————————————————————— CHARBONE Strengthens Its Industrial Gas Offering With a Filling Unit in Sorel-Tracy 2026-10-21 · NewMediaWire · Finance, AI, SaaS, Energy, Industrial, Aerospace & defense, Biotech & pharma, Semiconductors https://www.newmediawire.com/news/charbone-strengthens-its-industrial-gas-offering-with-a-filling-unit-in-sorel-tracy-7090774 VARENNES, QUEBEC - October 21, 2026 - CHARBONE CORPORATION (TSXV: CH; OTCQB: CHHYF; FSE: K47) (“CHARBONE” or the “Company”), a vertically integrated industrial gases company focused on production, distribution and storage of clean ultra-high purity (“UHP”) hydrogen and other strategic industrial gases, announces the addition of an industrial gas cylinder filling unit at its Sorel-Tracy site. This new activity aims to support revenue growth, broaden the commercial offering and develop the Company's customer base in Quebec and other Canadian regions. Specifically, this unit will allow CHARBONE to fill hydrogen and helium cylinders directly from the onset at its Sorel-Tracy site, with the ability to expand to other industrial gases and specialized mixtures in the future. These cylinders, also known as gas cylinders, are used to store, transport, and supply the gases required for various customer applications. CHARBONE will thus directly manage this step in preparing the products for its customers. This new activity represents a further step in the development of CHARBONE's integrated platform. It aims to expand the markets accessible to the Company and generate new revenue opportunities through an offering tailored to the needs of industrial, commercial, and institutional clients. A new lever for business development The filling unit will primarily serve the Quebec market, while also supporting CHARBONE's business development elsewhere in Canada. Target customers include private companies and distribution partners, including independent distributors. The offering will also address supply needs related to certain government contracts and the defense sector. By adding cylinder filling to the activities of its Sorel-Tracy site, CHARBONE is internalizing a step previously sources externally, which is expected to support margin improvement and enhance control over product quality and delivery timelines. This enables the Company to expand the services offered to its customers, develop new business relationships and strengthen its position in industrial gases. Dave Gagnon, President and CEO of CHARBONE, declares: “Our goal is to make Sorel-Tracy a growth engine for CHARBONE. By handling the filling of helium cylinders ourselves, and later industrial gases and specialty mixtures, we are expanding our offering and opening up new opportunities to grow our revenue with a diverse clientele. We are building a Canadian industrial gas group with the ambition of becoming a leading supplier for companies seeking to source their gases from a Canadian partner, reliably. Our priority is to develop lasting relationships with our customers and translate this business expansion into long-term value creation for our shareholders.” Expanding Market Presence Across Quebec and CanadaThis initiative further develops CHARBONE beyond hydrogen production, expanding the activities and services offered within its industrial gas platform. Helium, in particular, represents a high-demand industrial gas with constrained supply, making direct cylinder filling a strategically important capability for CHARBONE’s customers across sectors like semiconductors, aerospace and defense, and advanced manufacturing. The Company intends to leverage this new unit to increase its presence in Quebec and develop business opportunities with Canadian buyers seeking a long-term supply partner. CHARBONE to Present at the Emerging Growth Conference The Company has been invited to present at the upcoming Emerging Growth Conference, a live, interactive online event giving individual and institutional investors, advisors, and analysts the opportunity to receive a brief recap of recent achievements and path forward from CHARBONE’s CFO and Corporate Secretary, Benoit Veilleux. Date: Thursday, October 29, 2026 Time: 3:10 PM ET Register: https://goto.webcasts.com/starthere.jsp?ei=1772210&tp_key=8ae90219a3&sti=ch About CHARBONE CORPORATION CHARBONE is a vertically integrated industrial gases company focused on developing and operating a network of supply hubs for the production, storage, and distribution of Ultra-High Purity (UHP) strategic industrial gases. The Company serves customers across sectors including semiconductors, artificial intelligence and data centers, advanced pharmaceuticals, and aerospace and defense technologies, where UHP gases are critical for high-precision manufacturing processes and operational performance. CHARBONE is advancing a network of clean UHP hydrogen production plants across North America and selected international markets. The Company’s modular, decentralized, and demand-driven approach, combined with its integrated storage and distribution platform for all UHP gases, supports scalable growth, enhances operational flexibility, and enables more stable and diversified revenue generation. This model allows CHARBONE to efficiently serve mid-tier industrial gas customers with a reliable supply of UHP gases, including hydrogen, helium, oxygen, and any other high-demand gases that are often difficult to source reliably at the regional level. The Company is committed to supporting the global transition to a lower-carbon economy by providing accessible, decentralized clean hydrogen and specialty gases, while addressing supply gaps for underserved industrial customers and accelerating the shift towards localized clean energy. CHARBONE is listed on the TSX Venture Exchange (TSXV: CH), the OTC Markets (OTCQB: CHHYF), and the Frankfurt Stock Exchange (FSE: K47). For more information, please visit: www.charbone.com. Forward-Looking Statements This news release contains statements that are “forward-looking information” as defined under Canadian securities laws (“forward-looking statements”). These forward-looking statements are often identified by words such as “intends”, “anticipates”, “expects”, “believes”, “plans”, “likely”, or similar words. The forward-looking statements reflect management's expectations, estimates, or projections concerning future results or events, based on the opinions, assumptions and estimates considered reasonable by management at the date the statements are made. Although Charbone believes that the expectations reflected in the forward-looking statements are reasonable, forward-looking statements involve risks and uncertainties, and undue reliance should not be placed on forward-looking statements, as unknown or unpredictable factors could cause actual results to be materially different from those reflected in the forward-looking statements. The forward-looking statements may be affected by risks and uncertainties in the business of Charbone. These risks, uncertainties and assumptions include, but are not limited to, those described under “Risk Factors” in the Corporation’s Filing Statement dated March 31, 2022, which is available on SEDAR+ at www.sedarplus.ca; they could cause actual events or results to differ materially from those projected in any forward-looking statements. Except as required under applicable securities legislation, Charbone undertakes no obligation to publicly update or revise forward-looking information. Neither TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release. Contact Charbone Corporation Telephone: +1 450 678 7171   Email: ir@charbone.com   Benoit Veilleux CFO and Corporate Secretary ———————————————————————————————————————————————————————————— Aeluma Announces Primit Parikh as Strategic Advisor 2026-10-21 · GlobeNewswire · Finance, AI, Automotive, Aerospace & defense, Semiconductors https://www.globenewswire.com/news-release/2026/10/21/3385370/0/en/aeluma-announces-primit-parikh-as-strategic-advisor.html GOLETA, Calif., Oct. 21, 2026 -- Aeluma, Inc. (NASDAQ: ALMU), a semiconductor company specializing in high-performance, scalable technologies for mobile, AI, defense and aerospace, robotics, automotive, AR/VR, and quantum, announced today it has appointed Primit Parikh, Ph.D. as a Strategic Advisor. Dr. Parikh will support Aeluma’s management team, bringing more than 25 years of leadership experience from several prominent semiconductor organizations. ———————————————————————————————————————————————————————————— NVIDIA cuDSS Now Generally Available to Accelerate Engineering and Scientific Simulations 2026-10-21 · NVIDIA · Industrial, Aerospace & defense, Semiconductors https://blogs.nvidia.com/blog/cudss-generally-available-engineering-scientific-simulation/ NVIDIA cuDSS, launched today in general availability, is an NVIDIA CUDA-X library that shifts a critical part of engineering and scientific simulations onto GPUs.  Complex engineering feats — from advanced chips to aircraft to industrial systems —– depend on simulation to predict how designs will perform before they’re built. As designs become more complex, simulations […] ———————————————————————————————————————————————————————————— NVIDIA Launches OpenShell Reference Architecture for Safe AI Agents 2026-10-21 · PressReach · AI, Semiconductors https://pressreach.com/nvidia-launches-openshell-reference-architecture-for-safe-ai-agents News Summary: The NVIDIA OpenShell Reference Architecture delivers enterprise governance, isolation and security for building, containing, observing and enforcing safe agents across enterprise infrastructure and edge systems. Built on the foundation of NVIDIA OpenShell secure runtime software, the architecture brings together NVIDIA Vera Rubin infrastructure for model inference, NVIDIA Vera CPUs for agent harnesses and … Continue reading "NVIDIA Launches OpenShell Reference Architecture for Safe AI Agents" ———————————————————————————————————————————————————————————— Lithia & Driveway (LAD) Reports Third Quarter Results, Achieves 54% Increase in Diluted Earnings Per Share, 9% Increase in Adjusted Diluted Earnings Per Share, and Raises Quarterly Dividend 7% 2026-10-21 · PressReach · Finance, Retail, Semiconductors https://pressreach.com/lithia-driveway-lad-reports-third-quarter-results-achieves-54-increase-in-diluted-earnings-per-share-9-increase-in-adjusted-diluted-earnings-per-share-and-raises-quarterly-dividend-7 Key Highlights Record third quarter revenues of $9.9 billion Used retail GPUs increased $197, or 11%, year over year Aftersales gross profit increased by 2.4% and gross margin was 59.5%, a 100-basis point increase, on a same-store basis Financing Operations income of $32.3 million, a 69% increase year over year, with record originations of $937 … Continue reading "Lithia & Driveway (LAD) Reports Third Quarter Results, Achieves 54% Increase in Diluted Earnings Per Share, 9% Increase in Adjusted Diluted Earnings Per Share, and Raises Quarterly Dividend 7%" ———————————————————————————————————————————————————————————— Hudbay and Mitsubishi Approve Copper World Project Construction; Advancing Next Major U.S. Copper Mine Towards First Production in 2029 2026-10-21 · PressReach · Finance, Semiconductors https://pressreach.com/hudbay-and-mitsubishi-approve-copper-world-project-construction-advancing-next-major-u-s-copper-mine-towards-first-production-in-2029 TORONTO, Oct. 21, 2026 — Hudbay Minerals Inc. (“Hudbay” or the “Company”) (TSX, NYSE: HBM) today announced the results of the definitive feasibility study and related pre-feasibility studies (collectively, the “DFS”) for its 70%-owned Copper World project in Arizona, located approximately 50 kilometres (31 miles) southeast of Tucson. Copper World is 30%-owned by … Continue reading "Hudbay and Mitsubishi Approve Copper World Project Construction; Advancing Next Major U.S. Copper Mine Towards First Production in 2029" ———————————————————————————————————————————————————————————— Vultr and AMD Expand Global Collaboration with New AI Infrastructure in India 2026-10-21 · Business Wire · AI, SaaS, Semiconductors https://finance.yahoo.com/technology/ai/articles/vultr-amd-expand-global-collaboration-053000713.html New Chennai deployment will create one of the world's largest AMD Instinct™ superclusters, expanding AI compute access in India CHENNAI, India, October 21, 2026--Vultr, the world's largest privately-held cloud infrastructure company, today announced a major expansion of its AMD powered infrastructure f ———————————————————————————————————————————————————————————— Red Hat OpenShift Virtualization achieves NVIDIA-Certified Hypervisor status 2026-10-21 · Red Hat · AI, SaaS, Semiconductors, Cloud & data centers https://www.redhat.com/en/blog/red-hat-openshift-virtualization-achieves-nvidia-certified-hypervisor-status Red Hat OpenShift Virtualization 4.22 has achieved NVIDIA-Certified Hypervisor status for NVIDIA HGX systems, validating near bare-metal GPU performance for representative AI and accelerated computing workloads.What this means for customersYou no longer have to choose between the flexibility of VMs and the scale of Kubernetes for your AI pipeline. GPU-accelerated virtual machines and containerized AI workloads can run on the same cluster, under the same API, managed by the same team.The NVIDIA-Certified Hypervisors program validates that virtualization platforms deliver near bare-metal perform ———————————————————————————————————————————————————————————— RHEL for NVIDIA delivers trusted foundation for next-gen AI workloads 2026-10-21 · Red Hat · AI, Automotive, Semiconductors, Software & IT https://www.redhat.com/en/blog/rhel-nvidia-delivers-trusted-foundation-next-gen-ai-workloads New NVIDIA GPUs typically arrive before a standard enterprise Linux release can carry every driver, kernel change, and virtualization patch those systems need. The usual result is a bad choice: wait, or stand the first cluster up on an operating system the team does not intend to keep.Red Hat Enterprise Linux for NVIDIA 26.03 is the other choice. It is a partner-optimized edition of Red Hat Enterprise Linux (RHEL) for the latest NVIDIA hardware, included with a RHEL for ARM 64 subscription. It is how you start on enterprise Linux now and it is the edition ready to support the NVIDIA Vera Rubin ———————————————————————————————————————————————————————————— Elmos Semiconductor SE Shows Innovative IC-solutions at Electronica 2026 in Munich 2026-10-20 · NewMediaWire · SaaS, Energy, Automotive, Industrial, Cybersecurity, Semiconductors, Sustainability https://www.newmediawire.com/news/elmos-semiconductor-se-shows-innovative-ic-solutions-at-electronica-2026-in-munich-7090765 We Enable What Matters – IC-innovations for Secure, Smart, and Connected Applications LEVERKUSEN, GERMANY - October 20, 2026 - Elmos Semiconductor SE (FSE: ELG) will be showcasing innovative IC solutions for automotive and industrial electronics at electronica in Munich (Hall C3, Booth 141) from November 10 to 13, 2026. Under the motto “We enable what matters,” the focus will be on applications that enhance safety, efficiency, and comfort – ranging from intelligent lighting and motor control to reliable environment detection and secure data communication. Elmos will also show for the first time how proven automotive technologies can unlock new possibilities in humanoid robotics. We measure what matters: Reliable environment detection for greater safety Ultrasonic distance measurement supports driver-assistance systems all around the vehicle – from parking to automated driving. Elmos solutions detect obstacles and measure distances with precision. It makes safe parking and maneuvering possible and enables reliable 360-degree environment detection for assisted or autonomous driving. We sense what matters: Precise sensing as the foundation of modern vehicle functions Elmos sensor ICs measure and process key parameters such as pressure, temperature, rain, and light. The integrated signal processing filters out interference and provides reliable data for vehicle control. As a result, these solutions support safety-critical applications, such as braking systems, as well as battery management, climate control, and environment detection. We illuminate what matters: Smart lighting for safety and design Elmos ICs dynamically control LEDs and enable lighting features that improve visibility on the road, facilitate communication with other drivers, and allow for customized lighting concepts both inside and outside the vehicle. High integration and flexible interfaces lay the foundation for compact and high-performance lighting systems. We control what matters: Comfort and efficiency through precise motion Many vehicle functions rely on small electrical motors that move fans, pumps, valves, or air flaps. Elmos motor control ICs control these actuators precisely, quietly, and efficiently - in both traditional 12-volt systems and modern 48-volt architectures. They regulate speed and power and also enable the exact positioning of moving components. This enhances comfort and energy efficiency while supporting thermal management. We protect what matters: Safety for power, data, and passengers The Elmos portfolio includes solutions for functional safety, secure communication, and hardware-based cybersecurity. To enable smart power distribution in vehicles, Elmos develops eFuse solutions that monitor and precisely control the power supply to individual consumers. Elmos airbag solutions also ensure reliable airbag deployment, thereby helping to protect passengers. In addition, the Quantum Random Number Generator (QRNG) - winner of the 2026 German Innovation Award - generates truly random numbers based on quantum mechanical effects, thereby providing a crucial foundation for secure cryptographic encryption in automotive, industrial, and IoT applications. Proven in automotive. Ready for robotics. Humanoid robotics opens up a new growth area for Elmos. Like vehicles, robots require precise motion control, reliable sensors, and secure power and data distribution. Across the robotics architecture, Elmos already identifies more than 120 potential IC applications in the areas of motion, sensing, power, and connectivity. Building on its decades of automotive experience and existing systems expertise, Elmos can transfer proven technologies to new robotic applications. Contact Elmos Semiconductor SE Ralf Hoppe, CIR (Corporate Investor Relations, Communications & ESG) Mobile: +49 151 5383 7905 Email: invest@elmos.com About Elmos Elmos has been developing intelligent microchip solutions for over 40 years, primarily for the automotive industry. As a fabless company and specialist for analog mixed-signal ICs, Elmos makes the mobility of the future safer, more comfortable and more efficient. The innovative products of Elmos enable reliable driver assistance systems, intelligent sensors, efficient motors and new LED lighting concepts in modern vehicles. As a market leader in cutting-edge applications, Elmos is powering global megatrends such as autonomous driving, electromobility and software-defined vehicles. Note This release contains forward-looking statements that are based on assumptions and estimates made by the Elmos management. Even though we assume the underlying expectations of the forward-looking statements to be realistic, we cannot guarantee the expectations will prove right. The assumptions may carry risks and uncertainties, and as a result actual events may differ materially from the forward-looking statements. Among the factors that could cause such differences are changes in general economic and business conditions, fluctuations of exchange rates and interest rates, the introduction of competing products, lack of acceptance of new products, and changes in business strategy. Elmos neither intends nor assumes any obligation to update its statements with respect to future events. ———————————————————————————————————————————————————————————— SpacemiT Launches 46-Core V100 RISC‑V Server CPU 2026-10-20 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/10/20/3384813/0/en/spacemit-launches-46-core-v100-risc-v-server-cpu.html SpacemiT Launches 46-Core V100 RISC‑V Server CPU ———————————————————————————————————————————————————————————— Taiwan Excellence to Showcase Next-Gen Automotive Technologies at Reuters Events: Automotive USA 2026 in Detroit 2026-10-20 · Business Wire · AI, Automotive, Semiconductors https://finance.yahoo.com/technology/articles/taiwan-excellence-showcase-next-gen-172200135.html 10 Taiwanese companies will highlight innovations in semiconductors, ADAS, edge AI, smart cockpits and EV power systems, underscoring Taiwan's role as a trusted partner to U.S. automakers DETROIT, October 20, 2026--Taiwan Excellence will showcase 19 advanced automotive technologies from 10 Taiwanese co ———————————————————————————————————————————————————————————— Synteq Launches Apps & Serverless Functions in Developer Platform Expansion 2026-10-20 · PR Newswire · SaaS, Semiconductors https://www.prnewswire.com/news-releases/synteq-launches-apps--serverless-functions-in-developer-platform-expansion-302911899.html Synteq brings managed application hosting and serverless compute to its own infrastructure and network, so developers can run their code alongside their VPS instances, GPUs, and storage. WILMINGTON, Del., Oct. 20, 2026 -- Synteq today announced the launch of Apps and... ———————————————————————————————————————————————————————————— Selected for NEDO's "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of Manufacturing Technologies for Advanced Semiconductors (Subsidy)" 2026-10-20 · WebWire · Energy, Telecom, Industrial, Semiconductors https://www.webwire.com/ViewPressRel.asp?aId=363088 Nikon Corporation is pleased to announce that it has been selected for the "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of Manufacturing Technologies for Advanced Semiconductors (Subsidy)" conducted by the New Energy and Industrial Technology Development Organization (NEDO) for its newly launched development of a digital lithography system capable of achieving 0.5 �m *1 (L/S)*2 resolution. - - This projec... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=363088 ———————————————————————————————————————————————————————————— Efinix Appoints Kate Schuelke to Board of Directors 2026-10-20 · Business Wire · AI, Cybersecurity, Semiconductors https://finance.yahoo.com/technology/articles/efinix-appoints-kate-schuelke-board-160000780.html Former Seagate Chief Legal Officer and Altera General Counsel brings deep semiconductor, governance, and cybersecurity expertise to the Efinix board CUPERTINO, Calif., October 20, 2026--Efinix®, Inc ., the FPGA pioneer accelerating edge AI innovation, today announced that Kate Schuelke has joined its ———————————————————————————————————————————————————————————— Edgewater Wireless Brings Growing Semiconductor Momentum and Dual-Use Innovation to Canada's Semiconductor Symposium 2026 2026-10-20 · NewMediaWire · AI, SaaS, Media, Telecom, Industrial, Semiconductors https://www.newmediawire.com/news/edgewater-wireless-brings-growing-semiconductor-momentum-and-dual-use-innovation-to-canada-s-semiconductor-symposium-2026-7090746 Silicon Valley Investment, Global Semiconductor Engagement and Expanding Customer-Driven Engagement Position Edgewater for Its Next Phase of Commercialization OTTAWA, ON - October 20, 2026 - Edgewater Wireless Systems Inc. (TSXV: YFI) (OTC: KPIFF) (“Edgewater” or the “Company”), the industry pioneer of AI-powered Wi-Fi Spectrum Slicing™ silicon solutions and IP, today announced its participation in Canada’s Semiconductor Symposium 2026, taking place on October 20-21 in Ottawa, Ontario, as the Company advances its next-generation wireless silicon toward customer demonstrations and commercial adoption. Edgewater enters the Symposium with growing momentum, supported by strategic investment, global industry engagement and customer-driven development across next-generation Wi-Fi and high-performance dual-use wireless applications. Recent milestones include a strategic investment from Silicon Catalyst Angels - its first investment in a publicly traded company - and an invitation to GlobalFoundries' GFx Technology Summit, where Edgewater engaged with senior semiconductor executives, strategic investors and industry partners. The Company also participated in the RDK Global Summit, connecting with leading global broadband operators, OEMs and technology partners. Together, these developments are strengthening Edgewater's industry visibility and access to the expertise, relationships and resources needed to accelerate commercialization. “Industry and financial validation are providing the resources and access to advance our silicon toward customer demonstrations and commercial adoption,” said Andrew Skafel, President and CEO of Edgewater Wireless. “The Silicon Catalyst Angels investment, our growing engagement with global semiconductor leaders and increasing customer interest are coming together at an important point in our development. We're moving beyond proving the technology toward demonstrating what it can deliver for customers - and building the foundation for scalable commercial opportunities.” Advancing Toward Customer Demonstrations and Design-Ins Edgewater continues to advance PrismIQ™, its Wi-Fi 8-ready family of Spectrum Slicing™ semiconductor solutions, with development priorities increasingly shaped by prospective customer requirements and high-performance applications. The Company's patented multi-channel architecture is designed to deliver greater throughput, reduced latency and more predictable wireless performance - capabilities increasingly important for next-generation broadband, enterprise connectivity and mission-critical wireless communications. Beyond traditional Wi-Fi markets, Edgewater sees growing opportunities in dual-use applications, including autonomous systems, resilient wireless video links and low-latency command-and-control communications, where reliability and interference resilience are critical. Customer-driven engineering activities are helping shape upcoming prototype capabilities and demonstration priorities, with the Company focused on progressing qualified opportunities toward potential design-ins and commercial adoption. “What's particularly exciting is how our technology is opening doors beyond conventional Wi-Fi,” added Skafel. “We're seeing opportunities where reliable, high-performance wireless connectivity is a critical requirement, not simply a convenience. Our focus now is on converting these opportunities into tangible technical and commercial milestones, particularly in the emerging dual-use market.” Global Industry Support Strengthens Execution Edgewater's development program benefits from its relationships with Arm, Synopsys and Silicon Catalyst, alongside engagement with GlobalFoundries and Canada's semiconductor innovation ecosystem. Through CMC Microsystems and the FABrIC initiative, Edgewater has secured approximately $921,000 in non-dilutive project support toward its next-generation wireless baseband development and commercialization program, helping extend development resources while limiting reliance on shareholder capital. Hosted by CMC Microsystems under the theme “Where Sovereignty Meets Prosperity,” Canada's Semiconductor Symposium brings together technology leaders, policymakers, investors and innovators focused on strengthening Canada's semiconductor industry and global competitiveness. Edgewater will use the event to advance industry relationships, engage prospective strategic partners and highlight its progress toward bringing Canadian-developed wireless semiconductor technology to global markets. Attending Canada's Semiconductor Symposium? Connect with Edgewater at marketing@edgewaterwireless.com to arrange a meeting. About Edgewater Wireless We make Wi-Fi. Better. Edgewater’s patented, AI-powered Spectrum Slicing™ platform - delivered through the PrismIQ™ product family - breaks the limits of legacy Wi-Fi by enabling multiple concurrent channels in a single band. Wi-Fi Spectrum Slicing™ delivers a 10x improvement in performance and up with 50% lower latency, even for legacy devices. With 26 patents granted and 3 AI-related patents pending, Edgewater is transforming the economics of Wi-Fi for service providers, OEMs, and enterprises - powering scalable, standards-leading connectivity across residential, enterprise, and Industrial IoT markets. A Silicon Catalyst Portfolio Company with strategic investment from Silicon Catalyst Angels, Edgewater is an industry pioneer in its understanding of the future of Wi-Fi and is building the foundation for the next era of global connectivity which the company defines as intelligent wireless. Visit https://edgewaterwireless.com Edgewater Wireless Contacts: Andrew Skafel, President and CEO E: andrews@edgewaterwireless.com Bill Mitoulas, Investor Relations E: ir@edgewaterwireless.com T: +1.613.317.4448 Forward-Looking Statements This news release contains forward-looking statements and forward-looking information within the meaning of applicable securities laws. The use of any of the words "expect", "anticipate", "continue", "estimate", "objective", "ongoing", "may", "will", "project", "should", "believe", "plans", "intends" and similar expressions are intended to identify forward-looking information or statements. Specific statements respecting moving toward prototype validation and demonstrations, clearing a path toward the next generation of Spectrum Slicing products and moving from validation toward execution and commercialization comprise forward-looking statements and represent milestones which may or may not be achieved. Although Edgewater Wireless believes that the expectations and assumptions on which such forward-looking statements and information are based are reasonable, undue reliance should not be placed on the forward-looking statements and information because Edgewater Wireless can give no assurance that they will prove to be correct. By its nature, such forward-looking information is subject to various risks and uncertainties, which could cause Edgewater Wireless’ actual results and experience to differ materially from the anticipated results or expectations expressed. These risks and uncertainties, include, but are not limited to access to capital markets, market forces, competition from new and existing companies and regulatory conditions. Readers are cautioned not to place undue reliance on this forward-looking information, which is given as of the date it is expressed in this news release or otherwise, and to not use future-oriented information or financial outlooks for anything other than their intended purpose. Edgewater Wireless undertakes no obligation to update publicly or revise any forward-looking information, whether as a result of new information, future events or otherwise, except as required by law. NEITHER THE TSX VENTURE EXCHANGE NOR ITS REGULATION SERVICES PROVIDER (AS THAT TERM IS DEFINED IN THE POLICIES OF THE TSX VENTURE EXCHANGE) ACCEPTS RESPONSIBILITY FOR THE ADEQUACY OR ACCURACY OF THIS RELEASE. ———————————————————————————————————————————————————————————— Sequans Announces Conference Call to Review Third Quarter 2026 Results 2026-10-20 · Newsfile · Finance, Telecom, Semiconductors https://www.newsfilecorp.com/release/319947/Sequans-Announces-Conference-Call-to-Review-Third-Quarter-2026-Results Paris, France--(October 20, 2026) - Sequans Communications S.A. (NYSE: SQNS), a leading provider of 5G/4G cellular IoT and software-defined radio (SDR) semiconductor solutions, will release its financial results for the third quarter of 2026 on Tuesday, November 3, 2026, during pre-market hours. Following the announcement, Sequans' management will host a conference call at 8:00 a.m. ET.Conference Call DetailsDate: Tuesday, November 3, 2026Time: ... ———————————————————————————————————————————————————————————— LASE Strengthens Financial Management and Corporate Governance Appoints Tim Peterman Chief Financial Officer 2026-10-20 · Newswire.com · Finance, SaaS, Energy, Industrial, Biotech & pharma, Semiconductors https://www.newswire.com/news/lase-strengthens-financial-management-and-corporate-governance-appoints-tim Laser Photonics Corporation (NASDAQ:LASE), an emerging directed energy and laser technology platform developing applications for defense, semiconductor, pharmaceutical and industrial markets (the "Company"), today announced the appointment of Tim Peterman as Chief Financial Officer. Mr. Peterman's appointment, together with the Company's recent engagements of Sheppard, Mullin, Richter & Hampton LLP ("Sheppard") as ou ———————————————————————————————————————————————————————————— European Leaders Turn to NVIDIA Vera CPUs to Build Local Infrastructure 2026-10-20 · NVIDIA · Semiconductors https://blogs.nvidia.com/blog/european-leaders-vera-cpu-infrastructure/ Nebius and Nscale are among global technology partners looking to NVIDIA Vera CPUs to build the next wave of infrastructure. Their momentum reflects rapid advancements in agentic computing.  Agents do more than generate answers: they retrieve information, run software tools, execute code and evaluate results. Each step depends on fast CPU processing.  Vera accelerates that […] ———————————————————————————————————————————————————————————— Atturra Selects Activeport Software to Scale its Cloud and Compute Offering 2026-10-20 · MarketersMEDIA · AI, SaaS, Semiconductors, Software & IT https://news.marketersmedia.com/atturra-selects-activeport-software-to-scale-its-cloud-and-compute-offering/89206716 -- Atturra has signed a three-year deal with Activeport to deliver a new orchestration platform for Atturra’s network, cloud, compute and GPU services, including its Inference-as-a-Service offering. The platform is designed to help Atturra bring new AI and compute capacity to market faster through a branded, self-service digital experience. Atturra’s clients will be able to purchase, provision and manage network, clo ———————————————————————————————————————————————————————————— Mirantis Partners with VAST Data to Unify GPU Compute and Storage for Multi-Tenant AI Clouds 2026-10-20 · Business Wire · AI, SaaS, Real estate, Semiconductors https://finance.yahoo.com/technology/ai/articles/mirantis-partners-vast-data-unify-075000735.html Mirantis k0rdent AI integrates with the VAST AI Operating System to streamline secure AI cloud deployments by unifying infrastructure orchestration and data services CAMPBELL, Calif., October 20, 2026--Mirantis , delivering Kubernetes-native infrastructure for AI, today announced a joint integration w ———————————————————————————————————————————————————————————— Broadcom to Advance NTT DOCOMO’s Private Cloud with VMware Cloud Foundation 2026-10-20 · PressReach · Finance, SaaS, Semiconductors https://pressreach.com/broadcom-to-advance-ntt-docomos-private-cloud-with-vmware-cloud-foundation TOKYO, Oct. 19, 2026 — Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced that it has signed a 10-year agreement with NTT DOCOMO, INC. (DOCOMO) to continuously advance the private cloud that will underpin the company’s digital services over the next … Continue reading "Broadcom to Advance NTT DOCOMO’s Private Cloud with VMware Cloud Foundation" ———————————————————————————————————————————————————————————— MIPI Alliance Announces Board Leadership Appointments 2026-10-20 · Business Wire · AI, Automotive, Semiconductors https://finance.yahoo.com/technology/articles/mipi-alliance-announces-board-leadership-020700536.html Gaurav Arora of Google and Aruni Nelson of Intel Corporation appointed board co-chairs to help advance the interface technologies enabling mobile, automotive, physical AI, IoT and other connected systems BRIDGEWATER, N.J., October 20, 2026--The MIPI Alliance , an international organization that develop ———————————————————————————————————————————————————————————— Crossing the threshold to dependable open source AI serving 2026-10-20 · Red Hat · AI, Energy, Semiconductors, Software & IT https://www.redhat.com/en/blog/crossing-threshold-dependable-open-source-ai-serving When large open weight models first captured attention, the industry was faced with a challenge. Powerful open models were becoming available, but technologists lacked an open inference serving system that could run them efficiently. Having spent years building inference engines for CPUs, my team and I redirected all of our energy toward the vLLM project. Together with the community, vLLM capabilities expanded to become the de facto inference server. Today the vLLM project, now part of the PyTorch foundation, has a vibrant community of companies and developers actively adding support for new m ———————————————————————————————————————————————————————————— Shared GPUs without shared latency: Priority-aware serving in Red Hat AI 2026-10-20 · Red Hat · Crypto, AI, SaaS, Semiconductors https://www.redhat.com/en/blog/shared-gpus-without-shared-latency-priority-aware-serving-in-red-hat-ai Chat, batch, and agentic traffic can run on the same graphics processing unit (GPU) without the chatbot waiting for the batch job to complete. Built on llm-d flow control and generally available in Red Hat AI 3.5, priority-aware serving decides which request goes first when the pool is full, and applications change nothing. On a NVIDIA H100, 95% of premium requests got their first token in under half a second, and batch rejections fell from 48,224 to 0.Every separate pool pays for its own peakSooner or later, every shared inference platform gets the same question from 2 teams at once: Whose re ———————————————————————————————————————————————————————————— AMD and Intel Collaborate to Simplify AI Development on x86 CPUs with PyTorch 2026-10-20 · AMD · AI, Semiconductors, Software & IT https://newsroom.amd.com/news/amd-intel-collaborate-simplify-ai-development-on-x86-cpus-pytorch/ The companies plan to combine their x86 CPU optimization work for PyTorch in oneDNN to give developers a common software path across AMD and Intel CPUs. ———————————————————————————————————————————————————————————— AMD FSR Upscaling 4.1 Boosts Frames and Image Quality on More Devices 2026-10-20 · AMD · AI, Gaming, Semiconductors https://newsroom.amd.com/news/amd-fsr-upscaling-4-1-boosts-frames-image-quality/ The cutting-edge ML-based upscaling technology expands to AMD Radeon RX 6000 Series graphics, Ryzen AI 9 processors, Ryzen AI Max processors, select Ryzen Z2 processors and XBOX consoles. ———————————————————————————————————————————————————————————— Future Electronics Showcases Nordic Semiconductor nRF54L15 Tag Prototyping Platform for Bluetooth Tracking and Edge AI Development 2026-10-19 · Express Press Release · AI, SaaS, Semiconductors https://express-press-release.net/news/2026/10/19/1775878 Montreal, Canada, 2026-10-19 — Future Electronics, a global leading distributor of electronic components, is highlighting the Nordic Semiconductor nRF54L15 Tag, a compact [read full press release...] ———————————————————————————————————————————————————————————— Money, Rates, and Megawatts. The Three Questions Deciding the AI Buildout. 2026-10-19 · PressReach · Finance, AI, Semiconductors https://pressreach.com/featured-news/money-rates-and-megawatts-the-three-questions-deciding-the-ai-buildout Harmol Samra, Chief Executive Officer, Host Digital (NYSE American: HOST) letter to shareholders: NEW YORK, NY, Oct. 19, 2026 — Host Digital Inc. (NYSE American: HOST). It’s been a rough few weeks for anybody who owns a basket of AI stocks, whether that’s infrastructure developers, hyperscalers, neoclouds, or chipmakers, and Host Digital ($HOST) has taken … Continue reading "Money, Rates, and Megawatts. The Three Questions Deciding the AI Buildout." ———————————————————————————————————————————————————————————— Electronic System Design Industry Posts $5.7 Billion in Revenue in Q2 2026, ESD Alliance Reports 2026-10-19 · PR Newswire · Finance, Semiconductors https://www.prnewswire.com/news-releases/electronic-system-design-industry-posts-5-7-billion-in-revenue-in-q2-2026--esd-alliance-reports-302912151.html IC Physical Design & Verification, Semiconductor IP, and Services Reported Double-Digit Year-over-Year Revenue Increase MILPITAS, Calif., Oct. 19, 2026 -- Electronic System Design (ESD) industry revenue increased 12.2% to $5,710.8 million in the second quarter of 2026 from... ———————————————————————————————————————————————————————————— 1Gbits Expands Bare-Metal Footprint to 50+ Global Hubs to Support Surge in AI, Virtualization, and Gaming Demand 2026-10-19 · PRWeb · AI, Gaming, Semiconductors https://www.prweb.com/releases/1gbits-expands-bare-metal-footprint-to-50-global-hubs-to-support-surge-in-ai-virtualization-and-gaming-demand-302912302.html Global infrastructure provider 1Gbits has expanded its high-performance bare-metal network from 37 to 50+ international locations, deploying next-generation AMD EPYC, Ryzen 9 9950X, Threadripper PRO, and GPU-accelerated server nodes across premier facility operators including Equinix,... ———————————————————————————————————————————————————————————— Amazon opens its AWS Trainium AI chips to every PyTorch developer, no rewrite needed 2026-10-19 · Amazon · AI, Retail, Semiconductors https://www.aboutamazon.com/news/innovation-at-amazon/torchneuron-pytorch-aws-trainium-chips-ai?utm_source=rss TorchNeuron lets developers run their existing AI code on AWS Trainium chips with virtually no changes, reducing the friction to adopting new hardware. ———————————————————————————————————————————————————————————— indie's Combined SoC and Perception Software for Advanced DMS/OMS Awarded In-Cabin Solution of the Year 2026-10-19 · Business Wire · Finance, Automotive, Semiconductors https://finance.yahoo.com/technology/articles/indies-combined-soc-perception-software-130000119.html Annual Awards Program Recognizes Breakthrough Innovation in Automotive & Transportation Technologies Around the Globe ALISO VIEJO, Calif., October 19, 2026--indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, today announced it has been awarded "In-Cabin Solution of the Year" by Auto ———————————————————————————————————————————————————————————— Data I/O Signs Definitive Agreement to Acquire V-TEK and A&J Programming 2026-10-19 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/10/19/3383407/0/en/data-i-o-signs-definitive-agreement-to-acquire-v-tek-and-a-j-programming.html REDMOND, Wash., Oct. 19, 2026 -- Data I/O Corporation (NASDAQ: DAIO) (the “Company”), the leading global provider of data programming and security provisioning solutions for microcontrollers, security ICs and memory devices, today announced it has signed a definitive agreement to acquire V-TEK, Inc. (“V-TEK”), a leading manufacturer of semiconductor handling and packaging solutions based in Mankato, MN, and A&J Programming, Inc (“A&J Programming”), a device programming service provider in San Jose, CA. ———————————————————————————————————————————————————————————— Tenstorrent Announces a $1.5B Series E at a $6.2B Valuation 2026-10-19 · ACN Newswire · Finance, AI, Automotive, Media, Aerospace & defense, Semiconductors https://www.acnnewswire.com/press-release/english/110878/ SANTA CLARA, CA, Oct 19, 2026 - Tenstorrent, the AI computing company, has closed $1.5B in Series E funding at a $6.2B post-money valuation. The round was led by Trace Capital and Innovation X, with participation from new and existing investors including Agostinelli Group, ARK Invest, Brett Barna, Cadence Ventures, Eclipse, Fidelity Management & Research Company, Maverick Silicon, Morgan Stanley, Protagonist, Sandisk, T. Rowe Price*, Tether Investments, Troluce Capital, Virtu Financial, and XTX Markets. Tenstorrent will use the capital to deploy Galaxy servers at scale, continuing to serve open-weight models across LLMs and video generation, and advance the AI and CPU IP it licenses to customers designing their own silicon. Tenstorrent sells AI compute at every level of the stack - from a single card or workstation to racks, superclusters, and custom IP. With an open-source software stack, developers can run frontier models locally and enterprises can deploy models on-prem at industry-leading latency and throughput. "We built one architecture and sell it at every size," said Jim Keller, CEO of Tenstorrent. "The future of compute is open, scalable, and owned by the people building on it. Our investors believe in that model too, and we appreciate their support." "Jim and his team bring decades of hands-on silicon, software, and IP experience, and we're excited to partner with Tenstorrent as Galaxy continues to scale," said Ben Mahdavi, Founder at Trace Capital. "Few companies design the chip and the software that runs on it. Tenstorrent does both, and its video generation results beat industry benchmarks ahead of our expectations," said George Bousis, Co-Founder and Managing Partner at Protagonist. "We are excited to double down in the Series E to back Jim and the team through this next phase of growth." *Accounts advised by T. Rowe Price Associates, Inc. About Tenstorrent Tenstorrent is an AI compute company led by CEO Jim Keller - architect of Apple A4/A5, AMD Zen, and Tesla's Full Self-Driving chip. The company builds RISC-V-based AI processors and systems for developers, enterprises, and sovereign infrastructure worldwide. In addition to servers and workstations, Tenstorrent licenses its TT-Ascalon RISC-V CPU and Tensix AI cores to chip designers including Samsung and LG. Backed by Bezos Expeditions, Samsung, LG Electronics, Hyundai Motor Group, Fidelity Management and Research Company, and others, Tenstorrent operates from Santa Clara, Austin, Toronto, Belgrade, Tokyo, and Bangalore. tenstorrent.com About Trace Capital Trace Capital is an investment firm that invests in, acquires, and builds exceptional businesses across stages and industries. The firm takes a long-term, concentrated approach to businesses at the forefront of technological change and the industries being transformed by it. Trace Capital was founded in 2026 by Ben Mahdavi, who previously co-founded Quiet Capital and led its Access strategy. During his time at Quiet, the firm invested in many of the leading technology businesses of the past decade. www.tracecap.com About Innovation X Founded in 2016 by Roger Monteforte, Innovation X is a late-stage venture capital firm that invests in privately held companies with innovative or disruptive technologies across defense technology, fintech, artificial intelligence, infrastructure, and the space economy. Innovation X Advisors has over $4.5B under management across multiple funds (as reported on Form ADV as of 12/31/2025). Tenstorrent Media Contact: Justin Mauldin Salient PR achievemore@salientpr.com 737.234.0936 SOURCE: Tenstorrent ———————————————————————————————————————————————————————————— EyePoint Announces Topline Results from LUCIA, the Second Pivotal Phase 3 Clinical Trial of DURAVYU™ in Wet AMD 2026-10-19 · GlobeNewswire · Healthcare, Biotech & pharma, Semiconductors https://www.globenewswire.com/news-release/2026/10/19/3383257/0/en/eyepoint-announces-topline-results-from-lucia-the-second-pivotal-phase-3-clinical-trial-of-duravyu-in-wet-amd.html EyePoint Announces Topline Results from LUCIA, the Second Pivotal Phase 3 Clinical Trial of DURAVYUTM in Wet AMD ———————————————————————————————————————————————————————————— AAEON Breaks Down Thermal Barriers with the New UP Xtreme PTL Edge Air 2026-10-19 · Express Press Release · Semiconductors https://express-press-release.net/news/2026/10/19/1774552 With AirJet® solid-state active cooling technology, the UP Xtreme PTL Edge Air is 35% thinner and 43% lighter while delivering Intel® Core™ Ultra Series 3 [read full press release...] ———————————————————————————————————————————————————————————— Saxony and Arizona Expand Collaboration in the Semiconductor Industry 2026-10-19 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/saxony-and-arizona-expand-collaboration-in-the-semiconductor-industry-302912483.html DRESDEN, Germany, Oct. 19, 2026 -- Saxony and the U.S. state of Arizona intend to further expand their ties in the semiconductor industry. Saxony Trade & Invest Corp. (WFS) and the Arizona Commerce Authority (ACA) used SEMICON West, the leading US trade fair for the... ———————————————————————————————————————————————————————————— Great Sky’s High-Speed AI Chips Analyze Fusion Plasmas 2026-10-19 · Business Wire · AI, Semiconductors https://finance.yahoo.com/technology/ai/articles/great-sky-high-speed-ai-090000196.html BOULDER, Colo., October 19, 2026--Great Sky, Brookhaven National Lab, Princeton Plasma Physics Laboratory, and the DIII-D National Fusion Facility partnered to develop a new kind of AI chip with the speed necessary to sense and respond to searing plasmas present in fusion reactors. The chips differ fro ———————————————————————————————————————————————————————————— Power Transistors - Global Strategic Business Report: Capitalize on the US$21.4B Market by 2032 as Infineon, Fuji Electric, ON Semiconductor, Mitsubishi Electric and Toshiba Disrupt Power Systems 2026-10-19 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/10/19/3383029/28124/en/power-transistors-global-strategic-business-report-capitalize-on-the-us-21-4b-market-by-2032-as-infineon-fuji-electric-on-semiconductor-mitsubishi-electric-and-toshiba-disrupt-powe.html Target SiC and GaN innovation, EVs, renewables, IoT and smart grids to capture demand for efficient, reliable power management. Target SiC and GaN innovation, EVs, renewables, IoT and smart grids to capture demand for efficient, reliable power management. ———————————————————————————————————————————————————————————— Lithography Equipment Market Size to Reach US$ 70.46 Billion by 2033 2026-10-19 · PR News Releaser · AI, Semiconductors https://www.prnewsreleaser.com/news/473987 The Lithography Equipment Market size was valued at US$ 31.25 billion in 2025 and is projected to reach US$ 70.46 billion by 2033, growing at a CAGR of 10.7% during 2026–2033. Growing demand for artificial intelligence (AI) processors, advanced semiconductor ... Read more ———————————————————————————————————————————————————————————— GMIF2026: AI Inference Powers the "Token Factory" and Drives System-Level Rethinking of Memory & Storage 2026-10-19 · PR Newswire · Crypto, AI, Education, Travel, Industrial, Semiconductors https://www.prnewswire.com/news-releases/gmif2026-ai-inference-powers-the-token-factory-and-drives-system-level-rethinking-of-memory--storage-302912123.html SHENZHEN, China, Oct. 18, 2026 -- The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026, GMIF2026) recently concluded at the Renaissance Shenzhen Bay Hotel. Co-hosted by the Shenzhen Memory Industry Association (SMIA) and the School of Integrated Circuits at... ———————————————————————————————————————————————————————————— Hong Kong Autumn Electronics Fair and electronicAsia Attract Over 61,000 Buyers for Sourcing, Business Opportunities 2026-10-16 · NewMediaWire · AI, SaaS, Real estate, Energy, Automotive, Media, Education, Travel, Sports, Industrial, Logistics, Semiconductors https://www.newmediawire.com/news/hong-kong-autumn-electronics-fair-and-electronicasia-attract-over-61-000-buyers-for-sourcing-business-opportunities-7090713 - Strong demand for AI and robotics technologies as Hong Kong platform helps companies build global connections HONG KONG - October 16, 2026 - The 46th Hong Kong Electronics Fair (Autumn Edition), organised by the Hong Kong Trade Development Council (HKTDC), and the 29th electronicAsia, jointly organised by the HKTDC and MMI Asia concluded successfully today. Over the four-day exhibition period, the two fairs attracted over 61,000 buyers from 141 countries and regions. Buyers from outside Hong Kong came mainly from the Chinese Mainland, India, Japan and the United States, among others, while buyer attendance from Kazakhstan, Brazil and other areas recorded encouraging growth, further reinforcing Hong Kong's role as an international trading hub and an important platform connecting global innovation and technology industries with international markets. This year's Electronics Fair focused on three highlighted themes: AI & Robotics, Smart Wellness and NEXTEntertainment, with related products showcased across various thematic zones. electronicAsia also featured dedicated zones presenting electronic components, display technologies, printed circuit boards, electronic manufacturing services, and testing and measuring equipment, creating a comprehensive one-stop sourcing marketplace for the electronics industry. Silas Chu, HKTDC Associate Executive Director, said: "This year's Electronics Fair (Autumn Edition) and electronicAsia achieved a fruitful outcome, bringing together exhibitors, buyers, investors and industry players from around the world. The fairs generated strong sourcing momentum and facilitated numerous business deals and partnerships. As the industry continues to transform and upgrade, the role of trade fairs is also evolving, extending beyond traditional product showcases and sourcing activities to become important platforms for fostering innovation, industry exchange and cross-sector collaboration, while reinforcing Hong Kong's strengths as an international trade centre. The newly introduced Future Industries Zone attracted strong interest from technology companies, investors and buyers, while the GoGlobal Connect Zone and its related activities were also well received, reflecting strong demand from Chinese Mainland enterprises seeking to expand overseas and leverage Hong Kong's professional services. This highlights our city's unique role as a bridge connecting industries with global markets." Mr Chu added: "As Hong Kong's October exhibition season continues, the HKTDC will organise a series of major exhibitions and conferences, including the Hong Kong International Lighting Fair (Autumn Edition), Hong Kong International Outdoor and Tech Light Expo, and Eco Expo Asia later this month. These events will create more cross-industry collaboration opportunities while leveraging Hong Kong's unique advantage in connecting the Chinese Mainland with international markets. They also align with the Hong Kong SAR Government's latest Policy Address and first Five-Year Plan which emphasise accelerating innovation and technology development, promoting AI adoption and strengthening Hong Kong's position as an international trade centre." Survey: over 80% of respondents optimistic about ASEAN and Middle East markets; AI emerges as a key growth driver An independent research agency commissioned by the organisers interviewed over 1,150 buyers and exhibitors during the fairs. The survey found that 96% of respondents expected overall sales to increase or remain stable over the next 12 to 24 months, reflecting cautious optimism about the industry's medium-term market outlook. Respondents were particularly positive about future sales prospects in several areas, with the most promising growth opportunities identified in ASEAN (83%), the Middle East (83%) and Chinese Mainland  (81%). The findings suggest that companies are actively diversifying their business footprint and exploring new growth markets. The adoption of artificial intelligence (AI) continues to accelerate in the electronics industry, with 74% of surveyed companies already applying or planning to apply generative AI technologies. The main areas of application include product design and development, data analysis and reporting, sales and customer engagement, as well as marketing and content creation. Meanwhile, nearly 60% of respondents identified AI as the technology expected to have the greatest impact on the industry over the next two years. The two fairs featured more than 3,200 exhibitors from 15 countries and regions. The HKTDC organised 130 buying missions involving buyers from 65 countries and regions, including companies such as Samsung Electronics and SSG.com from Korea, Karimex, Stetsom and Mondial from Brazil; Mercado Libre from Argentina; Garni Technology, Varitec Corp and Pan Pacific International from Czechia; Reichelt Elektronik from Germany; Taç Elektronik from Turkey; and Pixel Electric Ltd from Kenya, further reinforcing Hong Kong's role as a platform connecting international markets with innovative supply chains. RoboPark and Future Industries Zone take centre stage RoboPark and the Future Industries Zone were among the major highlights of this year's fairs, showcasing the latest advancements in AI, robotics, and other frontier technologies. This year's fairs featured more than 120 robots, primarily showcased at RoboPark at the Electronics Fair, demonstrating practical applications across four key areas: commercial and service industries, industrial and logistics operations, entertainment and social interaction, and healthcare and rehabilitation. Leading robotics companies from the Chinese Mainland took part, including UBTECH, AgiBot and DEEP Robotics, showcasing the latest achievements in bringing robotics technologies from R&D to commercial deployment and real-world applications. Among the highlights was Booster Robotics, winner of the 2026 RoboCup World Championship, which showcased its championship-winning humanoid robot at the fairs. Yang Liuyang, APAC Sales Director of Booster Robotics, said: "We receive around 100 buyer visits every day from around the world, including Europe, Australia, and South American markets such as Brazil, Chile and Peru. This demonstrates the strong growth potential and commercial demand for humanoid robots in overseas markets. We are actively leveraging Hong Kong as a platform to expand our international business. We expect to appoint one to two distributors in Hong Kong this quarter, accelerating the commercialisation of our technologies and further expanding their applications in overseas markets." The newly launched Future Industries Zone spotlighted five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics, and Future Wellness. The zone brought together over 100 companies to showcase cutting-edge technologies and solutions. Among them was Hong Kong company Xeroptix Technology Limited, which presented core technologies serving as the "AI brain" for robots, offering integrated solutions spanning algorithms, software, hardware and chip design. Dr Steve Kong, Chief Technology Officer of Xeroptix Technology Limited, said the Future Industries Zone enabled innovation and technology companies to connect more effectively with industry partners while reaching investors, corporate users and international markets. During the exhibition, the company engaged with more than 50 potential clients from markets including Australia, the Middle East, Africa and Europe, many of whom expressed strong interest in its embodied AI technologies for robotics. “The exhibition has delivered encouraging results and is expected to generate potential orders worth over US$1 million,” Dr Kong said. Overseas exhibitors also leveraged the Autumn Electronics Fair to explore global business opportunities. First-time exhibitor Clevetura from Cyprus showcased its innovative input device that combines keyboard and touchpad functionalities, aiming to identify distribution partners and expand its international network. Co-founder Mike Krupenkov said: “Hong Kong serves as an important gateway to international markets. Through the fairs, we connected with a number of promising buyers from around the world, and the results have been highly encouraging.” The fairs brought together more than 120 young companies and start-ups, primarily located in the Startup Zone. Among them were numerous Hong Kong start-ups presenting their home-grown innovations to global markets. Hong Kong-based AI-powered news verification app developer Fliq achieved encouraging results in its debut participation. Its CEO and Co-founder Victor Nesteruk said: "Through the fairs, we connected with around 30 potential investors and business partners from markets including the Chinese Mainland, Brazil and Cyprus. We also arranged around 20 business meetings and secured two strategic cooperation opportunities. The fairs provide start-ups with an efficient platform to connect with international markets, and we will definitely participate again." In addition to business matching, the exhibition also helped start-ups explore business and fundraising opportunities through its Investment Matchmaking programme. Korea's Posco Investment attended the fair to explore strategic investment opportunities. The company's typical investment size for each project is around US$750,000. Olivia Park, Venture Capital Manager of Posco Investment, said: "We met with three to five high-potential technology companies and are currently conducting further due diligence and follow-up discussions with one start-up developing smart audio glasses for runners." The fairs featured numerous product debuts, with many companies choosing the platform to unveil their latest technologies and solutions to international buyers. Shenzhen-based VIGX Technology Co., Ltd. showcased the world's first pocket-sized AI-powered exoskeleton robot, overcoming the traditional limitations of bulky and cumbersome industrial exoskeletons. The product attracted strong interest from buyers, with nearly 1,000 visitors recorded during the first two days of the fair alone, including quality buyers from Europe, North America, and South American markets such as Argentina, Brazil and Chile. Wang Han, Overseas Sales Manager of VIGX, said: "The fair provides an ideal platform for us to showcase our latest innovations, accelerating the commercialisation of new technologies and their expansion into overseas markets. If market testing generates positive feedback, it could lead to volume purchases and potential orders worth around RMB1 million." Supporting Chinese Mainland enterprises in going global The HKTDC is one of the core members of the government-led GoGlobal Task Force. This year, the fairs featured the dedicated GoGlobal Connect Zone, offering support on financing, intellectual property, compliance, logistics and risk management to help Chinese Mainland enterprises leverage Hong Kong's international platform and professional services to connect with global markets. The zone received an enthusiastic response, attracting a large number of enquiries and registrations from businesses and professionals interested in expanding their overseas presence. At the same time, many Chinese Mainland technology companies actively used the fair as a springboard for global expansion Among them was Huahon Data Technology, a provider of liquid-cooled AI computing systems and AI solutions, which worked to actively expand its international presence through the fair, successfully connecting with buyers and business partners from Asia, the Middle East and Europe. The company's CEO, Luo Hua, said: "Our global expansion strategy goes beyond selling hardware products. We are committed to building a comprehensive AI ecosystem and providing overseas customers with integrated solutions covering hardware, platforms and applications." The company is actively advancing its international development plans and intends to establish a registered company in Hong Kong within the next one to two months, positioning the city as a key base for its global expansion. The exhibitor added: “The HKTDC not only helped us connect with overseas buyers, but also actively introduced us to banks and financial institutions, supporting our financing activities in Hong Kong and our overseas expansion efforts." Global buyers actively source innovative products The fair attracted buyers from around the world to Hong Kong to source innovative technologies and advanced electronic products, with vibrant business discussions taking place throughout the exhibition. Cizar Abughazaleh, CEO of Dubai-based Action to Action, a company specialising in robot procurement and integration solutions for a wide range of service projects, visited the fair to source robots designed for interactive learning and educational applications. He said: "The fair brings together robots for a wide range of applications in a designated showcase area, enabling buyers to efficiently connect with and compare suppliers. We have purchased a dancing robot and a larger humanoid robot designed for testing and evaluation, helping us explore further collaboration opportunities for future projects." In addition to buyers from the Middle East, the fair attracted buyers from emerging markets such as Africa and South America, who travelled to Hong Kong to source innovative products and technologies. Masibo Levy Wafula, Managing Director of Kenya-based robotics and intelligent systems supplier Pixel Electric, successfully identified manufacturers from the Chinese Mainland at the fair and plans to procure smart metering and automation solutions worth around US$100,000 to support the upgrading of his business. Meanwhile, Fabio Marqui, Foreign Trade Manager of Hayamax, a major electronics wholesaler and distributor in Brazil as well as Toshiba's distributor in the country, said that in addition to finalising a US$200,000 order with an existing business partner during the visit, he had also held discussions with a number of new suppliers from Hong Kong, the Chinese Mainland and Taiwan, and expects to establish around four new business collaborations. His experience highlights the fair's strong appeal in bringing together global buyers and quality suppliers, while underscoring Hong Kong's unique role as a vital gateway connecting the Chinese Mainland with international markets. Over 100 events and 180+ international experts drive industry exchange More than 100 events were organised during the fairs, including forums, robotics demonstrations and performances. Over 180 industry leaders, experts and business representatives from around the world shared their insights. Among the highlights was a series of well-attended sessions focusing on GoGlobal activities with representatives from Hang Seng Bank, the Hong Kong Export Credit Insurance Corporation and other financial and professional service organisations examining key considerations for overseas expansion, including financing, risk management and business planning. Meanwhile, speakers from OCBC Bank (Hong Kong) shared the latest developments in ASEAN’s manufacturing ecosystem and corporate expansion strategies, providing practical insights for businesses seeking opportunities in the region. In addition, a wide range of forum sessions explored topics such as AI applications, digital transformation, industrial upgrading and cross-border business opportunities, attracting strong participation from industry professionals and reflecting keen market interest in innovation and emerging business opportunities. The RoboPark also featured exciting robot football matches, robot street dance performances and other live demonstrations, vividly showcasing the latest developments in real-world robotics applications. These activities added energy and a vibrant technology atmosphere to the fair, drawing large crowds of buyers and visitors. The two fairs continued to adopt the EXHIBITION+ hybrid format, combining physical exhibitions with online business matching. In addition to attending the physical fairs, exhibitors and buyers also had access to the Click2Match smart business matching platform to conduct online meetings and sourcing activities. The online editions of both the Electronics Fair and electronicAsia will remain open until 23 October, extending business matching and collaboration opportunities worldwide. Photo download: https://bit.ly/4hNaRLX Websites - Hong Kong Electronics Fair (Autumn Edition): https://www.hktdc.com/event/hkelectronicsfairae/en - electronicAsia: https://www.hktdc.com/event/electronicasia/en Media enquiries Please contact the HKTDC's Communications & Public Affairs Department: Katy Wong Tel: (852) 2584 4524 Email: katy.ky.wong@hktdc.org Clayton Lauw Tel: (852) 2584 4472 Email: clayton.y.lauw@hktdc.org HKTDC Media Room: https://mediaroom.hktdc.com/en About HKTDC The Hong Kong Trade Development Council (HKTDC) celebrates its 60th anniversary this year. The HKTDC is a statutory body established in 1966 to promote, assist and develop Hong Kong's trade. With over 50 offices globally, including 13 in the Chinese Mainland, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via trade publications, research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus. ———————————————————————————————————————————————————————————— VCI Global Advances AI Infrastructure and Token Services Strategy; Strengthens Balance Sheet in 1H2026 2026-10-16 · GlobeNewswire · Crypto, AI, Semiconductors https://www.globenewswire.com/news-release/2026/10/16/3382838/0/en/vci-global-advances-ai-infrastructure-and-token-services-strategy-strengthens-balance-sheet-in-1h2026.html Total Equity Increases 19.2% to US$114.70 Million as Company Prioritizes Expansion Across GPU Computing and AI Model Service Total Equity Increases 19.2% to US$114.70 Million as Company Prioritizes Expansion Across GPU Computing and AI Model Service ———————————————————————————————————————————————————————————— Hyperscale Data Announces Plan for its askROI Subsidiary to Go Public in the Second or Third Quarter of 2027 2026-10-16 · PR Newswire · Finance, AI, SaaS, Semiconductors https://www.prnewswire.com/news-releases/hyperscale-data-announces-plan-for-its-askroi-subsidiary-to-go-public-in-the-second-or-third-quarter-of-2027-302911628.html askROI Offers an All-in-One Platform Featuring More Than 240 Productivity Tools, Generative AI, Business Automation and Advanced AI Research LAS VEGAS, Oct. 16, 2026 -- Hyperscale Data, Inc. (NYSE American: GPUS), an artificial intelligence ("AI") data center company... ———————————————————————————————————————————————————————————— LASE Appoints Dmitri Nikitin Executive Chairman 2026-10-16 · Newswire.com · Finance, SaaS, Energy, Industrial, Biotech & pharma, Semiconductors https://www.newswire.com/news/lase-appoints-dmitri-nikitin-executive-chairman Laser Photonics Corporation (NASDAQ:LASE), an emerging directed energy and laser technology platform developing applications for defense, semiconductor, pharmaceutical and industrial markets (the "Company"), today announced the appointment of Dmitri Nikitin, the Company's founder, as Executive Chairman of the Board of Directors and principal executive officer responsible for leading the Company, with the authority an ———————————————————————————————————————————————————————————— Sterne Kessler Client Netlist Negotiates $600 Million Settlement with Micron Technology 2026-10-16 · Business Wire · Semiconductors https://finance.yahoo.com/technology/articles/sterne-kessler-client-netlist-negotiates-172400860.html WASHINGTON, October 16, 2026--A cross-practice team at Sterne, Kessler, Goldstein & Fox served as U.S. International Trade Commission and Federal Circuit counsel to Netlist, Inc. in a series of patent disputes with Micron Technology, Inc. After several years of litigation, Netlist has reached a compreh ———————————————————————————————————————————————————————————— Epi Wafer Market Prospects Through 2034: Revenue Growth and 7.99% CAGR Forecast 2026-10-16 · PR News Releaser · Finance, Industrial, Semiconductors https://www.prnewsreleaser.com/news/473681 Overall, epi wafers are a fundamental component of modern semiconductor manufacturing. Their ability to provide precisely engineered crystalline layers makes them essential for producing efficient, reliable, and high-performance electronic devices across a wide range of industries. Epi Wafer Market Overview ... Read more ———————————————————————————————————————————————————————————— Silicon Motion Announces Annual Dividend Increase 2026-10-16 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/10/16/3382554/9885/en/silicon-motion-announces-annual-dividend-increase.html TAIPEI, Taiwan and MILPITAS, Calif., Oct. 16, 2026 -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) (“Silicon Motion” or the “Company”), a global leader in designing and marketing NAND flash controllers for solid state storage devices, announces today its annual cash dividend of $2.30 per ADS, a 15% increase from the $2.00 per ADS declared in 2025. ———————————————————————————————————————————————————————————— AIXTRON Q3 2026: Order Intake and Operating Profitability Significantly Exceed Market Expectations 2026-10-15 · NewMediaWire · Finance, AI, Energy, Semiconductors https://www.newmediawire.com/news/aixtron-q3-2026-order-intake-and-operating-profitability-significantly-exceed-market-expectations-7090658 HERZOGENRATH, GERMANY - October 15, 2026 - AIXTRON SE (FSE: AIXA, ISIN DE000A0WMPJ6) has determined preliminary results for the third quarter of 2026. Order intake, operating result (EBIT) and EBIT margin significantly exceed current market expectations. Preliminary Q3 2026 order intake amounted to approx. EUR 275 million, vs. EUR 124.0 million in the prior-year quarter. This was significantly above the median analyst estimate of EUR 214.6 million based on the company's current consensus, and also well above the EUR 214.5 million reported in Q2 2026. Preliminary revenue in Q3 2026 amounted to approximately EUR 184 million (Q3 2025: EUR 119.6 million) well within the forecast range for the quarter of EUR 180 million plus or minus EUR 20 million. Preliminary operating profitability exceeded market expectations, in particular due to a favorable product mix. Q3 2026 gross profit reached approximately EUR 87 million, corresponding to a gross margin of approximately 48% (Q3 2025: EUR 46.4 million; 39%). Preliminary operating result (EBIT) amounted to approximately EUR 57 million, with an EBIT margin of approximately 31% (Q3 2025: EUR 15.4 million; 13%). The guidance for fiscal year 2026 remains unchanged. “Our order intake continues to be driven by strong demand for equipment for laser applications in AI data center communications. At the same time, a favorable product mix contributed to profitability significantly above market expectations. The high order intake clearly strengthens our business prospects for 2027,” says Dr. Felix Grawert, CEO of AIXTRON SE. The full quarterly group statement for the third quarter of 2026, including the results for the first nine months of 2026, will be published as scheduled on October 29, 2026. Contact Christian Ludwig Vice President Investor Relations & Corporate Communications fon +49 (2407) 9030-444 e-mail c.ludwig@aixtron.com About AIXTRON: AIXTRON SE is a leading provider of deposition equipment to the semiconductor industry. The Company was founded in 1983 and is headquartered in Herzogenrath (near Aachen), Germany, with subsidiaries and sales offices in Asia, United States, and in Europe. AIXTRON´s technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and optoelectronic applications based on compound or organic semiconductor materials. Such components are used in a broad range of innovative applications, technologies and industries. These include laser and LED applications, display technologies, data transmission, SiC and GaN power management and conversion, communication, signaling and lighting as well as a range of other leading-edge applications. Our registered trademarks: AIXACT®, AIX-Multi-Ject®, AIXTRON®, Close Coupled Showerhead®, EXP®, EPISON®, Gas Foil Rotation®, HXP®, HYPERION®, Multi-Ject®, Planetary Reactor®, PVPD®, STExS®, TriJet® For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6) please visit our website at: www.aixtron.com. Forward-Looking Statements This document may contain forward-looking statements regarding the business, results of operations, financial condition, and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on our current assessments, expectations and assumptions, of which many are beyond control of AIXTRON, and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance, or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semiconductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements, in particular in the chapter Risks in the Annual Report, filed by AIXTRON. Any forward-looking statements contained in this document are based on current expectations and projections of the executive board based on information available on the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law.  This document is also available in a German language translation version. In case of discrepancies, the English language document shall prevail and shall be the valid version. ———————————————————————————————————————————————————————————— Judy Shelton, Gold Standard Chatter and Cracks in Credit: Inside DH Unplugged 821 2026-10-15 · Newsworthy.ai · Finance, AI, SaaS, Real estate, Retail, Gaming, Media, Logistics, Semiconductors https://newsworthy.ai/news/202610153057/judy-shelton-gold-standard-chatter-and-cracks-in-credit-inside-dh-unplugged-821 Delray Beach, FL Thursday Oct 15, 2026 @ 1:20 PM Central — Episode 821 of DH Unplugged, titled Gold Standard Ahead, hosted by Andrew Horowitz and John C. Dvorak, lands on October 14, 2026 with a flu-rattled Horowitz powering through a dense market docket. The pair unpack the appointment of Judy Shelton as a counselor to Treasury Secretary Scott Bessant, revived gold-standard chatter, the opening salvo of bank earnings season, cracking consumer credit, and a widening U.S. trade deficit. It is a quintessential DH Unplugged hour: skeptical, specific, and willing to call policy theater by its name. Listeners can expect granular reporting across several threads pulled directly from the week's tape: JPMorgan, Goldman Sachs, Citigroup and Wells Fargo kicking off earnings, with Bank of America hit by a reported $1.5 billion money-laundering fine on the eve of its print. High-yield bond yields climbing from 7.22% to 8.1% in a month, and CCC spreads blowing out roughly 1,250 basis points. U.S.-to-China tanker bookings reportedly hitting $80 million per voyage, adding about $41 per barrel in freight cost alone. Compass data showing price reductions on up to 58.9% of listings in Williamson, Texas, versus just 5.6% in San Francisco. The hosts' trademark skepticism cuts through official narratives on rate policy, the Russia-Ukraine ceasefire framing, and Bessant's bond-market maneuvering. Horowitz, exasperated by Treasury's attempts to cap long-end yields and possibly scrap 20-year auctions, delivers a direct message: Scott Bessant, if you're listening, because I know you are, I know you're listening, it's maybe late in the show, but please stop because you're messing around with gasoline with a match. Dvorak counters with his read of the political optics, arguing the administration is in "the twilight of the optics game" where messaging substitutes for substance. The episode goes deep on the collision of AI, labor and software economics. Kroger announced 3,000 corporate layoffs, roughly 30% of its 10,000-person white-collar headcount, targeting finance, supply chain, procurement, real estate and HR. Dvorak, drawing on his Fortune 500 consulting work, pushes back on the AI-productivity narrative, arguing most real savings come from replacing outside firms like PwC and Accenture rather than internal staff. The hosts also walk through Anthropic's new policy prohibiting "sustained needless cruelty" toward Claude, a French supermarket hack that remotely disabled internet-connected refrigerators (some reportedly catching fire), and a new open-source tool, Reverse Engineer Anything, which spawned Slowbooks, a free clone of QuickBooks 2003. Anduril's planned $3.7 billion Maryland shipyard for Virginia-class submarine components, Broadcom's $42 billion customer-financing program, and Apple's LG-built smart-home push round out the tech beat. About DH Unplugged DH Unplugged is a weekly investing and markets podcast hosted by financial advisor Andrew Horowitz and tech commentator John C. Dvorak. The show blends Fed policy, earnings, commodities, consumer trends and offbeat cultural observations with a skeptical, conversational tone that cuts through Wall Street spin. Available at dhunplugged.com, via RSS, Apple Podcasts, Spotify and Amazon Music/Podcasts, DH Unplugged serves self-directed investors who want context, not cheerleading. Episode 821 is available now wherever podcasts are heard. ———————————————————————————————————————————————————————————— Pervaziv AI Updates Cortex Discover Performance with Ten Phase Sustained AI Qualification 2026-10-15 · PRUnderground · AI, Semiconductors https://prunderground.com/pervaziv-ai-updates-cortex-discover-performance-with-ten-phase-sustained-ai-qual/cmv9ubfpb000006lbqztn6941 New results show 13% faster startup, memory near parity, 5.6% lower H.264 CPU, 25.8 ms AI panel readiness and zero retained processes in sustained testing. The post Pervaziv AI Updates Cortex Discover Performance with Ten Phase Sustained AI Qualification first appeared on ———————————————————————————————————————————————————————————— Hudbay to Host Conference Call for Third Quarter 2026 Results 2026-10-15 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/10/15/3382054/0/en/hudbay-to-host-conference-call-for-third-quarter-2026-results.html TORONTO, Oct. 15, 2026 -- Hudbay Minerals Inc. (“Hudbay” or the “Company”) (TSX, NYSE: HBM) senior management will host a conference call on Thursday, November 12, 2026 at 11:00 a.m. ET to discuss the Company’s third quarter 2026 results. ———————————————————————————————————————————————————————————— XCENA Showcases CXL Memory Innovations for AI Inference at OCP Global Summit 2026 2026-10-15 · Business Wire · AI, Semiconductors https://finance.yahoo.com/technology/ai/articles/xcena-showcases-cxl-memory-innovations-180000292.html XCENA's MX1 lineup of CXL-based memory solutions showcased at OCP Global Summit 2026 in San Jose. – XCENA and SK hynix are jointly optimizing RDMA-based shared-memory performance; their collaboration demo was featured at the SK hynix booth – MX1 demonstrations show a KV cache shared across inference servers and near-data ———————————————————————————————————————————————————————————— AI Maverick Intel Signs Definitive Agreement to Acquire Heal Access, an Agentic AI Healthcare Platform 2026-10-15 · Newswire.com · AI, SaaS, Semiconductors https://www.newswire.com/news/ai-maverick-intel-signs-definitive-agreement-to-acquire-heal-access-an-22874891 AI Maverick Intel, Inc. (OTCID:AIMV) ("AIMV" or the "Company") has entered into a definitive share purchase agreement (the "Share Purchase Agreement") to acquire, through a wholly owned subsidiary, all of the issued and outstanding shares of Heal Access Canada Inc. ("Heal Access") from HEAL Group Holdings Inc. ("HEAL Group"), AIMV's controlling stockholder. The Share Purchase Agreement follows the non-binding letter ———————————————————————————————————————————————————————————— Zesty Launches Automated Fractional GPUs, Bringing Automation to NVIDIA CUDA-Native GPU Fractioning 2026-10-15 · PR Newswire · AI, SaaS, Semiconductors https://www.prnewswire.com/news-releases/zesty-launches-automated-fractional-gpus-bringing-automation-to-nvidia-cuda-native-gpu-fractioning-302910271.html Following NVIDIA's open-source release of the Run:ai platform, Zesty's new autonomous capability continuously adapts GPU memory allocation, compute sharing, and workloads placement as demand changes, enabling more workloads to run on each GPU. SAN MATEO, Calif., Oct. 15, 2026... ———————————————————————————————————————————————————————————— Sterling and BitRipple Partner to Deliver Super Intelligence Efficiency and Communication Acceleration 2026-10-15 · Business Wire · Education, Semiconductors https://finance.yahoo.com/technology/ai/articles/sterling-bitripple-partner-deliver-super-150000787.html The companies will package BitRipple's LT3 GPU transport into deployment-ready solutions for AMD and NVIDIA GPU platforms NORTH SIOUX CITY, S.D. & BERKELEY, Calif., October 15, 2026--Sterling Computers Corp. ( www.sterling.com ), a global solutions integrator serving government, education and commercia ———————————————————————————————————————————————————————————— Infineon and Wolfspeed Expand and Extend Long-Term Silicon Carbide Wafer Supply Agreement to Include 200 mm 2026-10-15 · Business Wire · Finance, Semiconductors https://finance.yahoo.com/technology/articles/infineon-wolfspeed-expand-extend-long-120000618.html DURHAM, N.C., October 15, 2026--Wolfspeed, Inc (NYSE: WOLF), a global leader in silicon carbide technology, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the expansion and extension of their existing long-term silicon carbide (SiC) wafer supply agreement. The expanded agreement ———————————————————————————————————————————————————————————— Global Microprocessor Market Size, Share, Growth Trends, and Forecast 2026-2035 | AI, High-Performance Computing, Automotive, and IoT Drive 8.7% CAGR Toward USD 191 Billion 2026-10-15 · GlobeNewswire · AI, Energy, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/10/15/3381373/28124/en/global-microprocessor-market-size-share-growth-trends-and-forecast-2026-2035-ai-high-performance-computing-automotive-and-iot-drive-8-7-cagr-toward-usd-191-billion.html AI-optimized designs, energy-efficient chips, advanced packaging and ecosystem partnerships strengthen differentiation, supply security and ROI. AI-optimized designs, energy-efficient chips, advanced packaging and ecosystem partnerships strengthen differentiation, supply security and ROI. ———————————————————————————————————————————————————————————— EE Times Interview: Mark Papermaster on the Future of AI and Semiconductor Innovation (Video) 2026-10-15 · AMD · AI, Media, Semiconductors https://newsroom.amd.com/news/ee-times-interview-mark-papermaster-future-a-video/ Watch as AMD CTO Mark Papermaster joins EE Times journalist Nitin Dahad at World Summit AI 2026. ———————————————————————————————————————————————————————————— NVIDIA and Semiconductor Leaders Advance AI Across Chip Design and Manufacturing for AI-Defined Fabs 2026-10-14 · NVIDIA · AI, Industrial, Semiconductors https://nvidianews.nvidia.com/news/nvidia-and-semiconductor-leaders-advance-ai-across-chip-design-and-manufacturing-for-ai-defined-labs NVIDIA today announced semiconductor leaders are adopting NVIDIA CUDA-X™ libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents that simulate how atoms and molecules interact — to advance AI-defined fabs. ———————————————————————————————————————————————————————————— 51AIpower Introduces 200 Free Starter Plan Uses for New Users to Explore AI Infrastructure Participation 2026-10-14 · iCrowdNewswire · AI, Semiconductors https://icrowdnewswire.com/2026/10/14/51aipower-introduces-200-free-starter-plan-uses-for-new-users-to-explore-ai-infrastructure-participation/ Want to make money with AI but don’t have clients, coding experience, or your own GPUs? 51AIpower is offering new users an allowance for up to 200 free Starter Plan uses, providing an introduction to participation in the power and […] ———————————————————————————————————————————————————————————— OpenWorld (NASDAQ: OPNW) Signs Term Sheet to Finance and Operate a Solar-Powered AI Computing Network Built on Tesla Powerwall Batteries 2026-10-14 · ACN Newswire · Finance, Crypto, AI, SaaS, Real estate, Energy, Automotive, Industrial, Semiconductors https://www.acnnewswire.com/press-release/english/110796/ OpenWorld, Inc. ("OpenWorld" or the "Company") (NASDAQ: OPNW), an innovation company advancing global real-world asset ("RWA") tokenization, today announced that it has entered into a non-binding term sheet with Meridian to establish a tokenized financing program of up to $[1] billion to fund the purchase and deployment of a distributed AI computing network powered by solar energy and Tesla Powerwall battery storage. Under the term sheet, OpenWorld will serve as advisor, structuring agent and services provider for the program, and its OpenWorld Enterprise platform will finance, coordinate and monitor the network. Key Highlights Up to $1 billion in tokenized financing: OpenWorld structures and administers the tokenized financing program on OpenWorld Enterprise. Tesla Powerwall batteries, solar panels and AI computing equipment serve as collateral within the structure. Exclusive Tesla Powerwall inventory: Meridian holds exclusive rights to a reserved inventory of Tesla Powerwall systems that qualified for federal clean-energy tax credits before those credits were discontinued. [The inventory covers more than 160,000 Powerwalls, enough to support approximately 80,000 homes.] Initial deployment of 10,000 homes: [GPU-equipped computers at participating homes, with larger installations at local schools, hospitals and commercial campuses.] AI inference without new data centers: AI providers pay to run trained models on the network with no new centralized data-center sites, no additional grid interconnections and no water-based cooling. The program is intended to supply capacity to one or more leading AI inference providers. Hosts get paid: Homeowners receive monthly hosting payments and lower-cost electricity, with household energy needs taking priority over computing workloads. Commercial hosts receive a share of site revenue and backup power. Timeline: Test installations scheduled to begin in the fourth quarter of 2026; first commercial site targeted for the first quarter of 2027. Builds on the BeyondAI transaction: Follows last week's proposed transaction with BeyondAI, which would transform BeyondAI’s industrial AI intellectual property rights into financeable collateral on OpenWorld’s tokenization platform. Solving the Power Problem in AI Infrastructure Access to power is a growing constraint on AI infrastructure. New data centers face lengthy grid interconnection timelines, local opposition and significant water demands. The planned network of home-hosted, distributed AI inference computing would place GPU-equipped computers at participating homes and larger installations at local schools, hospitals and commercial campuses, each powered by on-site solar generation and Tesla Powerwall storage. AI providers would pay to use this computing capacity for inference, the process of running trained AI models, without requiring new centralized data-center sites, additional grid connections or water-based cooling. Participating homeowners would receive monthly hosting payments and lower-cost electricity, with household energy needs taking priority over computing workloads. Commercial hosts would receive a share of site revenue and backup power. How the Program Works Meridian, a privately held Delaware limited liability company, specializes in optimizing tax credits for Tesla Powerwall systems and holds exclusive rights to a reserved inventory of Powerwall systems that qualified for federal clean-energy tax credits before those credits were discontinued. [The inventory covers more than 160,000 Powerwalls, enough to support installations at approximately 80,000 homes. The program’s initial deployment is planned for 10,000 homes.]   Under the term sheet, OpenWorld will serve as advisor, structuring agent and services provider for the financing program. OpenWorld will establish and administer the tokenized financing structure on its OpenWorld Enterprise platform. The financing would support Meridian’s purchase and deployment of Tesla Powerwall batteries and associated AI computing equipment, as well as the purchase by OpenWorld or a subsidiary of solar panels, all of which would serve as collateral within the structure. OpenWorld is also developing an integrated system to power and operate each installation. The OpenWorld Enterprise platform will coordinate computing workloads across the network, monitor equipment performance and provide investors with reporting on the underlying assets. The program is intended to supply computing capacity to one or more leading AI inference providers. Test installations are scheduled to begin in the fourth quarter of 2026, with the first commercial site targeted for the first quarter of 2027. Management Commentary “Access to power is becoming the major constraint on the growth of AI infrastructure,” said Matt Shaw, CEO and Chairman of OpenWorld. “By bringing computing equipment to homes and commercial properties through solar generation and Tesla Powerwall storage, we can build AI capacity closer to the power source instead of waiting years for a grid connection. Our term sheet with Meridian brings together the tokenization, financing and operating capabilities needed to develop this network at scale, and it shows what OpenWorld Enterprise is built to do: turn real-world assets into financeable, on-chain infrastructure.” “Meridian’s rights to a large inventory of tax-qualified Tesla Powerwall systems provide the critical foundation for this program,” said Josh Raffaelli, founder of Meridian and clean energy investor. “OpenWorld will help us finance the equipment and manage the network, turning solar generation and battery storage at participating properties into infrastructure that can serve growing demand for AI computing.” If a transaction is consummated, Mr. Raffaelli is expected to join OpenWorld’s board of directors. Certain officers and directors of OpenWorld hold interests in Meridian; additional information regarding these relationships is included in the Company’s Current Report on Form 8-K. Forward-Looking Statements This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. The words “expected,” “would,” “will,” “anticipate,” “intend,” “plan” and similar expressions are intended to identify forward-looking statements. These include statements about the proposed engagement, the size, timing and structure of the financing program, the Distributed Inference Program, anticipated offtake arrangements and tax credit treatment. These statements are subject to risks and uncertainties that could cause actual results to differ materially. Those risks include failure to execute definitive agreements, market conditions, regulatory developments affecting tokenized securities, tax law changes and the risks described in OpenWorld’s Annual Report and Quarterly Reports filed with the SEC, including under the heading titled “Risk Factors.” OpenWorld undertakes no obligation to update these statements except as required by law. Tesla and Powerwall are trademarks of Tesla, Inc. Tesla, Inc. is not a party to the term sheet described in this release. No Offer or Solicitation This press release is for informational purposes only and does not constitute an offer to sell or the solicitation of an offer to buy any securities, nor shall there be any sale of securities in any jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such jurisdiction. About OpenWorld OpenWorld, Inc. (NASDAQ: OPNW) is a technology-powered digital assets and blockchain innovation company that co-architects and takes principal positions in enterprise blockchain initiatives alongside sovereign governments, institutional partners and major enterprises. Since its founding in 2023, OpenWorld has advised on projects representing over $66 billion in aggregate network value and supported more than 20 companies backed by leading global venture firms, including a16z, Multicoin Capital, Dragonfly and Founders Fund. OpenWorld’s capabilities span real-world asset tokenization, stablecoin infrastructure, capital markets advisory, governance structuring and public markets strategy, with active engagements across the United States, Gulf, Europe, Southeast Asia and Africa. To learn more, visit openworld.dev and follow OpenWorld on X at [@_openworld]. About Meridian Meridian is a privately held Delaware limited liability company that specializes in optimizing federal clean-energy tax credits for Tesla Powerwall systems and holds exclusive rights to a reserved inventory of tax-credit-qualified Powerwall systems. Contacts Investors ir@openworld.dev Media Gasthalter & Co. Phone: (212) 257-4170 Email: openworld@gasthalter.com ———————————————————————————————————————————————————————————— Microchip Expands Space Power Portfolio with New Radiation-Tolerant GaN Point-of-Load Converter 2026-10-14 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/10/14/3380644/0/en/microchip-expands-space-power-portfolio-with-new-radiation-tolerant-gan-point-of-load-converter.html Power device delivers 20A of continuous current in a compact form factor for new space and traditional space applications Power device delivers 20A of continuous current in a compact form factor for new space and traditional space applications ———————————————————————————————————————————————————————————— Global Vacuum Pumps Market Size, Share, Trends, and Forecast - 2033 | Market to Reach USD 8.1 Billion as Semiconductor Growth and Smart, Energy-Efficient Systems Drive 5.7% CAGR 2026-10-14 · GlobeNewswire · Energy, Semiconductors https://www.globenewswire.com/news-release/2026/10/14/3380438/28124/en/global-vacuum-pumps-market-size-share-trends-and-forecast-2033-market-to-reach-usd-8-1-billion-as-semiconductor-growth-and-smart-energy-efficient-systems-drive-5-7-cagr.html Invest in energy-efficient, IoT-enabled vacuum pumps, target semiconductor demand and expand across Asia-Pacific to reduce downtime and gain a competitive edge Invest in energy-efficient, IoT-enabled vacuum pumps, target semiconductor demand and expand across Asia-Pacific to reduce downtime and gain a competitive edge ———————————————————————————————————————————————————————————— Advantest Announces Call for Papers for VOICE 2027 Developer Conference in San Jose, Calif. 2026-10-14 · GlobeNewswire · AI, Education, Travel, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/10/14/3380355/0/en/advantest-announces-call-for-papers-for-voice-2027-developer-conference-in-san-jose-calif.html TOKYO, Oct. 14, 2026 -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced a global call for papers for its VOICE 2027 Developer Conference, focusing on leading-edge technologies and future trends. The conference will be held in San Jose, Calif., at the Signia by Hilton on June 14-16, 2027.  VOICE is the leading conference for the growing global community of users and strategic partners involved with Advantest’s V93000 and T2000 SoC test platforms, handlers, test cell solutions, product engineering and technology development. The annual conference brings together semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to discuss the latest technological advancements and network with peers. “The semiconductor industry is experiencing an extraordinary period of growth,” said Daniel Grzeda, VOICE 2027 General Chair, Test Quality Director, Texas Instruments. “Meeting the demands of this rapid evolution in artificial intelligence (AI) and high-performance compute (HPC) technology requires continuous innovation across the entire ecosystem, from design and manufacturing to test and measurement. VOICE 2027 provides a unique forum for engineers, researchers and industry leaders to share knowledge, exchange best practices and collaborate on the technologies that will enable the next generation of semiconductor innovation.” Like in previous years, VOICE 2027 will offer a wide array of learning opportunities through technical presentations, keynote addresses and technology kiosks. Advantest’s VOICE 2027 call for papers focuses on these technology tracks and suggested topic areas: ———————————————————————————————————————————————————————————— MSI Showcases Open Data Center and AI Infrastructure at 2026 OCP Global Summit 2026-10-13 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/msi-showcases-open-data-center-and-ai-infrastructure-at-2026-ocp-global-summit-302902123.html SAN JOSE, Calif., Oct. 13, 2026 -- MSI showcases its open data center and AI infrastructure at the 2026 OCP Global Summit (Booth #A49), led by new 21-inch ORv3 systems and DC-MHS modular building blocks, alongside NVIDIA MGX rack and GPU server platforms and the XpertStation... ———————————————————————————————————————————————————————————— Nikon Launches DSP-110 Digital Lithography System with 1.5 �m Resolution 2026-10-13 · WebWire · Semiconductors https://www.webwire.com/ViewPressRel.asp?aId=362788 Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027, featuring 1.5 �m resolution *1 (L/S *2 ) and throughput of 72 panels / hour *3. The DSP-110 also supports large substrates and achieves approximately 40% higher throughput than the DSP-100, which offers resolution of 1.0 �m (L/S) *4. - - *1: 1 �m (micrometer) represents one-millionth of a meter (one-thousandth of a millimeter). - - *2: Abbreviation for Line and Space. Re... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=362788 ———————————————————————————————————————————————————————————— Global Semiconductor Ceramics Market Size, Share, and Trends Forecast, 2026-2033 | AI Chips and Advanced Packaging Drive 6.5% CAGR to USD 16.7 Billion 2026-10-13 · GlobeNewswire · Finance, AI, Semiconductors https://www.globenewswire.com/news-release/2026/10/13/3379926/28124/en/global-semiconductor-ceramics-market-size-share-and-trends-forecast-2026-2033-ai-chips-and-advanced-packaging-drive-6-5-cagr-to-usd-16-7-billion.html Capitalize on advanced chip demand with insights into high-purity materials, regional opportunities, competitive strategies, product innovation, and new revenue streams. Capitalize on advanced chip demand with insights into high-purity materials, regional opportunities, competitive strategies, product innovation, and new revenue streams. ———————————————————————————————————————————————————————————— Global Pet Microchips Market Size, Share and Trends Forecast, 2026-2033 | Regulation and Pet Humanization Drive 10.6% CAGR Toward USD 972.1 Million 2026-10-13 · GlobeNewswire · Retail, Semiconductors https://www.globenewswire.com/news-release/2026/10/13/3379923/28124/en/global-pet-microchips-market-size-share-and-trends-forecast-2026-2033-regulation-and-pet-humanization-drive-10-6-cagr-toward-usd-972-1-million.html Capitalize on mandatory pet identification, rising safety awareness and pet humanization, with opportunities across veterinary clinics, retail and E-Commerce. Capitalize on mandatory pet identification, rising safety awareness and pet humanization, with opportunities across veterinary clinics, retail and E-Commerce. ———————————————————————————————————————————————————————————— AI Competition Moves Into Power as 51AIpower Focuses on Individual Infrastructure Participation 2026-10-13 · iCrowdNewswire · AI, Energy, Media, Semiconductors https://icrowdnewswire.com/2026/10/13/ai-competition-moves-into-power-as-51aipower-focuses-on-individual-infrastructure-participation/ Buying GPUs clears one hurdle in the AI race. Keeping them powered clears another. As AI services expand from chat into reasoning, video generation, and automated tasks, competition increasingly extends to electricity supply, grid connections, and data center operations. The […] ———————————————————————————————————————————————————————————— Digi Power X Announces $200 Million Debt Financing Commitment to Support Completion of Alabama AI Data Center and Provides Expansion Update 2026-10-13 · ACN Newswire · Finance, Crypto, AI, SaaS, Automotive, Industrial, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/110762/ MIAMI BEACH, FL, Oct 13, 2026 - Digi Power X Inc. (Nasdaq:DGXX)(Cboe Canada:DGX) ("Digi Power X" or the "Company"), an AI data center infrastructure operator, today announced that it has received a commitment letter from a major lending institution for US$200 million in debt financing to support the development of its 40 MW AI data center in Columbiana, Alabama. The financing, syndicated by Goldman Sachs, is expected to close within 90 days, subject to definitive documentation and satisfaction of various conditions, including the lender's completion of its diligence efforts. The financing is to be structured at a project special purpose vehicle ("SPV") level, with an unsecured Company guarantee through project completion and other limited matters. Proceeds are intended to support completion of the Alabama project and related project costs, helping preserve corporate liquidity, mitigate shareholder dilution and position the Company to pursue additional customer contracts. "This financing commitment is an important step toward completing our Alabama campus while limiting dilution for our shareholders. We are progressing from infrastructure development toward revenue generation, with construction on schedule in Alabama, our first modular GPU deployment operating successfully, and expansion plans advancing across our portfolio." - Michel Amar, Chairman & Chief Executive Officer, Digi Power X Inc. Financial Position and Alabama Construction Update As of the date hereof, Digi Power X held approximately US$135 million in cash and invested approximately US$153 million in capital expenditures year to date in 2026. The Company did not issue any shares under its at-the-market ("ATM") equity offering program during the third quarter of 2026, resulting in no ATM-related shareholder dilution during the quarter. Construction at the 40 MW Alabama campus remains on target, with Phase 1 expected to be completed in December 2026 and Phase 2 in March 2027. ARMS 200 Operations and Supermicro Partnership The Company's first ARMS 200 modular data center has been operating successfully since May 2026, supporting its GPU bare-metal business. The deployment demonstrates Digi Power X's ability to manage the infrastructure supporting these services, including power, cooling, data center operations and GPU systems. Digi Power X's partnership with Super Micro Computer, Inc. ("Supermicro") supports dedicated, bare-metal access to NVIDIA Blackwell GPUs, enabling customers to deploy AI workloads without building or managing the underlying infrastructure themselves. Supermicro recently highlighted the collaboration publicly, underscoring its role in powering Digi Power X's full-stack AI offering. Digi Power X: Expanding the AI Token Factory Through NeoCloudz Digi Power X plans to expand its AI token factory infrastructure through its NeoCloudz platform, using the proprietary ARMS modular data center systems of US Data Center, Inc., a subsidiary of which the Company is the largest shareholder, to support fast deployment. This expansion is intended to support the Company's planned growth in GPU bare-metal services and AI token generation. Building on its initial ARMS 200 deployment, the Company intends to deploy additional modular capacity to meet customer demand and grow recurring AI infrastructure revenue. "We're excited to unveil our AI token factory at NVIDIA GTC Berlin. Digi Power X owns the whole stack, from the power to the data center to the computer, and that's how we deliver fast, affordable inference at scale." - Alec Amar, President, Digi Power X Inc. New York Transition to AI Token Factories Digi Power X is in the planning phase to repurpose its New York State sites into AI token factories, expanding capacity for GPU bare-metal services and AI token generation. The planned conversion is designed to reduce site noise levels and incorporate closed-loop cooling systems designed to minimize water consumption by recirculating coolant without routine evaporative water use. Silicon Valley Development Lab The Company has also acquired an office and laboratory facility in Silicon Valley to develop the technology and operational intelligence supporting its AI token factory strategy. Digi Power X is bringing together top talent in engineering, artificial intelligence and software development to accelerate innovation and strengthen its capabilities as it expands its GPU infrastructure and AI services. About Digi Power X Digi Power X is a fully integrated AI infrastructure company that owns and operates the whole stack, from power generation and data centers to the computers that run AI workloads. The Company offers colocation for enterprise and hyperscale customers, bare metal GPU rental and a token factory that delivers AI inference at scale. Because it controls the power, the infrastructure and the compute, Digi Power X can bring capacity online faster and more affordably. For more information, visit www.digipowerx.com. Investor Relations For further information, please contact: Michel Amar, Chief Executive Officer Digi Power X Inc. www.digipowerx.com Investor Relations: T: 888-474-9222 | Email: IR@digihostpower.com Cautionary Statement Trading in the securities of the Company should be considered highly speculative. No stock exchange, securities commission or other regulatory authority has approved or disapproved the information contained herein. Cboe Canada does not accept responsibility for the adequacy or accuracy of this release. Cautionary Note and Forward-Looking Statements This press release contains "forward-looking statements" within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, and "forward-looking information" within the meaning of applicable Canadian securities laws (collectively, "forward-looking statements"). All statements other than statements of historical fact are forward-looking statements. Words such as "anticipate," "believe," "continue," "estimate," "expect," "intend," "may," "plan," "potential," "proposed," "should," "target," "will," "would" and similar expressions are intended to identify forward-looking statements, although not all forward-looking statements contain these words. Forward-looking statements in this press release include, without limitation, statements regarding: the proposed $200 million debt financing, including the timing of closing and funding, and the satisfaction of conditions to closing, including lender satisfaction of its diligence requirements; the expected use of proceeds, including the funding of remaining construction and related project costs, and the anticipated effects on corporate liquidity and shareholder dilution; the progress, schedule and completion of Phase 1 and Phase 2 of the Company's 40 MW AI data center in Columbiana, Alabama, the Company's ability to pursue additional customer contracts and generate recurring revenue; the planned expansion of the Company's AI token factory infrastructure, including through USDC and the ARMS modular data center platform; the planned conversion of the Company's New York State sites and the anticipated noise and water use benefits of that conversion; the anticipated use and benefits of the Company's Silicon Valley facility; and the execution of the Company's AI infrastructure strategy. These statements are based on management's current expectations, estimates and assumptions and are subject to known and unknown risks, uncertainties and other factors that could cause actual results to differ materially, including, among others: the risk that the conditions to closing under the commitment letter are not satisfied or waived on a timely basis or at all, or that the financing is not completed on the anticipated terms or at all; the risk that the lender's commitment terminates or is modified; the possibility that financing proceeds will be insufficient to fund all remaining construction and project costs; the risk that preliminary financial information differs from final reported results; construction delays, cost overruns, supply chain disruptions and the availability of equipment, GPUs, labor and power; permitting, zoning, environmental and other regulatory approvals; the performance of contractors, partners and counterparties; the ability of the Company and its customers to perform under the Company's colocation and other customer agreements; obligations under the financing; demand for AI and high-performance computing infrastructure; general economic, market and interest rate conditions; and the other risks and uncertainties described under "Risk Factors" in the Company's most recent Annual Report on Form 10-K and other filings with the U.S. Securities and Exchange Commission. Readers are cautioned not to place undue reliance on forward-looking statements, which speak only as of the date of this press release. Except as required by applicable law, the Company undertakes no obligation to update or revise any forward-looking statement, whether as a result of new information, future events or otherwise. SOURCE: Digi Power X Inc. ———————————————————————————————————————————————————————————— H3C CAS Named a Visionary in Gartner(R) Magic Quadrant(TM) for Server Virtualization Platforms 2026-10-13 · ACN Newswire · AI, SaaS, Media, Education, Cybersecurity, Semiconductors https://www.acnnewswire.com/press-release/english/110768/ BEIJING, Oct 13, 2026 - On September 14, Gartner released its Magic Quadrant™ for Server Virtualization Platforms. H3C CAS is positioned as a Visionary in the 2026 Gartner® Magic Quadrant™ for Server Virtualization Platforms, making H3C one of the few Chinese vendors included in the report. This recognition reflects H3C CAS's continued innovation and capabilities in server virtualization. Beyond Virtualization: A Stable Foundation for Mission-Critical Workloads As cloud computing continues to evolve, server virtualization remains a key foundation for enterprise IT infrastructure. At the same time, the growth of AI, diverse computing architectures, and the coexistence of virtual machines and containers are creating new requirements for virtualization platforms. H3C CAS has evolved from a compute virtualization platform into an enterprise virtualization and cloud management platform covering compute, storage, networking, security, and unified management. It supports x86, ARM, and a broad range of operating systems and hardware. Key capabilities include: 1. Improved resource utilization with NVMe SSD-based intelligent memory overcommitment. 2. Optimized VM scheduling with automatic VM NUMA binding. 3. Support for AI workloads with capabilities such as vGPU live migration. From Virtual Machines to Containers: One Platform for Application Modernization As virtual machines and containers increasingly coexist in enterprise data centers, organizations need a unified infrastructure platform to support both traditional and cloud-native applications. H3C CAS integrates virtualization and cloud-native technologies through native Kubernetes integration and container cluster services, enabling unified management of VM and container resources. CAS also provides virtual networking and network services, including Open vSwitch, bandwidth management, traffic prioritization, firewalls, load balancing, and micro-segmentation. Support for RoCE v2 and SR-IOV further enables high-performance and AI workloads. Evolving Virtualization for the AI Era As IT infrastructure evolves from server virtualization to cloud and AI infrastructure, enterprises continue to require stable, secure, efficient, and future-ready platforms. The Visionary positioning in the Gartner Magic Quadrant reflects the global competitiveness of H3C CAS in server virtualization. Today, CAS serves more than 15,000 customers, with 500,000+ CPUs running online, across industries including government, finance, education, and broadcasting and television. Looking ahead, H3C will continue to integrate server virtualization with AI computing, GPU resource management, and cloud-native technologies, helping customers build more efficient and intelligent infrastructure for next-generation data centers. Disclaimer: Source:Gartner, Magic Quadrant for Server Virtualization Platforms, 14 September 2026 GARTNER and Magic Quadrant are registered trademarks of Gartner, Inc. and/or its affiliates in the U.S. and internationally and are used herein with permission. All rights reserved. Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner's research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability or fitness for a particular purpose. H3C Jingwen Zeng zeng.jingwen@h3c.com  https://www.h3c.com/en/ ———————————————————————————————————————————————————————————— Gemtek, Qualcomm and gFiber Collaborate to Bring Edge AI to Wi-Fi 8 Broadband Gateways 2026-10-13 · PR Newswire · AI, Telecom, Semiconductors https://www.prnewswire.com/news-releases/gemtek-qualcomm-and-gfiber-collaborate-to-bring-edge-ai-to-wi-fi-8-broadband-gateways-302906828.html New AI-Native Wi-Fi 8 Gateway combines next-generation connectivity, local AI computing, and intelligent software TAIPEI, Oct. 13, 2026 -- Gemtek Technology Co., Ltd. announced it is highlighting an AI-native Wi-Fi 8 broadband gateway at Network X 2026, developed in... ———————————————————————————————————————————————————————————— Tower Semiconductor Announces Third Quarter 2026 Financial Results and Conference Call 2026-10-13 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/10/13/3379355/0/en/tower-semiconductor-announces-third-quarter-2026-financial-results-and-conference-call.html Tower will issue its third quarter 2026 earnings release on Nov 2, 2026. Tower will hold a conference call to discuss its third quarter financial results. ———————————————————————————————————————————————————————————— In-vehicle Infotainment Market to Grow from USD 23.07 billion in 2025 to USD 40.49 billion by 2032, at a CAGR of 8.4% — MarketsandMarkets™ 2026-10-13 · GlobeNewswire · SaaS, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/10/13/3379292/0/en/in-vehicle-infotainment-market-to-grow-from-usd-23-07-billion-in-2025-to-usd-40-49-billion-by-2032-at-a-cagr-of-8-4-marketsandmarkets.html Delray Beach, FL , Oct. 12, 2026 -- MarketsandMarkets™ projects the in-vehicle infotainment market is projected to grow from USD 23.07 billion in 2025 to USD 40.49 billion by 2032 at a CAGR of 8.4%. The evolution toward Software-Defined Vehicles (SDV) is transforming the IVI market into a high-bandwidth platform that integrates ADAS and vehicle-edge computing, making the screen the primary HMI for complex data. This is enabled by zonal E/E architectures and Ethernet backbones, which facilitate seamless OTA updates and GPU-accelerated HMIs. By adopting Android Automotive OS and containerized UX, automakers are shortening development cycles and enabling app ecosystems, thus ensuring continuous feature updates and sustained customer demand. On the other hand, IVI now sits on the same backbone as ADAS and powertrain domains; securing cross-domain communication (especially in AAOS-based systems) requires advanced intrusion detection, secure gateways, and costly certification under UNECE WP.29. This becomes challenging for OEMs and Tier-1 players. ———————————————————————————————————————————————————————————— OCP 2026 Keynote Replay: Building the Next Era of AI Infrastructure 2026-10-13 · AMD · AI, Semiconductors https://newsroom.amd.com/news/ocp-2026-keynote-replay-next-era-ai-infrastructure/ Watch as AMD CEO and Chair Lisa Su highlights the company’s portfolio of open, full-stack compute to help support agentic AI at every scale. ———————————————————————————————————————————————————————————— Applied Materials Unveils $5 Billion EPIC Center in Silicon Valley to Accelerate Semiconductor Innovation for the AI Era 2026-10-12 · GlobeNewswire · AI, Education, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/10/12/3379252/0/en/applied-materials-unveils-5-billion-epic-center-in-silicon-valley-to-accelerate-semiconductor-innovation-for-the-ai-era.html SUNNYVALE, Calif., Oct. 12, 2026 -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center, a $5 billion capital investment* to build the world’s largest facility dedicated to collaborative semiconductor process technology and manufacturing equipment R&D. Inside the EPIC Center, leading chipmakers, systems companies, equipment partners and university researchers will work side by side with Applied’s scientists and engineers to accelerate the pace of chip innovation for the AI era. ———————————————————————————————————————————————————————————— ASML reports transactions under its current share buyback program 2026-10-12 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/10/12/3378817/0/en/asml-reports-transactions-under-its-current-share-buyback-program.html ASML reports transactions under its current share buyback program ———————————————————————————————————————————————————————————— Changzhou Microintelligence Co., Ltd passes HKEX Listing Committee hearing 2026-10-12 · ACN Newswire · Finance, AI, SaaS, Real estate, Energy, Retail, Automotive, Education, Industrial, Semiconductors https://www.acnnewswire.com/press-release/english/110749/ Hong Kong, Oct 12, 2026 - Changzhou Microintelligence Co., Ltd (“Microintelligence” or “the Company”) recently passed the hearing of the Listing Committee of The Stock Exchange of Hong Kong Limited (HKEX) on X 2026. Orient Capital, the subsidiary of Orient Securities, is the sole sponsor for the initial public offering. Based on 2025 revenue, the Company is China’s largest supplier of Embodied Industrial Intelligent Robots (EIIR), with a market share of approximately 20.0%. Microintelligence was founded in 2018. As a leader in industrial embodied intelligence, the Company develops EIIR products and integrated solutions capable of autonomous perception, learning, decision-making and executing of complex tasks with its full-stack self-developed software, hardware and systems engineering capabilities. Its products have achieved commercialization at scale in real-world industrial settings, including in industries with extremely high requirements for precision, stability, and reliability, such as 3C electronics, automotive manufacturing, new energy, fast-moving consumer goods (FMCG), and semiconductors. Meanwhile, its application scenarios are evolving from "mature single-process workflow” to "integrated workstations." According to IDC's China Industrial Embodied Intelligent Robots Market Share, 2025 report, the company holds the No. 1 market share in China. The Company is also one of the world’s first leading companies to achieve commercial verification of embodied industrial intelligence robots in multiple complex industrial scenarios. Through a standardized "Cloud-Edge-Device" integrated architecture, Microintelligence combines AI models, industrial know-how, and real-world scenario data to build core physical AI capabilities. This enables EIIR to complete a fully autonomous closed loop spanning perception, learning, decision-making, and execution. As EIIR systems roll out across real factory environments, the company has also built a "data-model-product-redeployment" flywheel. On-site data accumulated during production line operations is distilled into process knowledge through a "human-in-the-loop" mechanism with insights fed back into ongoing model iteration. As model capabilities advance, the products can take on more complex production tasks and continue to broaden their application scope. Backed by full-stack software and hardware capabilities and commercial validation in real-world scenarios, the company has delivered efficient, cost-effective commercialisation across multiple industrial scenarios, creating a durable competitive moat. Through the continuous deployment of the aforementioned technologies and industrial practices, the Company has been accumulating real production-line industrial data while maintaining high levels of R&D investment. According to the documents disclosed after its hearing, the Company amassed an unstructured, finely-annotated database sourced from real industrial scenarios, with a data volume exceeding 23TB and containing over 1.6 billion annotated data records. The database holds more than 800 independent intellectual property rights, including over 210 invention patents and 310 software copyrights. In 2024, the Company’s R&D project entitled “Development and Application of High-Speed, Self-Planning, Integrated Intelligent System for Defect Detection and Repair” has been jointly certified by the Ministry of Industry and Information Technology (MIIT) and the Ministry of Science and Technology (MOST) as having reached an “International Leading” level. The Company’s client base includes more than 25 Fortune Global 500 enterprises and leading manufacturers. Its business spans mainland China, Europe and the United States, and actively develops for the expansion into new overseas markets including Japan, Singapore and Malaysia. Financially, the Company’s revenue rose from RMB 434 million in 2023 to RMB 796 million in 2025, representing a compound annual growth rate (CAGR) of 35.4%. For the five months ended May 31, 2026, the Company recorded revenue of RMB 424 million, up 22.6% year on year. Revenue from its flagship EIIR products grew from RMB 114 million in 2023 to RMB 453 million in 2025, and reached RMB 260 million for the five months ended May 31, 2026. The EIIR products’ contribution to total revenue rose to 61.4% for the five months ended May 31, 2026, while gross margin further improved to 54.8%. In terms of profitability, the Company achieved profitable results for two consecutive years in 2024 and 2025. It recorded a full-year profit of approximately RMB 15.7 million in 2024 and approximately RMB 5.1 million in 2025, as higher R&D investment weighed on profit for the year. For the five months ended May 31, 2026, profit reached RMB 22.53 million, while adjusted net profit for the period—excluding the impact of share-based payments and listing expenses—amounted to RMB 33.84 million, up 41.5% year on year. In addition, following the turnaround to positive operating cash flow in 2025, the Company continued to record net cash inflow for the five months ended May 31, 2026, reflecting a substantive and sustained improvement in the cash-generating capability of its core business. The Company plans to primarily allocate the proceeds from this initial public offering to core technology R&D, focusing on iterating the Company’s end-to-end industrial VLA model, to continuously enhance the intelligence and performance of EIIR robots. In parallel, the Company will build localised overseas sales and service networks to deepenits global business footprint. In addition, the Company will allocate the proceeds for strategic investments and to foster an open, win-win application ecosystem through M&A, to expand manufacturing capacity to meet the growing order volumes. Looking ahead, Microintelligence will seize the opportunity presented by its HKEX listing to continue to strengthen its core capabilities in industrial embodied intelligence. As the global manufacturing sector continues to advance its intelligent transformation, the Company will focus on six key dimensions—deepening customer engagement, replicating success across new industries, expanding overseas, upgrading product value, strengthening software-hardware synergies, and driving continuous AI evolution—to bring EIIR solutions into more industrial scenarios. Together with industry partners, the Company will build an industrial embodied intelligence ecosystem and create long-term value for customers and the industry as a whole. ———————————————————————————————————————————————————————————— Indonesia Urges Greater Transparency in Cross-Border Copyright Royalty Governance Before 35 Countries 2026-10-12 · ACN Newswire · SaaS, Real estate, Industrial, Semiconductors https://www.acnnewswire.com/press-release/english/110748/ BALI, INDONESIA, Oct 12, 2026 - The Indonesian Government brought together delegates from 35 countries, international organizations, collective management organizations, creators, industry representatives, and experts to discuss cross-border copyright royalty governance in the digital era. The Global Dialogue on Cross-Border Copyright Royalty Governance in the Digital Era is being held in Bali from October 7 to 9, 2026, focusing on three key issues: transparency, accountability, and system interoperability. Doc. Participants at the Global Dialogue on Cross-Border Copyright Royalty Governance in the Digital Era. “Through the Global Dialogue on Cross-Border Copyright Royalty Governance in the Digital Era, we seek to promote common rules and systems so that copyright royalties, which are increasingly flowing across national borders, can be recorded, calculated, and distributed in a more transparent, accountable, and fair manner,” said Indonesian Minister of Law Supratman Andi Agta. The dialogue, initiated by the Indonesian Government through the Directorate General of Intellectual Property (DJKI), is being held from October 7 to 9, 2026. A total of 35 countries are actively participating in the forum, both online and in person, bringing together member states of the World Intellectual Property Organization (WIPO), two intergovernmental organizations, six collective management organizations and industry representatives, as well as experts, creators, and other stakeholders. “When creative works can be enjoyed across countries through digital platforms, royalty governance must also keep pace with these developments. Transparency, accountability, and interconnected systems are essential to ensure that creators’ economic rights are protected,” he said. Supratman said cross-border royalty issues go beyond copyright regulations, also requiring coordination among institutions and interoperable information systems. Against this backdrop, Indonesia is pushing for international dialogue to share experiences and practices across countries while respecting each nation’s legal framework. “This forum provides a platform for building a shared understanding and exploring practical cooperation. The goal is to ensure that creators and rights holders receive a fairer share of the economic benefits generated from the use of their works in the digital environment,” he said. Director General of Intellectual Property at the Ministry of Law Hermansyah Siregar said cross-border royalty issues are largely related to information exchange rather than copyright law itself. Incomplete ownership data, metadata, and differences in systems can complicate efforts to match the use of creative works with their respective rights holders. “Cross-border royalty friction rarely stems from disputes over copyright law. The main challenge is the exchange of information,” Hermansyah said According to Hermansyah, these challenges can arise at every stage, from work registration and usage reporting to metadata matching that links usage reports to rights holders. When unique identifiers for creative works are unavailable, royalty calculation, distribution, and reconciliation become increasingly complex. Data from the International Confederation of Societies of Authors and Composers (CISAC) showed that global royalty collections by creators’ rights organizations reached €13.97 billion (approximately Rp278 trillion) in 2024. Of that amount, €5.14 billion (approximately Rp103.16 trillion), or around 37 percent, came from digital uses. However, royalty collections remain concentrated in Europe and North America. The dialogue focuses on three key issues: transparency, accountability, and system interoperability. Transparency concerns the information available to rights holders; accountability covers responsibility at every stage of royalty management; while interoperability refers to the ability of different systems to exchange information reliably. At the international level, WIPO is also promoting good governance in collective management through publications and technical assistance, including guidance on good practices for collective management organizations and the TAG of Excellence initiative on transparency, accountability, and governance. These efforts are expected to be developed in collaboration with stakeholders, while applying professional rules and governance standards across member organizations. In Indonesia, the copyright framework is governed by Law No. 28 of 2014 on Copyright, which also establishes the national framework for collective management. In addition, Government Regulation No. 56 of 2021 on the Management of Copyright Royalties for Songs and/or Music provides a framework for the collection and distribution of royalties. The regulation also provides for a centralized database of songs and music managed by the Directorate General of Intellectual Property, as well as the Song and/or Music Information System (SILM), which supports the registration of works, usage data, and royalty distribution. According to Hermansyah, system interoperability is key to ensuring that royalties can flow from the use of a work through to its rights holder. Indonesia is also developing the Song and Music Data Center (PDLM) and information systems to establish connectivity with global royalty systems. “Interoperability simply requires systems that can communicate reliably. Many emerging markets currently lack the IT infrastructure needed to process large volumes of digital data,” he said. Indonesia has previously put forward a proposal on royalty governance, known as the Indonesian Proposal, at the World Intellectual Property Organization’s (WIPO) Standing Committee on Copyright and Related Rights (SCCR). Discussions on the proposal will continue at the SCCR, while the Global Dialogue in Bali provides a platform for sharing experiences and identifying practical solutions that can be developed on a voluntary basis. “Technology has democratized the distribution of music. Our task now is to ensure that our governance structures democratize remuneration for those works as well,” Hermansyah said. About DJKI The Directorate General of Intellectual Property (DJKI) is an echelon I unit under the Ministry of Law of the Republic of Indonesia, responsible for formulating and implementing policies in the field of intellectual property. DJKI provides registration and protection services for copyrights, patents, trademarks, industrial designs, geographical indications, integrated circuit layout designs, and trade secrets. Through digital transformation and strengthened public services, DJKI is committed to providing fast, transparent, and accountable legal protection for creators, inventors, and businesses across Indonesia. Directorate General of Intellectual Property (DJKI) – Public Relations Ministry of Law of the Republic of Indonesia DJKI Building Jl. HR. Rasuna Said Kav. 8–9, South Jakarta, Jakarta, Indonesia M. Wahdan H.J.Q. +62 878-3954-6154 ———————————————————————————————————————————————————————————— Introducing AMD Helion, Agentic AI Compute at Rack Scale 2026-10-12 · AMD · AI, Semiconductors https://newsroom.amd.com/news/open-rack-blueprint-scale-agentic-ai/ Introducing AMD Helion, Agentic AI Compute at Rack Scale ———————————————————————————————————————————————————————————— OCP 2026: AMD CEO Lisa Su Highlights Open Infrastructure for the Future of AI 2026-10-12 · AMD · AI, Semiconductors https://newsroom.amd.com/news/ocp-2026-amd-ceo-lisa-su-keynote-takeaways/ At the OCP keynote, AMD’s leader outlines how a broad AI portfolio will help build the next era of AI infrastructure. ———————————————————————————————————————————————————————————— AI Revenue Questions Pull Semiconductor Stocks Off October Highs 2026-10-10 · PR Newswire · Finance, AI, Semiconductors https://www.prnewswire.com/news-releases/ai-revenue-questions-pull-semiconductor-stocks-off-october-highs-302905067.html VANCOUVER, BC, Oct. 10, 2026 -- Stock Preachers News Commentary - Semiconductor equities began October on firm footing, with the iShares Semiconductor ETF advancing for five consecutive sessions and the sector's largest company reaching a record high, before retreating... ———————————————————————————————————————————————————————————— LGF Lab Gas Flow Launches Laboratory Ultra-High Purity Gas Delivery System and Gas Scrubber Systems for Scientific Research 2026-10-09 · GlobeNewswire · Energy, Biotech & pharma, Semiconductors https://www.globenewswire.com/news-release/2026/10/09/3378318/0/en/lgf-lab-gas-flow-launches-laboratory-ultra-high-purity-gas-delivery-system-and-gas-scrubber-systems-for-scientific-research.html LGF Lab Gas Flow, a manufacturer of laboratory infrastructure, has released its integrated Ultra-High Purity Gas Delivery Systems and Laboratory Gas Scrubber Systems. Designed for scientific research, biotechnology, and semiconductor fabrication, this equipment provides contamination control, operational safety, and environmental compliance. ———————————————————————————————————————————————————————————— Introducing on-demand CPU and memory profiling with flamegraphs for Workers and Durable Objects 2026-10-09 · Cloudflare · Semiconductors https://blog.cloudflare.com/workers-on-demand-profiling/ On-demand CPU and memory profiling for Cloudflare Workers and Durable Objects is now available. Now you can generate interactive flamegraphs directly in production to quickly track down memory leaks and performance bottlenecks. ———————————————————————————————————————————————————————————— Gorilla Advances U.S. Market Entry with Proposed 36 MW Data Centre Acquisition and 100+ MW AI Infrastructure Expansion Plan 2026-10-09 · Newsfile · Finance, AI, SaaS, Semiconductors https://www.newsfilecorp.com/release/317962/Gorilla-Advances-U.S.-Market-Entry-with-Proposed-36-MW-Data-Centre-Acquisition-and-100-MW-AI-Infrastructure-Expansion-Plan Proposed first US data-centre acquisition offers expansion potential to 36 MW of total site power capacity, marking Gorilla's planned entry into the US AI infrastructure market and establishing the foundation for a scalable domestic platform -         Broader US expansion strategy targets more than 100 MW of capacity over the next 12-18 months, combining owned infrastructure, customer-led GPU deployments and dedicated project financing to accelerate Gorilla's next phase of growth -London, United... ———————————————————————————————————————————————————————————— XMax to Acquire Hexa Creation, Developer of 1200V Vertical GaN Power Semiconductor Technology 2026-10-09 · GlobeNewswire · AI, Semiconductors https://www.globenewswire.com/news-release/2026/10/09/3378050/37029/en/xmax-to-acquire-hexa-creation-developer-of-1200v-vertical-gan-power-semiconductor-technology.html Transaction gives XMax footing in high-voltage GaN power technology aimed at AI data center power infrastructure Transaction gives XMax footing in high-voltage GaN power technology aimed at AI data center power infrastructure ———————————————————————————————————————————————————————————— United States stocks: S&P 500, Nasdaq end lower as unrefined rates leap, chip stocks weigh 2026-10-09 · Webnewswire · Finance, Semiconductors https://www.webnewswire.com/2026/10/09/united-states-stocks-sp-500-nasdaq-end-lower-as-unrefined-rates-leap-chip-stocks-weigh/ United States stocks dipped on Thursday as unrefined rates rose on a spike in Middle East stress and a cut in United States output that fed inflation and rate-hike worries, while semiconductor stocks plunged. According to initial information, the S&P 500 lost 36.07 points, or 0.46%, to end at 7,765.70 points, while the Nasdaq Composite […] ———————————————————————————————————————————————————————————— Broomkit lets Mac owners test every feature for three days before paying once 2026-10-08 · ePRNews · Semiconductors https://eprnews.com/broomkit-lets-mac-owners-test-every-feature-for-three-days-before-paying-once-688956/ DPR Software Labs OPC Private Limited, a software company registered in Bangalore, India, makes Broomkit, a disk cleaner and app uninstaller for Mac computers. A single developer designed the app and wrote it in Swift. It runs on macOS 14.0 or later and supports both Apple Silicon and Intel machines. Broomkit is a Mac cleaner […] ———————————————————————————————————————————————————————————— AI Chip Market to Reach $677.59 Billion by 2035 as Inference and Custom Silicon Reshape Global Compute Demand 2026-10-08 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/ai-chip-market-to-reach-677-59-billion-by-2035-as-inference-and-custom-silicon-reshape-global-compute-demand-302902998.html DC Market Insights forecasts 13.85% CAGR through 2035; GPUs hold 76.9% of 2025 market value while AI ASICs and SoCs expand at 19.61% annually LONDON, Oct. 8, 2026 -- The global AI Chip Market was valued at $185.26 billion in 2025 and is projected to reach $677.59 billion by... ———————————————————————————————————————————————————————————— TMX Group Equity Financing Statistics - September 2026 2026-10-08 · ACN Newswire · Finance, AI, Aerospace & defense, Semiconductors https://www.acnnewswire.com/press-release/english/110695/ TORONTO, ON, Oct 9, 2026 - TMX Group today announced its financing activity on Toronto Stock Exchange (TSX) and TSX Venture Exchange (TSXV) for September 2026. TSX welcomed 28 new issuers in September 2026, compared with 14 in the previous month and 29 in September 2025. The new listings were 27 exchange traded funds and one mining company. Total financings raised in September 2026 decreased 36% compared to the previous month, but were up 263% compared to September 2025. The total number of financings in September 2026 was 53, compared with 29 the previous month and 55 in September 2025. For additional data relating to the number of transactions billed for TSX, please click on the following link: https://www.tmx.com/resource/en/440. There were five new issuers on TSXV in September 2026, compared with three in the previous month and three in September 2025. The new listings were three mining companies, one financial services company and one life sciences company. Total financings raised in September 2026 increased 69% compared to the previous month, and were up 60% compared to September 2026. There were 88 financings in September 2026, compared with 77 in the previous month and 119 in September 2025. TMX Group consolidated trading statistics for September 2026 can be viewed at www.tmx.com. Toronto Stock Exchange  September 2026August 2026September 2025 Issuers Listed229622751,976 New Issuers Listed281429 IPOs271227 Graduates from TSXV131 Issues Listed2,9532,9302,630 IPO Financings Raised$139,734,076$356,716,460$59,050,000 Secondary Financings Raised$3,942,203,252$5,571,740,370$735,357,479 Supplemental Financings Raised$776,006,697$3,468,750$543,680,650 Total Financings Raised$4,857,944,025$5,931,925,580$1,338,088,129 Total Number of Financings532955 Market Cap Listed Issues$7,046,648,640,029$7,253,321,243,857$5,962,344,835,101   Year-to-date Statistics  20262025% change New Issuers Listed270225+20.0 IPOs230203+13.3 Graduates from TSXV197+171.4 IPO Financings Raised$2,793,238,974$1,532,755,260+82.2 Secondary Financings Raised$19,499,634,913$5,828,747,507+234.5 Supplemental Financings Raised$1,463,146,557$3,979,404,333-63.2 Total Financings Raised$23,756,020,444$11,340,907,100+109.5 Total Number of Financings442423+4.5 Market Cap Listed Issues$7,046,648,640,029$5,962,344,835,101+18.2   TSX Venture Exchange**  September 2026August 2026September 2025 Issuers Listed1,7041,7061,795 New Issuers Listed533 IPOs011 Graduates to TSX131 Issues Listed1,7601,7601,860 IPO Financings Raised$0$500,000$500,000 Secondary Financings Raised (1)$237,591,376$53,291,379$123,899,190 Supplemental Financings Raised$767,167,449$540,904,315$505,554,235 Total Financings Raised$1,004,758,825$594,695,694$629,953,425 Total Number of Financings8877119 Market Cap Listed Issues$132,590,780,228$142,429,746,905$131,725,663,502   Year-to-date Statistics  20262025% Change New Issuers Listed3627+33.3 IPOs116+83.3 Graduates to TSX197+171.4 IPO Financings Raised$24,159,272$13,734,685+75.9 Secondary Financings Raised (1)$2,146,093,763$1,080,336,575+98.7 Supplemental Financings Raised$7,000,449,034$4,364,785,594+60.4 Total Financings Raised$9,170,702,069$5,458,856,854+68.0 Total Number of Financings1,032950+8.6 Market Cap Listed Issues$132,590,780,228$131,725,663,502+0.7    **Includes NEX (not applicable to New Issuers Listed, IPOs and IPO Financings Raised) (1) Secondary financings include prospectus offerings on both a treasury and secondary basis The information contained in this media release is provided for informational purposes only and is not intended to provide investment, trading, financial or other advice. Comparative data has been updated to reflect known corrections. TMX Group welcomes the following companies that listed during September 2026: Toronto Stock Exchange Issuer NameCompany Symbol BMO Strategic Autocallable Income US Large Cap ETFZACU CI Munro International Growth Equity FundCMIG Corton Rosenberg Global Macro FundROSY Corton Theta Alpha FundTPUT Global X 1-10 Year Canadian Corporate Bond Index ETFGCIG Global X 3-10 Year U.S. Treasury Bond Index ETFTMTX Global X Artificial Intelligence Memory Index ETFDRAM Global X Asia Semiconductor Index ETFACHP Global X Canadian Universe Bond Index ETFAGGX Global X Korea KOSPI 200 Index ETFKORX Global X S&P/TSX Capped Composite Index ETFCNDC Manulife All-Equity ETF PortfolioMEQP Manulife All-Fixed Income ETF PortfolioMBND Manulife Corporate Bond FundCORB Manulife Smart International Dividend ETF - USDIDUV.U Middlefield Alternative Global Fixed Income FundMAGF Middlefield Global Multi-Sector Fixed Income FundMGFI NBI SmartData Enhanced Yield U.S. Equity FundNSUY NBI SmartData International Equity Covered Call FundNICC NBI SmartData U.S. Equity Covered Call FundNUCC NBI Target 2032 Investment Grade Bond FundNTGG NBI Ultra Short-Term Fixed Income FundNUST Ninepoint Enhanced Aerospace and Defense HighShares ETFEDHI Ninepoint Enhanced U.S. Equity HighShares ETFUSHI Santacruz Silver Mining Ltd.SCZ TD Q International Dividend ETFTQID Vanguard Global Core-Plus Bond ETFVCOR Westcourt Hamilton Yield Portfolio ETFWHYP   TSX Venture Exchange Issuer NameCompany Symbol Alex Metals Corp.ALX Crown Capital Partners Inc.CRWN Green Canada Uranium Corp.GCUC NAIA Relief Inc.NAIA Stardust Metal Corp.ZIGY   About TMX Group (TSX:X) TMX Group operates global markets, and builds digital communities and analytic solutions that facilitate the funding, growth and success of businesses, traders and investors. TMX Group's key operations include Toronto Stock Exchange, TSX Venture Exchange, TSX Alpha Exchange, TMX Australia Exchange, The Canadian Depository for Securities, Montréal Exchange, Canadian Derivatives Clearing Corporation, TSX Trust, TMX Trayport, TMX Datalinx, TMX VettaFi and TMX Newsfile, which provide listing markets, trading markets, clearing facilities, depository services, technology solutions, data products and other services to the global financial community. TMX Group is headquartered in Toronto and operates offices across North America (Montréal, Calgary, Vancouver and New York), as well as in key international markets including London, Singapore, Vienna and Sydney. For more information about TMX Group, visit www.tmx.com. Follow TMX Group on X: @TMXGroup. For more information, please contact: Catherine Kee Head of Media Relations TMX Group 416-671-1704 catherine.kee@tmx.com ———————————————————————————————————————————————————————————— Broadcom Redefines AI Infrastructure with Industry-Leading Networking Innovations at 2026 OCP Global Summit 2026-10-08 · GlobeNewswire · AI, Semiconductors https://www.globenewswire.com/news-release/2026/10/08/3377533/19933/en/broadcom-redefines-ai-infrastructure-with-industry-leading-networking-innovations-at-2026-ocp-global-summit.html Company to Highlight OCP Rack-Based Innovations Enabling Scale-Up, Scale-Out, and Scale-Across Networks Across AI Clusters Company to Highlight OCP Rack-Based Innovations Enabling Scale-Up, Scale-Out, and Scale-Across Networks Across AI Clusters ———————————————————————————————————————————————————————————— Marvell to Showcase Open AI Infrastructure Solutions at OCP Global Summit 2026 2026-10-08 · Marvell Technology · Finance, AI, Semiconductors, Cloud & data centers https://investor.marvell.com/news-events/press-releases/detail/1036/marvell-to-showcase-open-ai-infrastructure-solutions-at-ocp-global-summit-2026 Marvell Powers Next-generation AI Data Center Infrastructure with Switching, Interconnect, Memory and Storage Solutions Across Every Distance SANTA CLARA, Calif.--Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its comprehensive portfolio of AI data center infrastructure solutions at OCP Global Summit 2026, October 12 ———————————————————————————————————————————————————————————— GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging 2026-10-08 · GlobeNewswire · AI, Semiconductors https://www.globenewswire.com/news-release/2026/10/08/3377242/0/en/globalfoundries-reaches-agreement-to-establish-u-s-based-supply-of-silicon-interposers-for-advanced-ai-packaging.html Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies ———————————————————————————————————————————————————————————— MGI Tech Launches Stereo-seq OMNI Large Chip Design for FFPE at ESSB 2026 2026-10-08 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/mgi-tech-launches-stereo-seq-omni-large-chip-design-for-ffpe-at-essb-2026-302902249.html New format will help researchers study larger tissue areas while preserving spatial context SITGES, Spain, Oct. 8, 2026 -- MGI Tech Co., Ltd. (MGI), a company committed to developing core tools and technologies that drive innovation in life science, launched its Stereo-seq... ———————————————————————————————————————————————————————————— Driven by Strong Growth in New AI Business, AAC Technologies Named in TIME's World's Best Companies 2026 2026-10-08 · ACN Newswire · Finance, AI, Automotive, Industrial, Semiconductors, Sustainability https://www.acnnewswire.com/press-release/english/110677/ Hong Kong, Oct 8, 2026 - Recently, TIME magazine, together with global data provider Statista, officially released the 2026 ranking of the World’s Best Companies. AAC Technologies Holdings Inc. stands out as the sole Hong Kong-listed technology manufacturer to be featured on this year’s list.   TIME’s World’s Best Companies ranking is one of the world’s most credible comprehensive corporate evaluations. The 2026 edition selected 1,000 top performing enterprises globally, with weighted overall scores based on three core dimensions: employee satisfaction, revenue growth, and transparency in sustainable development. Notably, AAC Technologies received the highest rating of “Very High” for its standout revenue growth performance, and was shortlisted in the Information Technology & Electronic Hardware category. Findings from this year’s ranking demonstrate that the impact  of the AI economy has long extended beyond chipmakers into physical industries like advanced manufacturing. In recent years, AAC Technologies has accelerated its strategic transition into a provider of AI perception infrastructure. The company has established a dualtrack business layout spanning computingpowerside and enddevice segments, and developed a new AI business matrix including liquidcooled Coolant Distribution Units (CDUs) for servers, AR optical waveguides and optical engines, acoustic solutions for automotive smart cockpits, actuators for humanoid robots, and CPO microlens arrays for optical communications. These emerging segments have become the core driver of the company’s revenue growth and are poised to sustain longterm earnings growth. According to management guidance from AAC Technologies, the total revenue generated by the company’s new AIrelated businesses is expected to reach RMB 8 billion to RMB 9 billion by 2027. Among these segments, thermal management is the largest and most certain growth pillar. The company’s liquidcooled server CDU products have achieved global delivery, with shipment volume ranking among the top three domestic suppliers. The revenue scale of Vapor Chamber (VC) and active thermal management business is projected to hit the RMB 5 billion mark. The newly launched iPhone Duo and iPhone 18 Pro series from Apple adopt Vapor Chamber (VC) heat spreaders supplied by AAC Technologies. ———————————————————————————————————————————————————————————— AI's Next Infrastructure Challenge Is Power: DIGITIMES Examines the Shift Toward 800VDC Data Centers 2026-10-08 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/ais-next-infrastructure-challenge-is-power-digitimes-examines-the-shift-toward-800vdc-data-centers-302899474.html TAIPEI, Oct. 7, 2026 -- As AI computing continues to scale, the infrastructure challenge is moving beyond processors. Rising rack-level power requirements are forcing data center operators, server makers, and semiconductor suppliers to rethink how electricity is delivered... ———————————————————————————————————————————————————————————— AMD CEO Lisa Su Receives National Medal of Science 2026-10-08 · AMD · Semiconductors https://newsroom.amd.com/news/lisa-su-national-medal-science/ In recognition of her role advancing computing at AMD, the company’s leader is honored with the nation’s highest recognition for scientists and engineers. ———————————————————————————————————————————————————————————— Mobile Edge Computing - Global Strategic Business Report: Capitalize on 29% CAGR to Secure the US$6.9 Billion 2030 Market as Cisco, AT&T, Broadcom, ADLINK, and HPE Reshape Competition 2026-10-07 · GlobeNewswire · Finance, Telecom, Semiconductors https://www.globenewswire.com/news-release/2026/10/07/3376888/28124/en/mobile-edge-computing-global-strategic-business-report-capitalize-on-29-cagr-to-secure-the-us-6-9-billion-2030-market-as-cisco-at-t-broadcom-adlink-and-hpe-reshape-competition.html Boost ROI with MEC by cutting data transmission costs, accelerating processing, improving operational efficiency, and unlocking low-latency services and new revenue streams. Boost ROI with MEC by cutting data transmission costs, accelerating processing, improving operational efficiency, and unlocking low-latency services and new revenue streams. ———————————————————————————————————————————————————————————— Vishay Intertechnology to Showcase Solutions for Next-Generation Battery and EV Systems at The Battery Show 2026 2026-10-07 · GlobeNewswire · Energy, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/10/07/3376646/0/en/vishay-intertechnology-to-showcase-solutions-for-next-generation-battery-and-ev-systems-at-the-battery-show-2026.html Company to Highlight Passive and Semiconductor Technologies and Reference Designs for Battery Management, Protection, and Power Conversion Company to Highlight Passive and Semiconductor Technologies and Reference Designs for Battery Management, Protection, and Power Conversion ———————————————————————————————————————————————————————————— HPE accelerates enterprise AI innovation with next-generation AMD CPU-powered servers 2026-10-07 · Hewlett Packard Enterprise · Finance, AI, Semiconductors https://www.hpe.com/us/en/newsroom/press-release/2026/10/hpe-accelerates-enterprise-ai-innovation-with-next-generation-amd-cpu-powered-servers.html HOUSTON – Oct. 7, 2026 – HPE (NYSE: HPE) today announced the first four of its HPE ProLiant Gen13 Servers powered by 6th Generation AMD EPYC™ Server processors. The new systems expand compute, memory, and I/O capabilities to help enterprises accelerate agentic AI and inference, analytics, virtualization, simulation, and modeling while strengthening security, simplifying operations, and providing reliability across distributed IT environments. As AI systems evolve from generating insights to taking autonomous action, trust becomes a prerequisite for scale. McKinsey’s 2026 AI Trust Maturity S... ———————————————————————————————————————————————————————————— MintNeuro raises $5 million to scale purpose-built chip platform for neural devices and brain-computer interfaces 2026-10-07 · PR Newswire · Finance, SaaS, Semiconductors https://www.prnewswire.com/news-releases/mintneuro-raises-5-million-to-scale-purpose-built-chip-platform-for-neural-devices-and-brain-computer-interfaces-302900235.html Funding from European and US investors will accelerate product launch, partner adoption and international expansion LONDON, Oct. 7, 2026 -- MintNeuro, a semiconductor company building specialised chips for neural devices from implants to wearables, today announces a $5... ———————————————————————————————————————————————————————————— Global Power Discrete Market Size, Share, Trends, and Forecast (2021 - 2034) | Market to Reach US$ 24.46 Billion at 6.4% CAGR, Fueled by SiC, GaN, EVs, and Data Centers 2026-10-07 · GlobeNewswire · Energy, Telecom, Semiconductors https://www.globenewswire.com/news-release/2026/10/07/3376247/28124/en/global-power-discrete-market-size-share-trends-and-forecast-2021-2034-market-to-reach-us-24-46-billion-at-6-4-cagr-fueled-by-sic-gan-evs-and-data-centers.html Capitalize on EVs, 5G, IoT and Industry 4.0 by prioritizing energy-efficient SiC/GaN solutions and Asia Pacific’s robust semiconductor ecosystem. Capitalize on EVs, 5G, IoT and Industry 4.0 by prioritizing energy-efficient SiC/GaN solutions and Asia Pacific’s robust semiconductor ecosystem. ———————————————————————————————————————————————————————————— NX Group and JAL Launch Intra-Asia/North America-Asia Transport Partnership 2026-10-07 · PR Newswire · AI, Travel, Aerospace & defense, Logistics, Semiconductors https://www.prnewswire.com/news-releases/nx-group-and-jal-launch-intra-asianorth-america-asia-transport-partnership-302900619.html - Building Transport Network with Large Freighter Aircraft to Meet Growing Demand for AI- and Semiconductor-related Cargo Transportation - TOKYO, Oct. 7, 2026 -- NIPPON EXPRESS HOLDINGS, INC. ("NX Group") and Japan Airlines Co., Ltd. ("JAL") have launched a transport... ———————————————————————————————————————————————————————————— US Advanced Semiconductor Packaging Market - Size, Strategic Insights, and Forecasts, 2026-2031 | AI, 5G, CHIPS Act, and Reshoring Drive Growth to USD 11.7 Billion 2026-10-06 · GlobeNewswire · AI, Automotive, Telecom, Logistics, Semiconductors https://www.globenewswire.com/news-release/2026/10/06/3375909/28124/en/us-advanced-semiconductor-packaging-market-size-strategic-insights-and-forecasts-2026-2031-ai-5g-chips-act-and-reshoring-drive-growth-to-usd-11-7-billion.html CHIPS Act incentives, reshoring, and investment in advanced packaging help capture AI, 5G, and automotive demand while reducing supply chain risk CHIPS Act incentives, reshoring, and investment in advanced packaging help capture AI, 5G, and automotive demand while reducing supply chain risk ———————————————————————————————————————————————————————————— U.S. Semiconductor Photolithography Equipment Market - Strategic Forecast, 2026-2031 | AI Chips, Fab Onshoring, and High-NA EUV Propel Growth to USD 22.6 Billion 2026-10-06 · GlobeNewswire · Finance, AI, Semiconductors https://www.globenewswire.com/news-release/2026/10/06/3375908/28124/en/u-s-semiconductor-photolithography-equipment-market-strategic-forecast-2026-2031-ai-chips-fab-onshoring-and-high-na-euv-propel-growth-to-usd-22-6-billion.html Federal incentives, AI chip demand and domestic fab expansion strengthen EUV/DUV investment, while competitive insights guide market entry, capacity planning and new revenue opportunities. Federal incentives, AI chip demand and domestic fab expansion strengthen EUV/DUV investment, while competitive insights guide market entry, capacity planning and new revenue opportunities. ———————————————————————————————————————————————————————————— USA Semiconductor Foundry Market - Strategic Insights and Forecasts, 2026-2031 | AI, Automotive, and Domestic Fab Investments Drive Growth to $23.9 Billion at a 7.8% CAGR 2026-10-06 · GlobeNewswire · AI, Automotive, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/10/06/3375907/28124/en/usa-semiconductor-foundry-market-strategic-insights-and-forecasts-2026-2031-ai-automotive-and-domestic-fab-investments-drive-growth-to-23-9-billion-at-a-7-8-cagr.html Capitalize on policy incentives, domestic fab expansion, mature-node demand, advanced packaging and partnerships serving AI, automotive, defense and industrial markets Capitalize on policy incentives, domestic fab expansion, mature-node demand, advanced packaging and partnerships serving AI, automotive, defense and industrial markets ———————————————————————————————————————————————————————————— 51AIpower Launches Shared AI Infrastructure Plans, Opening the AI Token Economy to Individuals 2026-10-06 · iCrowdNewswire · Crypto, AI, Semiconductors https://icrowdnewswire.com/2026/10/06/51aipower-launches-shared-ai-infrastructure-plans-opening-the-ai-token-economy-to-individuals/ Do you need coding skills, AI stocks, or your own business to make money with AI? 51AIpower is introducing shared AI infrastructure participation plans that focus on the electricity and GPU computing resources behind AI services. Through its Power Plans, […] ———————————————————————————————————————————————————————————— Anticloud Reports $0.013 Electricity Cost in PAX v52 AI Research Benchmark 2026-10-06 · Newsfile · AI, Semiconductors https://www.newsfilecorp.com/release/317270/Anticloud-Reports-0.013-Electricity-Cost-in-PAX-v52-AI-Research-Benchmark Dubai, United Arab Emirates--(October 6, 2026) - Anticloud FZ LLE, a Dubai-based developer of sovereign AI infrastructure, has reported results from a PAX v52 benchmark in which its 27B-parameter model generated structured research frameworks for 20 open problems spanning mathematics, physics, computer science, biology and cosmology.According to Anticloud's published benchmark results, the test generated approximately 24,000 tokens of output during a run on a T4 GPU. The company... ———————————————————————————————————————————————————————————— Smart Payment Association Warns of Growing Supply Chain Pressures on Payment Card Industry 2026-10-06 · PR Newswire · AI, Logistics, Semiconductors https://www.prnewswire.com/news-releases/smart-payment-association-warns-of-growing-supply-chain-pressures-on-payment-card-industry-302898271.html AI-driven semiconductor demand, geopolitical instability and rising raw material costs threaten chip availability for the global payment card sector MUNICH, Oct. 6, 2026 -- The Smart Payment Association (SPA), the trade body of the cards and mobile payment industry, today... ———————————————————————————————————————————————————————————— DIGITIMES Expands Global Tech Supply Chain Intelligence with Redesigned Intelligence Hub and New News Feed API 2026-10-06 · PR Newswire · AI, SaaS, Logistics, Semiconductors https://www.prnewswire.com/news-releases/digitimes-expands-global-tech-supply-chain-intelligence-with-redesigned-intelligence-hub-and-new-news-feed-api-302898219.html TAIPEI, Oct. 5, 2026 -- The global technology supply chain is moving faster than ever. From semiconductor capacity shifts and changes in the AI chip supply chain to export controls and geopolitical developments, enterprises face a challenge that goes beyond information... ———————————————————————————————————————————————————————————— AMD to Report Fiscal Third Quarter 2026 Financial Results 2026-10-06 · AMD · Semiconductors https://newsroom.amd.com/news/earnings-date-3q-2026/ AMD to Report Fiscal Third Quarter 2026 Financial Results ———————————————————————————————————————————————————————————— Skyworks Announces Expiration and Final Results of Exchange Offers for Qorvo’s Senior Notes due 2029 and 2031 2026-10-05 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/10/05/3375060/0/en/skyworks-announces-expiration-and-final-results-of-exchange-offers-for-qorvo-s-senior-notes-due-2029-and-2031.html IRVINE, Calif., Oct. 05, 2026 -- Skyworks Solutions, Inc. (Nasdaq: SWKS) (“Skyworks”), a leading developer, manufacturer and provider of analog and mixed-signal semiconductors and solutions for numerous applications, today announced the expiration and final results of its previously announced offers to holders of Qorvo Notes (as defined herein) to exchange (the “Exchange Offers”) any and all outstanding 4.375% Senior Notes due 2029 (the “2029 Qorvo Notes”) and any and all outstanding 3.375% Senior Notes due 2031 (the “2031 Qorvo Notes” and, together with the 2029 Qorvo Notes, the “Qorvo Notes”) issued by Qorvo, Inc. (“Qorvo”) as set forth in the table below for (1) with respect to the 2029 Qorvo Notes, up to $850,000,000 aggregate principal amount of new 4.375% Senior Notes due 2029 (the “New 2029 Skyworks Notes”) issued by Skyworks and (2) with respect to the 2031 Qorvo Notes, up to $700,000,000 aggregate principal amount of new 3.375% Senior Notes due 2031 (the “New 2031 Skyworks Notes”) issued by Skyworks. ———————————————————————————————————————————————————————————— AM Intelligence Expands NVIDIA Vera Rubin AI Factory Buildout in India and Malaysia 2026-10-05 · Business Wire · AI, Industrial, Semiconductors https://finance.yahoo.com/technology/ai/articles/am-intelligence-expands-nvidia-vera-181600397.html HYDERABAD, India, October 05, 2026--AM Intelligence today announced two firm and binding orders for 20,000 NVIDIA Rubin GPUs to be deployed as NVIDIA Vera Rubin NVL72 rack-scale systems. ———————————————————————————————————————————————————————————— Huawei and Qualcomm Announce Broad Patent License Agreement 2026-10-05 · Huawei · Semiconductors https://www.huawei.com/en/news/2026/10/qualcomm-broad-patent-agreement Huawei and Qualcomm today announced a multi-year, broad patent license agreement that includes cross licenses to the companies’ patent portfolios across a range of technology fields ———————————————————————————————————————————————————————————— AMD Helios: Designing and Building the Future of AI Infrastructure (Videos) 2026-10-05 · AMD · AI, Semiconductors https://newsroom.amd.com/news/amd-helios-designing-building-future-ai-infrastructure/ Watch behind-the-scenes accounts of what it takes to engineer every detail of the AMD Helios rackscale solution. ———————————————————————————————————————————————————————————— E&R Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services 2026-10-04 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/er-engineering-to-launch-new-malaysia-plant-expanding-global-packaging-materials-production-and-localized-services-302897736.html KAOHSIUNG, Oct. 4, 2026 -- E&R Engineering Corp., (TWSE: 8027) an international provider of semiconductor packaging equipment, announced today the upcoming grand opening of its new Malaysian subsidiary—E&R SEMICONDUCTOR (MALAYSIA) SDN. BHD.—at the Melaka Free Trade Zone on... ———————————————————————————————————————————————————————————— Central New Energy (01735.HK) Receives MSCI Provisional ESG Rating of BB Under Semiconductor & Semiconductor Equipment Industry Model 2026-10-04 · ACN Newswire · Energy, Semiconductors, Sustainability https://www.acnnewswire.com/press-release/english/110561/ Hong Kong, Oct 4, 2026 - Central New Energy Holding Group Limited (01735.HK) announced that MSCI Sustainability & Climate has assigned the Company a Provisional ESG Rating of BB, with a rating action date of September 23, 2026. According to the MSCI report, the Company was assessed under the Semiconductors & Semiconductor Equipment ESG Rating model (version 5.0.2), recording an industry-adjusted score of 4.14 and a weighted-average Key Issue score of 4.8 out of 10. Across the three pillars, the Company scored 4.8 for Environmental, 2.3 for Social, and 7.0 for Governance, with governance serving as a key pillar of support. The MSCI BB rating demonstrates that the Company possesses a mature ESG risk-management framework and robust resilience against long-term sustainability risks. Achieving this rating reinforces the Company's investability and enhances its standing among global institutional investors and ESG-focused funds, providing strong momentum for future capital market access, financing optimization, and long-term expansion. The Company said it will continue to enhance its ESG management, disclosure, and operational practices to support business development and sustainable value creation. The rating is provisional and does not constitute a credit rating, securities research report, or investment advice. ———————————————————————————————————————————————————————————— What Is a Token in AI? 51AIpower Explores How Individuals Can Participate in AI Infrastructure 2026-10-03 · GlobeNewswire · Crypto, AI, SaaS, Semiconductors https://www.globenewswire.com/news-release/2026/10/03/3374108/0/en/what-is-a-token-in-ai-51aipower-explores-how-individuals-can-participate-in-ai-infrastructure.html From writing with ChatGPT to creating videos and selling digital products, discussions about how to make money with AI often begin with using tools to deliver services. But what other participation options are worth understanding for people who do not code, want to avoid buying GPUs, or lack the time for ongoing freelance work? Starting with AI tokens, 51AIpower examines the electricity and computing behind AI applications and how individuals can participate in infrastructure through platform plans. From writing with ChatGPT to creating videos and selling digital products, discussions about how to make money with AI often begin with using tools to deliver services. But what other participation options are worth understanding for people who do not code, want to avoid buying GPUs, or lack the time for ongoing freelance work? Starting with AI tokens, 51AIpower examines the electricity and computing behind AI applications and how individuals can participate in infrastructure through platform plans. ———————————————————————————————————————————————————————————— Middle East, Africa, and Latin America GPU as a Service (GPUaaS) Market Size, Share, Trends, and Forecast, 2025-2031 | Sovereign AI and Cloud Growth Unlock $6.62 Billion by 2031 2026-10-02 · GlobeNewswire · AI, SaaS, Semiconductors https://www.globenewswire.com/news-release/2026/10/02/3373606/28124/en/middle-east-africa-and-latin-america-gpu-as-a-service-gpuaas-market-size-share-trends-and-forecast-2025-2031-sovereign-ai-and-cloud-growth-unlock-6-62-billion-by-2031.html Pay-per-use GPUaaS cuts upfront costs and speeds innovation, while subscription and IaaS models lead adoption amid sovereign AI and cloud expansion in the UAE and Brazil. Pay-per-use GPUaaS cuts upfront costs and speeds innovation, while subscription and IaaS models lead adoption amid sovereign AI and cloud expansion in the UAE and Brazil. ———————————————————————————————————————————————————————————— Silvaco CEO Dr. Walden “Wally” Rhines Inducted into the National Academy of Engineering 2026-10-02 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/10/02/3373526/0/en/silvaco-ceo-dr-walden-wally-rhines-inducted-into-the-national-academy-of-engineering.html Prestigious honor recognizes co-invention of the blue-light-emitting diode and a lifetime of leadership in the semiconductor industry Prestigious honor recognizes co-invention of the blue-light-emitting diode and a lifetime of leadership in the semiconductor industry ———————————————————————————————————————————————————————————— How NVIDIA GPUs Help Accelerate OpenAI’s GPT-6 Astra Ultrafast 2026-10-01 · NVIDIA · Crypto, AI, SaaS, Semiconductors https://blogs.nvidia.com/blog/gpus-openai-gpt-6-astra-ultrafast/ GPT-6 Astra Ultrafast, running on NVIDIA Blackwell GPUs, is available now in the OpenAI API and to eligible ChatGPT Work and Codex users.  Accelerated by inference optimizations through OpenAI’s models that tap into the capabilities of the NVIDIA Blackwell architecture, Ultrafast offers up to 8x faster token generation than the Astra Standard mode. For developers, […] ———————————————————————————————————————————————————————————— Infineon opens new backend manufacturing hub in Thailand adding resilient capacity for future growth 2026-10-01 · PR Newswire · Industrial, Semiconductors https://www.prnewswire.com/news-releases/infineon-opens-new-backend-manufacturing-hub-in-thailand-adding-resilient-capacity-for-future-growth-302895721.html New backend manufacturing hub strengthens and further diversifies Infineon's global production network Strategic investment reinforces Thailand's growing semiconductor ecosystem and talent development, creating up to 1,000 highly skilled jobs Designed for phased expansion, Bangkok has the... ———————————————————————————————————————————————————————————— SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program 2026-10-01 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/semifive-signs-turnkey-contract-with-mobilint-to-develop-robotics-ai-chip-under-k-on-device-ai-semiconductor-program-302895266.html Accelerates commercialization of robotics AI chip through end-to-end "Spec Hand-off" development Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-S Expands applications beyond data center, HPC and edge AI into Physical AI, diversifying... ———————————————————————————————————————————————————————————— AMD Sampling Versal AI Core Adaptive SoC in Enhanced Space-Grade Package for the Most Demanding Missions 2026-10-01 · AMD · AI, Semiconductors https://newsroom.amd.com/news/amd-sampling-versal-ai-core-adaptive-soc/ New package will be Class Y qualified for the highest level of reliability assurance, and is specifically designed for extended space missions lasting up to 15 years. ———————————————————————————————————————————————————————————— Skyworks Announces Extension of Expiration Date of Exchange Offers for Qorvo’s Senior Notes due 2029 and 2031 2026-09-30 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/09/30/3372469/0/en/skyworks-announces-extension-of-expiration-date-of-exchange-offers-for-qorvo-s-senior-notes-due-2029-and-2031.html IRVINE, Calif., Sept. 30, 2026 -- Skyworks Solutions, Inc. (Nasdaq: SWKS) (“Skyworks”), a leading developer, manufacturer and provider of analog and mixed-signal semiconductors and solutions for numerous applications, today announced that it has extended the expiration date of its previously announced offers to holders of Qorvo Notes (as defined herein) to exchange (the “Exchange Offers”) any and all outstanding 4.375% Senior Notes due 2029 (the “2029 Qorvo Notes”) and any and all outstanding 3.375% Senior Notes due 2031 (the “2031 Qorvo Notes” and, together with the 2029 Qorvo Notes, the “Qorvo Notes”) issued by Qorvo, Inc. (“Qorvo”) as set forth in the table below for (1) with respect to the 2029 Qorvo Notes, up to $850,000,000 aggregate principal amount of new 4.375% Senior Notes due 2029 (the “New 2029 Skyworks Notes”) issued by Skyworks and (2) with respect to the 2031 Qorvo Notes, up to $700,000,000 aggregate principal amount of new 3.375% Senior Notes due 2031 (together with the New 2029 Skyworks Notes, the “New Skyworks Notes”) issued by Skyworks. ———————————————————————————————————————————————————————————— HPE secures its first AMD Helios order in $1.2 billion deal with Vultr 2026-09-30 · Hewlett Packard Enterprise · Finance, AI, SaaS, Semiconductors, Software & IT, Cloud & data centers https://www.hpe.com/us/en/newsroom/press-release/2026/09/hpe-secures-its-first-amd-helios-order-in-12-billion-deal-with-vultr.html SUNNYVALE, Calif. – Sept. 30, 2026 – HPE (NYSE: HPE) today announced a $1.2 billion order from Vultr, the world’s largest privately-held cloud infrastructure company, to deploy AMD Helios™ AI Rack by HPE systems at Vultr’s cloud data center locations in the United States. It is HPE's first order for the new AMD Helios system, which features purpose-built HPE Networking scale-up switching and software. HPE and AMD will support Vultr’s effort to meet service provider and enterprise demand for model training and inferencing workloads in their AI data centers. “AI is driving the largest infrast... ———————————————————————————————————————————————————————————— Arasan to demonstrate the industry's first MIPI SWI3S™ IP at the MIPI Member meet in Taipei 2026-09-30 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/arasan-to-demonstrate-the-industrys-first-mipi-swi3s-ip-at-the-mipi-member-meet-in-taipei-302891552.html Arasan Chip Systems, announces that it will demonstrate the industries first MIPI SWI3S™ Manager IP and Peripheral IP on Oct 21, 2026 in Taipei SAN JOSE, Calif., Sept. 30, 2026 -- Arasan Chip Systems a leading provider of Semiconductor IP Cores for Mobile and Automobile SoC's... ———————————————————————————————————————————————————————————— AMD Brings the Power of Agentic AI to Embedded Design and Development Cycle 2026-09-30 · AMD · AI, Semiconductors, Software & IT https://newsroom.amd.com/news/amd-ross-agentic-ai-embedded-design-development/ AMD Ross agentic AI assistant spans software, silicon and board design to dramatically accelerate embedded system design, optimization, debug and deployment compared to typical development life cycles. ———————————————————————————————————————————————————————————— Huatai-PCG HKEX KRX Semiconductor Index ETF Listed on HKEX 2026-09-29 · ACN Newswire · Finance, AI, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/110484/ HONG KONG, Sept 29, 2026 - On 28 September 2026, the Huatai-PCG HKEX KRX Semiconductor Index ETF (Stock Code: 3569, HKD counter), issued by Huatai-PCG Asset Management Limited (Huatai-PCG), was officially listed on the Stock Exchange of Hong Kong.   The fund tracks the HKEX KRX Semiconductor Index, the first co-branded index jointly developed by Hong Kong Exchanges and Clearing Limited (HKEX) and Korea Exchange (KRX). The index brings together leading semiconductor-related companies listed in Hong Kong, China and South Korea, providing investors with a convenient investment tool to participate in Asia's semiconductor value chain. As one of the first exchange traded funds (ETFs) tracking this cross-market index, the product enables investors to access investment opportunities across two key semiconductor markets—Hong Kong, China and South Korea—through a single trading instrument.   Hong Kong Exchanges and Clearing Limited (HKEX) HKEX Chief Executive Officer, Bonnie Y Chan, said: "We are delighted to welcome the first ETFs tracking HKEX’s cross-market index series. Their launch marks an important step in our efforts to connect Hong Kong with international markets by working with exchanges and partners across Asia and beyond to broaden investor choice. By bringing together opportunities across different markets and sectors, these benchmarks respond to investors' growing demand for diversification and reinforce Hong Kong's role as a gateway connecting the Chinese Mainland with the rest of the world." Huatai-PB Fund Management Co., Ltd. (Huatai-PB) The General Manager of Huatai-PB and Director of Huatai-PCG, Ms. CUI Chun, said: “The Huatai-PCG HKEX KRX Semiconductor Index ETF links the core supply chain of China’s emerging wafer fabrication players with South Korea’s global memory chip leaders, capturing upside from the AI-driven semiconductor upcycle. Its 60/40 structural allocation lays the groundwork for potential inclusion in the Southbound ETF Connect. A dedicated offering from Huatai-PCG thanks to HKEX and KRX’s great support, it is tailored to meet the asset allocation needs of investors in Hong Kong and Mainland China.”   Investment Highlights - Cross-market exposure: A single fund spanning leading semiconductor companies across both Hong Kong, China and South Korea, mitigating concentration risk in any one market; - Aligned with a key sector theme: Focused on the semiconductor industry, consistent with broader global technology and artificial intelligence trends; - Co-branded index backing: Tracking the flagship co-branded index developed jointly by HKEX and KRX, with a clear and established benchmark methodology. About Huatai-PCG Huatai-PCG Asset Management Co., Ltd. (“Huatai-PCG”) is registered in Hong Kong, China and is a wholly-owned subsidiary of Huatai-PB Fund Management Co., Ltd. (“Huatai-PB”). The business development of Huatai-PCG has gained strong support from both major shareholders of the parent company, Huatai Securities Co., Ltd. and Pacific Century Group. The company obtained approval from the China Securities Regulatory Commission on November 29, 2024, and obtained licenses No. 1 (securities trading), No. 4 (providing advice on securities), and No. 9 (providing asset management) issued by the Hong Kong Securities and Futures Commission (SFC) on September 12, 2025. As one of the first domestic ETF managers, the parent company Huatai-PB Fund has nearly 20 years of experience in ETF businesses, especially in managing the innovative cross-border index product Huatai-PB China Korea Semiconductor ETF (513310). It has accumulated rich investment management experience in cross market investment, index tracking, and product operation, fully empowering Huatai-PCG to provide investors with more diversified investment choices in the era of global asset allocation. For Media Inquiries: Huatai-PCG Asset Management Co., Ltd. Email: service@huatai-pb.com.hk Official website: https://www.huatai-pb.com.hk ———————————————————————————————————————————————————————————— Four major tech fairs open in October attracting some 6,200 exhibitors from around the world 2026-09-29 · ACN Newswire · Finance, AI, SaaS, Healthcare, Energy, Retail, Gaming, Media, Education, Food & drink, Fashion & luxury, Sports, Industrial, Aerospace & defense, Logistics, Biotech & pharma, Semiconductors, Sustainability https://www.acnnewswire.com/press-release/english/110467/ HONG KONG, Sept 29, 2026 - The Hong Kong Trade Development Council (HKTDC) will stage flagship fairs for electronics and lighting in October, including the 46th Hong Kong Electronics Fair (Autumn Edition) and the 29th electronicAsia, which will be held concurrently at the Hong Kong Convention and Exhibition Centre (HKCEC) from 13 to 16 October; the 11th Hong Kong International Outdoor and Tech Light Expo, taking place at AsiaWorld-Expo from 26 to 29 October; and the 28th Hong Kong International Lighting Fair (Autumn Edition), to be held at the HKCEC from 27 to 30 October. The four fairs are expected to attract some 6,200 exhibitors from 28 countries and regions, showcasing cutting-edge technologies and solutions spanning consumer electronics, artificial intelligence (AI), robotics, future industries, smart lighting and smart city applications. The fairs will highlight the latest achievements in innovation and technology, reflecting global trends in industrial upgrading and digital transformation. At a press conference held today to introduce the four fairs, HKTDC Associate Executive Director Silas Chu said: “The Hong Kong SAR Government's latest Policy Address and first Five-Year Plan underscore the importance of consolidating and enhancing Hong Kong's status as an international trade centre, expediting the city's development into an international innovation and technology (I&T) centre and advancing the adoption and development of AI. In support of these strategic directions, the HKTDC is introducing several new elements at this year’s October fairs, including a new Future Industries Zone at the Autumn Electronics Fair, expanded showcases and business-matching opportunities for AI and robotics technologies to help companies connect with funding, talent, technology and international markets. A dedicated GoGlobal Connect Zone will also be set up at the venue to provide advisory services for businesses, encouraging more Chinese Mainland enterprises to leverage Hong Kong as a platform for expanding into international markets. The two lighting fairs, meanwhile, will focus on key industry trends related to smart connectivity, healthy living, immersive spatial experiences and sustainability.” Presenting highlights of the Autumn Electronics Fair, electronicAsia, the Autumn Lighting Fair and the International Outdoor and Tech Light Expo at today's press conference are: DDD (centre), Associate Executive Director of the HKTDC; Steve Chuang (left), Chairman of the HKTDC Electronics/Electrical Appliances Industries Advisory Committee; and Alvin Lee (right), Chairman of the Hong Kong Electronics & Technologies Association New Future Industries Zone demonstrates synergies in the innovation and tech ecosystem The Autumn Electronics Fair and electronicAsia kick off in mid-October, bringing together over 3,200 exhibitors from 15 countries and regions. In support of the national strategy to foster future industries, this year's Electronics Fair will introduce the new Future Industries Zone. Supported by the Innovation, Technology and Industry Bureau of the HKSAR Government, the zone is jointly organised by the HKTDC and the Hong Kong Electronic Industries Association (HKEIA), with participation from some of Hong Kong's leading innovation and technology institutions. The zone will focus on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness. In addition to industry leaders such as Lenovo, AV Concept and GP Energy Tech, more than 100 exhibitors will be showcasing a wide range of cutting-edge technologies and innovative solutions. In addition, a series of thematic events and forums centred on the five key themes will be held during the fair. The distinguished speaker lineup includes Jeffrey Lam, Member of the Executive Council and Chairperson of the Board of Directors of the Hung Shui Kiu Industry Park Company Limited; Vincent Ma, Chief Executive Officer of the Hong Kong-Shenzhen Innovation and Technology Park Limited; Clara Chan, Chief Executive Officer of the Hong Kong Investment Corporation Limited; and Allen Yeung, President (Hong Kong) of the Greater Bay Area International Information Technology Industry Association. Another highlight in the Future Industries Zone will be the announcement of the Top 100 Future Industries Pioneer List, which aims to identify innovative products and solutions with strong commercial value. The fair will also feature a start-up pitching competition, as well as thematic forums dedicated to technology talent development and industry application matching, fostering closer collaboration between innovation, talent and business opportunities. GoGlobal Connect Zone helps enterprises expand into global markets As a core member of the Task Force on Supporting Mainland Enterprises in Going Global, spearheaded by the HKSAR Government, the HKTDC is setting up a dedicated GoGlobal Connect Zone at the Electronics Fair to help Chinese Mainland companies connect with international markets through Hong Kong’s professional services providers. A series of "GoGlobal" themed forums will also be held, including “Scaling Smart Consumer Innovations Worldwide”, featuring representatives from the Hong Kong Export Credit Insurance Corporation (HKECIC), TechNode and Hang Seng Bank. The forum will explore key strategies for overseas expansion, covering topics such as market entry, financing and risk management, smart manufacturing, sustainability, compliance and certification, and brand building. In addition, representatives from OCBC Bank (Hong Kong) will share insights on the ASEAN manufacturing ecosystem in the “Navigate the Opportunities and Challenges of Overseas Expansion and Next Frontier of Growth” session, helping companies interested in expanding into ASEAN markets gain a deeper understanding of the region’s economic environment, tax policies, business expansion practices and the latest market trends. Spotlight on highlighted themes: AI and Robotics, Smart Wellness and NEXTEntertainment The Autumn Electronics Fair will showcase the latest consumer electronics products and innovative technologies, with three highlighted themes: AI & Robotics, Smart Wellness and NEXTEntertainment. Related products will be featured at various thematic zones across the fair. As the convergence of AI and robotics continues to accelerate, this year’s fair will showcase more than 120 robots, primarily in RoboPark, demonstrating applications across four key scenarios: Commercial & Services, Industrial & Logistics, Entertainment & Social, and Healthcare & Rehabilitation. The impressive lineup includes AgiBot, the world’s leading humanoid robot manufacturer by shipment volume in the first half of 2026[1]; the Shenzhen Honor Smart Technology Development Co., Ltd.’s humanoid robot, winner of the 2026 Beijing E-Town Half Marathon; Booster Robotics, champion of the 2026 RoboCup; UBTECH, one of the “Shenzhen Eight Great Guardians of Embodied Intelligence”, which will present the world’s first next-generation full-sized humanoid robot designed for “urban coexistence”; and several prominent technology companies from the “Shenzhen Eight Great Guardians” and “Hangzhou Six Little Dragons”, including AI² Robotics, Digit Robotics, EngineAI, DexForce and Deep Robotics. In addition, VIGX Technology Co., Ltd. will showcase the world’s first “pocket-sized” AI exoskeleton robot, designed to overcome the bulkiness of traditional industrial exoskeletons while being portable and easy to wear. UBTECH's Walker C1 robot performs a waltz at the press conference, demonstrating its agility, fluid motion and remarkable balance capabilitiesVIGX Technologies Limited presents its latest innovation – the world's first "pocket-sized" AI exoskeleton robot, designed to overcome the bulkiness of traditional industrial exoskeletons while being portable and easy to wearManna Pacific (HK) Limited showcases an AI-powered indoor fitness screen that combines real-time motion tracking and visual guidance to help users improve posture accuracy, body coordination and workout safety. RoboPark will also feature multiple interactive experiences and showcase zones, including the RoboDog Garden for robot dog demonstrations, a robot football exhibition, the Robot Dance Battle performance, the Coffee & Popcorn Station where robots serve coffee and popcorn, as well as interactive photo spots, allowing visitors to experience firsthand the applications of robotics technology in diverse scenarios. Another highlighted theme, Smart Wellness, will cover digital health devices, smart wearables, personal care technologies, gerontech and healthy living electronics, reflecting the growing demand for solutions related to technology-enabled health management and improved quality of life. NEXTEntertainment, meanwhile, will feature extended reality (XR) technologies, smart gaming devices, digital content creation tools, AI-powered entertainment solutions and innovative consumer electronics, enhancing entertainment experiences and digital content creation capabilities. Showcasing renowned brands and start-ups with the Immersive Experience Zone The Autumn Electronics Fair will feature more than 20 themed zones, including the Hall of Fame, showcasing products from more than 560 renowned electronics brands. First-time exhibitors include companies such as HiFuture, Aoni and ZENS. The RISE Avenue zone will bring together emerging brands, featuring products ranging from gaming equipment to home entertainment systems. Another spotlight area, Adventure Hub, will include the Immersive Experience Zone, where creative technology companies will present the latest interactive gaming experiences and demonstrate virtual reality (VR) and augmented reality (AR) technologies. Visitors can try experiences such as brainwave-controlled sensors that enable users to operate games using concentration alone, without any physical controls. Over 120 emerging enterprises and start-ups will participate in the fair, primarily in the "Startup Zone”, with both the Internet of Things Hong Kong Association (IOTHK) and JimHang Academy leading groups of start-ups to showcase technologies and solutions that address real business challenges. And the Tech Hall will spotlight professional AI-driven data and Internet of Things (IoT) solutions across various industries, including intelligent monitoring systems for transportation applications. Concurrent electronicAsia to drive industry upgrading Jointly organised by the HKTDC and MMI Asia Pte Ltd and held concurrently with the Electronics Fair, electronicAsia (eAsia) will bring together exhibitors engaged in semiconductors, sensors, electronic components and manufacturing technologies. The exhibition will demonstrate how the electronics supply chain is adapting to the growing demands of AI development and digital transformation, helping enterprises seize opportunities arising from the next wave of industrial upgrading. Exhibitors including Easttop Display and Microtech Technology will unveil their latest products at the fair. Symposium on Innovation and Technology to spotlight AI and smart infrastructure A series of forums, seminars and networking events will be held during the Autumn Electronics Fair. Among the highlights is the annual Symposium on Innovation and Technology, jointly organised by the HKTDC and the Hong Kong Electronics and Technologies Association (HKETA) under the theme "AI-Driven Security & The Next-Gen Infrastructure". Distinguished speakers include Alexander Gerfer, Chief Technology Officer of Würth Elektronik Group, who will discuss how electronics technologies are powering the future of AI and intelligent systems; Dr Charles Cheung, Adjunct Associate Professor of the Department of Mathematics at Hong Kong Baptist University, who will explore how businesses can translate AI capabilities into operational excellence, innovation and business growth; and Silvia Lam Ihensekhien, Chief Security Advisor Microsoft, who will share insights into building resilient infrastructure to support AI-driven enterprises and enhance operational efficiency and competitiveness. The Hong Kong Electronics Forum, jointly organised by the HKTDC, MMI Asia Pte Ltd and the HKEIA and co-organised by Hong Kong Institute of Engineers, will explore how AI, sustainability and technological innovation are shaping the future of the electronics industry. The exhibition will also feature a series of start-up-focused activities, including enterprise-investor matching sessions, the Hong Kong Value Creation for Technology: Pitching Competition, and mentorship programmes, providing start-ups with valuable opportunities to showcase innovative ideas, expand investor networks and secure funding support to strengthen their competitiveness. Top-tier lighting technologies and global industry leaders converge at twin lighting fairs As premier annual events for the global lighting and lighting products industry, the Hong Kong International Lighting Fair (Autumn Edition) and Hong Kong International Outdoor and Tech Light Expo are expected to bring together some 3,000 exhibitors from more than 20 countries and regions. Under the theme “Beyond Illumination”, the twin lighting fairs will showcase the integration of smart technologies, sustainability, design aesthetics and lighting applications through a diverse range of thematic zones and activities. The fairs will highlight emerging industry trends and further reinforce their position as flagship platforms for the lighting industry in Asia and around the world. Leading global smart lighting and IoT industry alliances will participate in the Autumn Lighting Fair, including the Connectivity Standards Alliance, the DALI Alliance, the SILA-EMN Alliance, the Zhaga Consortium and, making its debut at the fair, KNX, the global standard for smart building and home automation. KNX, together with GVS Smart, will showcase the award-winning KNX Smart Touch S7 control panel, recipient of leading industry honours including the Red Dot Award, A’ Design Award and BDA Product Design Award. This product enables centralised control of lighting, curtains, air-conditioning systems and multiple smart home scenarios, allowing users to create personalised lighting environments and enjoy a seamless smart living experience. Hong Kong exhibitor Dimon Technology will showcase its advanced theatre lighting technologies deployed at the WestK Performing Arts Centre. The company has also provided intelligent lighting solutions for the International Gateway Centre (IGC), designed by internationally renowned architectural firm Zaha Hadid Architects, demonstrating the capability of Hong Kong lighting enterprises in delivering premium lighting technologies for landmark development projects. Hall of Connected Lighting returns with immersive lighting experiences A highlight of the Autumn Lighting Fair, the Hall of Connected Lighting will feature more than 60 leading brands, including local brand Dimon and Viliya; TUYA and Inventronics from the Chinese Mainland; Viso Systems from Denmark; Casambi from Finland; and Signify from the Netherlands. The zone will feature immersive lighting installations and application-based displays, enabling visitors to explore the latest smart lighting products and solutions through interactive light-and-shadow experiences. Among the highlights, Signify will collaborate with the Mercedes-AMG PETRONAS F1 Team to present a racing simulator experience that extends the excitement of motorsport beyond the screen into a physical environment through innovative lighting technologies. Two professional racing simulators will allow visitors to experience the thrill of high-speed driving and sharp cornering in a highly immersive setting. Premium decorative lighting brand Viliya will create Mirrorverse, an immersive mirrored art installation featuring its popular Starburst crystal chandeliers and sophisticated table lamps. The installation will demonstrate how decorative lighting can shape ambience, elevate interior design and create distinctive spatial experiences. Sunpu-Opto (HK) Limited displays its 360° Round Tube RGB Table Lamp with a high-performance RGB LED module, creating an immersive atmosphere with dynamic colour-changing light Meanwhile, Casambi, the world's leading wireless smart lighting control platform, will once again host its Artisan Café concept space at the fair. Together with renowned international lighting brand Formalighting and 12 partners from Europe, the United States and the Asia-Pacific region, Casambi will showcase its open and interconnected smart lighting ecosystem through technical presentations and application sharing. New LED Display Solution Zone creates a commercial display ecosystem Expanding the event’s product scope, the Autumn Lighting Fair will launch the new LED Display Solution Zone to foster the development of a commercial LED display ecosystem. The zone will feature LED video walls, commercial displays, transparent and flexible LED panels, immersive audio-visual systems and integrated display solutions, covering applications ranging from retail environments and corporate presentations to exhibitions, virtual production and major commercial projects. First-time exhibitor Ledman Hong Kong will present the QS Series IceScreen LED Display, which was deployed at the Milano Cortina 2026 Winter Olympic Games. Featuring large-scale 8K display technology, the solution delivers highly realistic and impactful visual experiences. The company will also introduce the LEDHUB Smart Conference Solution, which integrates large-format display, video conferencing and collaboration functions into a single platform. Winner of the 2025 TITAN Innovation Awards Gold Award, the solution has been adopted by leading institutions including The University of Hong Kong, the University of Warwick and Fudan University. Another signature zone, the Hall of Aurora, will feature some 500 renowned brands offering high-quality lighting products. Exhibitors include Hong Kong industry pioneers Prosperity Lamps & Components and Profiled Group, mainland brands Eaglerise, FSL and Leedarson, and international brands such as Finland's Lival, Germany's Cupower and Italy's Beghelli. Other featured zones include Commercial Lighting, Residential Lighting and LED Essentials. Prosperity Lamps & Components' SYMPL FUSION seamlessly integrates intelligent control and dynamic lighting, supporting multiple protocols including DALI, KNX and DMX to combine smart management with creative lighting applicationsFirst-time exhibitor Ledman Hong Kong showcases its LEDHUB Smart Conference Solution, an all-in-one platform that integrates large-format display, video conferencing and collaboration functions Outdoor and Tech Light Expo focuses on emerging smart city lighting trends The Hong Kong International Outdoor and Tech Light Expo will showcase a wide range of outdoor, commercial and industrial lighting products and solutions across three major zones: Smart Pole and Solution; Outdoor, Industrial and Technical Lighting; and Landscape and Architectural Lighting. The expo will present newly introduced photovoltaic (PV) and energy storage solutions to help cities enhance energy efficiency, alongside lighting applications for smart city development, industrial environments, professional settings, landscape projects and architectural illumination. Expo exhibitor Fonda Technology will showcase intelligent lighting solutions based on its FondaCity AIoT Cloud Platform within the Smart Pole and Solution zone, incorporating solar energy, motion sensing and various communication technologies. Approximately 70,000 smart streetlight control devices have already been deployed under Hong Kong's New Territories West smart lighting project. In addition to enabling precision lighting control, the system allows city managers to monitor operational conditions in real time via an AIoT platform, significantly enhancing urban management efficiency. Zhejiang Fonda Technology Co., Ltd. presents its multifunctional smart pole solution, which has been deployed in a project in Hong Kong’s New Territories West. Supported by approximately 70,000 smart streetlight controllers and an AIoT cloud platform, the solution enhances lighting management efficiency At the Outdoor, Industrial and Technical Lighting zone, exhibitor Zhejiang Ouruijie Lighting Technology Co., Ltd. will showcase its L10A Starship Flood Luminaire, winner of the Aladdin Lighting Award 2026 – National Best Lighting Product Award. Inspired by aircraft carrier design, the product combines a distinctive appearance with innovative lighting technology. The Landscape and Architectural Lighting zone will showcase how lighting can create unique urban atmospheres while enhancing the safety, functionality and aesthetics of public spaces. Throughout the fair period, the two lighting fairs will join hands with leading international lighting organisations to present a series of seminars, product launches and networking events. The Innovative Lighting Design Forum will be held at the Hong Kong Convention and Exhibition Centre on 27 October under the theme “Treasures of Light: Artistic Brilliance Beyond Exhibitions”. Three renowned lighting designers behind internationally acclaimed landmark projects will share the latest trends and insights, including Dr Yan Liu, Design Director, China of AT Design & Consulting Co Ltd, whose portfolio includes landmark projects such as the Louvre Museum in Paris and the Palace Museum in Beijing; Adam Meredith, Lighting Designer at MEGS Lighting from Australia, who has led lighting design projects for the Metropolitan Museum of Art in New York and M+ in Hong Kong; and Omar Elkerm, Lighting Design Manager (Africa) at Signify, who led the lighting design for several major pyramid illumination projects in Egypt. On the same day, the fair will collaborate with the Illuminating Engineering Society (IES) to launch a brand-new event, “Award-winning Illumination: Highlights from the IES Illumination Awards”. Winners of the prestigious IES Illumination Awards will share insights into the artistic and technical evolution of lighting design across different sectors. Featured speakers include Hiroyasu Shoji, Representative and Lighting Designer of Lightdesign Inc., who led the lighting design for the Grand Ring at Expo 2025 Osaka, and Kelly Jones, Co-Chief Executive Officer and President of Lighting Design Alliance, whose portfolio includes numerous projects for Disney and Universal Studios. The fair will also partner with Women in Lighting (WIL) for the first time to present “Circularity in Lighting Design” on 28 October. Leading female designers from around the world will discuss sustainable lighting design and the application of circular economy principles in the industry. Speakers include Yah Li Toh, Founder and Principal of Light Collab, who designed the lighting for the Singapore Pavilion at Expo 2020 Dubai, and Pavlina Akritas, Founder of Akritas Lighting Design, known for her work on lighting projects for some of the world's most prestigious luxury brands. Another key event, the Connected Lighting Forum, will once again be co-organised with the Shanghai Pudong Intelligent Lighting Association (SILA). Under the theme “Healing Light for the Future: Illuminating Emotional Well-being”, the forum will explore developments in intelligent and human-centric lighting technologies and their role in supporting emotional wellness, featuring case studies on the therapeutic applications of light. At AsiaWorld-Expo, a series of exhibitor and buyer activities will be held. Among the highlights, a seminar titled “Smart Tech Integration in Outdoor Lighting” on 27 October will bring together experts from the Alliance of Smart Pole Industry and another industry organisation to examine how AI is driving the next generation of smart pole applications. To facilitate sourcing and business networking across the fairs, a complimentary shuttle bus service will be provided for exhibitors and buyers between the HKCEC and AsiaWorld-Expo throughout the exhibition period. The four exhibitions will continue to adopt the HKTDC's EXHIBITION+ hybrid exhibition model, combining physical and online participation. In addition to attending the fairs in person, exhibitors and buyers can utilise the Click2Match smart business matching platform to connect, source and conduct business discussions online. The online exhibition period for the Hong Kong Electronics Fair (Autumn Edition) and electronicAsia will run from 6 to 23 October, while the online exhibitions for the Hong Kong International Lighting Fair (Autumn Edition) and Hong Kong International Outdoor and Tech Light Expo will be available from 19 October to 6 November, enabling businesses to extend their sourcing and networking activities beyond the physical fair dates. [1] Source: Counterpoint Research: Global Humanoid Robot Shipment Report for H1 2026, published on 20 August 2026. Photo download: https://bit.ly/3VBQ6dm Websites - Hong Kong Electronics Fair (Autumn Edition): https://www.hktdc.com/event/hkelectronicsfairae/en - electronicAsia: https://www.hktdc.com/event/electronicasia/en - Hong Kong International Lighting Fair (Autumn Edition): https://www.hktdc.com/event/hklightingfairae/en - Hong Kong International Outdoor and Tech Light Expo: https://www.hktdc.com/event/hkotlexpo/en Media enquiries Please contact the HKTDC’s Communications & Public Affairs Department: Hong Kong Electronics Fair (Autumn Edition) & electronicAsia Katy Wong Tel: (852) 2584 4524 Email: katy.ky.wong@hktdc.org Clayton Lauw Tel: (852) 2584 4472 Email: clayton.y.lauw@hktdc.org Hong Kong International Lighting Fair (Autumn Edition) & Hong Kong International Outdoor and Tech Light Expo Christy Lee Tel: (852) 2584 4369 Email: christy.wn.lee@hktdc.org Jane Cheung Tel: (852) 2584 4137 Email: jane.mh.cheung@hktdc.org HKTDC Media Room: https://mediaroom.hktdc.com/en About HKTDC The Hong Kong Trade Development Council (HKTDC) celebrates its 60th anniversary this year. The HKTDC is a statutory body established in 1966 to promote, assist and develop Hong Kong's trade. With over 50 offices globally, including 13 in the Chinese Mainland, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via trade publications, research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus. ———————————————————————————————————————————————————————————— Microchip Expands Single Pair Ethernet Portfolio with New 10BASE‑T1S Devices Enabling Scalable Edge Connectivity 2026-09-29 · GlobeNewswire · Automotive, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370741/0/en/microchip-expands-single-pair-ethernet-portfolio-with-new-10base-t1s-devices-enabling-scalable-edge-connectivity.html New transceivers and integrated endpoint family simplify zonal architectures and reduce system complexity for automotive and industrial applications New transceivers and integrated endpoint family simplify zonal architectures and reduce system complexity for automotive and industrial applications ———————————————————————————————————————————————————————————— South Korea Semiconductor Foundry Market Size and Share - Growth Analysis and Forecast 2026-2035 | AI and 2 nm GAA Demand Drive a US$42.30 Billion Opportunity 2026-09-29 · GlobeNewswire · AI, Automotive, Telecom, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370529/28124/en/south-korea-semiconductor-foundry-market-size-and-share-growth-analysis-and-forecast-2026-2035-ai-and-2-nm-gaa-demand-drive-a-us-42-30-billion-opportunity.html AI/HPC demand, advanced GAA nodes, public investment, automotive and 5G orders, and Gyeonggi’s fab ecosystem strengthen South Korea’s foundry market AI/HPC demand, advanced GAA nodes, public investment, automotive and 5G orders, and Gyeonggi’s fab ecosystem strengthen South Korea’s foundry market ———————————————————————————————————————————————————————————— United States Semiconductor Memory Market: Size, Trends and Forecast to 2032 | Rising Automotive, IT, and Consumer Electronics Demand Creates Growth Opportunities 2026-09-29 · GlobeNewswire · Retail, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370527/28124/en/united-states-semiconductor-memory-market-size-trends-and-forecast-to-2032-rising-automotive-it-and-consumer-electronics-demand-creates-growth-opportunities.html Deep insights into demand, competitive positioning, growth drivers, market entry opportunities, and semiconductor memory segments across key U.S. industries Deep insights into demand, competitive positioning, growth drivers, market entry opportunities, and semiconductor memory segments across key U.S. industries ———————————————————————————————————————————————————————————— MENA Medical Semiconductor Memory Market Size, Trends, Competitive Landscape, and Forecast to 2032 | Digital Health and Next-Generation Memory Unlock Growth Opportunities 2026-09-29 · GlobeNewswire · Healthcare, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370525/28124/en/mena-medical-semiconductor-memory-market-size-trends-competitive-landscape-and-forecast-to-2032-digital-health-and-next-generation-memory-unlock-growth-opportunities.html Explore MENA demand-supply trends, growth drivers, competitive positioning, distributor networks, segment opportunities and market-entry strategies Explore MENA demand-supply trends, growth drivers, competitive positioning, distributor networks, segment opportunities and market-entry strategies ———————————————————————————————————————————————————————————— MENA Semiconductor Memory Market Size, Trends, and Forecast to 2032 | Automotive, Telecom, and Industrial Demand Create Growth Opportunities 2026-09-29 · GlobeNewswire · Automotive, Telecom, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370524/28124/en/mena-semiconductor-memory-market-size-trends-and-forecast-to-2032-automotive-telecom-and-industrial-demand-create-growth-opportunities.html Identify high-potential segments, entry routes and competitive positioning through insights on demand, trends, growth drivers and distributor networks across MENA Identify high-potential segments, entry routes and competitive positioning through insights on demand, trends, growth drivers and distributor networks across MENA ———————————————————————————————————————————————————————————— United Arab Emirates Medical Semiconductor Memory Market Size, Share, Trends, and Forecast to 2032 | Digital Health, Medical Imaging, and Remote Monitoring Fuel Growth 2026-09-29 · GlobeNewswire · Healthcare, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370523/28124/en/united-arab-emirates-medical-semiconductor-memory-market-size-share-trends-and-forecast-to-2032-digital-health-medical-imaging-and-remote-monitoring-fuel-growth.html Unlock UAE medical memory opportunities with insights into demand, competition, market entry strategies, key applications, technologies, and distributors Unlock UAE medical memory opportunities with insights into demand, competition, market entry strategies, key applications, technologies, and distributors ———————————————————————————————————————————————————————————— United Arab Emirates Semiconductor Memory Market Size, Trends, and Forecast to 2032 | AI, Data Centers, and Automotive Demand Drive Growth Opportunities 2026-09-29 · GlobeNewswire · AI, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370522/28124/en/united-arab-emirates-semiconductor-memory-market-size-trends-and-forecast-to-2032-ai-data-centers-and-automotive-demand-drive-growth-opportunities.html Optimize UAE market entry with demand-supply insights, growth drivers, segment opportunities, competitive positioning and distributor intelligence Optimize UAE market entry with demand-supply insights, growth drivers, segment opportunities, competitive positioning and distributor intelligence ———————————————————————————————————————————————————————————— Poland Medical Semiconductor Memory Market Size, Trends and Forecast to 2032 | Digital Health, Connected Care, and Next-generation Memory Open Strategic Growth Opportunities 2026-09-29 · GlobeNewswire · Healthcare, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370521/28124/en/poland-medical-semiconductor-memory-market-size-trends-and-forecast-to-2032-digital-health-connected-care-and-next-generation-memory-open-strategic-growth-opportunities.html Pinpoint high-potential memory types and medical applications using demand trends, competitive positioning, distributor insights and market-entry analysis in Poland Pinpoint high-potential memory types and medical applications using demand trends, competitive positioning, distributor insights and market-entry analysis in Poland ———————————————————————————————————————————————————————————— Poland Semiconductor Memory Market Size, Trends, and Forecast to 2032 | Automotive, Industrial, and Telecom Demand Creates Strategic Growth Opportunities 2026-09-29 · GlobeNewswire · Automotive, Telecom, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370519/28124/en/poland-semiconductor-memory-market-size-trends-and-forecast-to-2032-automotive-industrial-and-telecom-demand-creates-strategic-growth-opportunities.html Unlock Poland’s semiconductor memory market with insights into demand, key trends, growth drivers, competitive positioning, distributors and market-entry opportunities. Unlock Poland’s semiconductor memory market with insights into demand, key trends, growth drivers, competitive positioning, distributors and market-entry opportunities. ———————————————————————————————————————————————————————————— Global Activated Carbon Fiber Market (2026-2031) to Reach US$561.57 Million by 2031 as Emission Regulations Drive Adoption 2026-09-29 · GlobeNewswire · Energy, Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370518/28124/en/global-activated-carbon-fiber-market-2026-2031-to-reach-us-561-57-million-by-2031-as-emission-regulations-drive-adoption.html Stricter emissions rules and semiconductor growth drive demand for compact, fast-regenerating filters; wearable filtration and energy storage offer upside, despite feedstock cost pressures Stricter emissions rules and semiconductor growth drive demand for compact, fast-regenerating filters; wearable filtration and energy storage offer upside, despite feedstock cost pressures ———————————————————————————————————————————————————————————— Chemical Mechanical Planarization Global Market Size, Share, and Growth Forecast 2026-2035 | Advanced Chips and 3D NAND Propel Market to US$15.42 Billion 2026-09-29 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/09/29/3370516/28124/en/chemical-mechanical-planarization-global-market-size-share-and-growth-forecast-2026-2035-advanced-chips-and-3d-nand-propel-market-to-us-15-42-billion.html Asia Pacific leads CMP demand, while slurries dominate. Advanced nodes, 3D NAND, packaging and SiC wafers offer strong opportunities for innovation and strategic investment. Asia Pacific leads CMP demand, while slurries dominate. Advanced nodes, 3D NAND, packaging and SiC wafers offer strong opportunities for innovation and strategic investment. ———————————————————————————————————————————————————————————— Huatai-PCG HK-KR Semiconductor ETF Listed on HKEX 2026-09-29 · ACN Newswire · Finance, AI, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/110459/ HONG KONG, Sept 29, 2026 - On 28 September 2026, the Huatai-PCG HKEX KRX Semiconductor Index ETF (Stock Code: 3569, HKD counter), issued by Huatai-PCG Asset Management Limited (Huatai-PCG), was officially listed on the Stock Exchange of Hong Kong .   The fund tracks the HKEX KRX Semiconductor Index, the first co-branded index jointly developed by Hong Kong Exchanges and Clearing Limited (HKEX) and Korea Exchange (KRX). The index brings together leading semiconductor-related companies listed in Hong Kong, China and South Korea, providing investors with a convenient investment tool to participate in Asia's semiconductor value chain. As one of the first exchange traded funds (ETFs) tracking this cross-market index, the product enables investors to access investment opportunities across two key semiconductor markets—Hong Kong, China and South Korea—through a single trading instrument.   Hong Kong Exchanges and Clearing Limited (HKEX) HKEX Chief Executive Officer, Bonnie Y Chan, said: "We are delighted to welcome the first ETFs tracking HKEX’s cross-market index series. Their launch marks an important step in our efforts to connect Hong Kong with international markets by working with exchanges and partners across Asia and beyond to broaden investor choice. By bringing together opportunities across different markets and sectors, these benchmarks respond to investors' growing demand for diversification and reinforce Hong Kong's role as a gateway connecting the Chinese Mainland with the rest of the world." Huatai-PB Fund Management Co., Ltd. (Huatai-PB) The General Manager of Huatai-PB and Director of Huatai-PCG, Ms. CUI Chun, noted: “The Huatai-PCG HKEX KRX Semiconductor Index ETF links the core supply chain of China’s emerging wafer fabrication players with South Korea’s global memory chip leaders, capturing upside from the AI-driven semiconductor upcycle. Its 60/40 structural allocation lays the groundwork for potential inclusion in the Southbound ETF Connect. A dedicated offering from Huatai-PCG thanks to HKEX and KRX’s great support, it is tailored to meet the asset allocation needs of investors in Hong Kong and Mainland China.”   Investment Highlights - Cross-market exposure: A single fund spanning leading semiconductor companies across both Hong Kong, China and South Korea, mitigating concentration risk in any one market; - Aligned with a key sector theme: Focused on the semiconductor industry, consistent with broader global technology and artificial intelligence trends; - Co-branded index backing: Tracking the flagship co-branded index developed jointly by HKEX and KRX, with a clear and established benchmark methodology. About Huatai-PCG Huatai-PCG Asset Management Co., Ltd. (“Huatai-PCG”) is registered in Hong Kong, China and is a wholly-owned subsidiary of Huatai-PB Fund Management Co., Ltd. (“Huatai-PB”). The business development of Huatai-PCG has gained strong support from both major shareholders of the parent company, Huatai Securities Co., Ltd. and Pacific Century Group. The company obtained approval from the China Securities Regulatory Commission on November 29, 2024, and obtained licenses No. 1 (securities trading), No. 4 (providing advice on securities), and No. 9 (providing asset management) issued by the Hong Kong Securities and Futures Commission (SFC) on September 12, 2025. As one of the first domestic ETF managers, the parent company Huatai-PB Fund has nearly 20 years of experience in ETF businesses, especially in managing the innovative cross-border index product Huatai-PB China Korea Semiconductor ETF (513310). It has accumulated rich investment management experience in cross market investment, index tracking, and product operation, fully empowering Huatai-PCG to provide investors with more diversified investment choices in the era of global asset allocation. For Media Inquiries: Huatai-PCG Asset Management Co., Ltd. Email: service@huatai-pb.com.hk Official website: https://www.huatai-pb.com.hk ———————————————————————————————————————————————————————————— SEMIFIVE Secures USD 52 Million AI Accelerator Contract with U.S. Fabless Company, Validating End-to-End ASIC Model in North America 2026-09-29 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/semifive-secures-usd-52-million-ai-accelerator-contract-with-us-fabless-company-validating-end-to-end-asic-model-in-north-america-302892224.html First Spec Hand-off project in North America marks SEMIFIVE's largest single contract to date Next-generation data center AI chip to integrate LPDDR6, PCIe Gen5, and Big Die technologies Tape-out targeted for the first half of 2027, followed by global mass production beginning in 2028... ———————————————————————————————————————————————————————————— Media Alert: AMD CEO Lisa Su to Lead Keynote at 2026 OCP 2026-09-29 · AMD · AI, Semiconductors https://newsroom.amd.com/news/media-alert-ceo-lisa-su-keynote-2026-ocp/ The leader of AMD will highlight how the company delivers the open, full-stack infrastructure required for agentic AI. ———————————————————————————————————————————————————————————— U.S. Government Selects Navitas to Develop Next-Generation 10 kV SiC Power Semiconductors 2026-09-28 · GlobeNewswire · Industrial, Logistics, Semiconductors https://www.globenewswire.com/news-release/2026/09/28/3370264/0/en/u-s-government-selects-navitas-to-develop-next-generation-10-kv-sic-power-semiconductors.html Award recognizes Navitas' leadership in ultra-high-voltage (UHV) SiC technology and resilient U.S.-anchored manufacturing supply chain Award recognizes Navitas' leadership in ultra-high-voltage (UHV) SiC technology and resilient U.S.-anchored manufacturing supply chain ———————————————————————————————————————————————————————————— Lattice to Showcase Open Control Plane Innovations for AI Infrastructure at OCP Global Summit 2026 2026-09-28 · Business Wire · Finance, AI, SaaS, Semiconductors https://finance.yahoo.com/technology/ai/articles/lattice-showcase-open-control-plane-200000870.html HILLSBORO, Ore., September 28, 2026--Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its participation in OCP Global Summit 2026. At the event, Lattice and AMI, a Lattice company, will demonstrate how an open control plane can help organizations build secure, scalable, and manageable AI infrastructure from silicon to rack. ———————————————————————————————————————————————————————————— Lenovo Introduces Its First Googlebook, Delivering Premium AI Experiences in a Sleek, Lightweight Design 2026-09-28 · Lenovo · AI, Semiconductors, Consumer electronics https://news.lenovo.com/pressroom/press-releases/first-googlebook-premium-ai-experiences-sleek-lightweight-design/ Powered by Intel Core Ultra 5 processors, Lenovo Googlebook 15 combines built-in Gemini Intelligence with Lenovo's trusted design and years of Chromebook expertise. ———————————————————————————————————————————————————————————— AI Chip and Server Revenue Reaches About HK$1.047 Billion; Proposed Rebrand Signals Central New Energy's Intelligent-Computing Ambition 2026-09-28 · ACN Newswire · Finance, AI, Energy, Semiconductors https://www.acnnewswire.com/press-release/english/110403/ HONG KONG, Sept 28, 2026 - Central New Energy Holding Group Limited ('Central New Energy' ; Stock Code: 1735)  has  proposed  changing  its  name  to  Central  AI  Technology  Group Limited, with proposed as its new Chinese name. The proposed name change highlights the Group's continued push into the intelligent- computing value chain, including AI chips, servers and data centers. According to information cited in the company’s announcement and its 2026 interim report, revenue from its AI chip and server segment grew to approximately HK$1.047 billion for the six months ended June 30, 2026. The company said this momentum is consistent with its strategy to capture rapid growth in the global AI industry and, going forward, to invest in, construct and operate data centers. As demand for AI infrastructure continues to grow, the proposed new name is expected to more clearly communicate the Group’s evolving positioning in intelligent computing and technology. The proposal remains subject to shareholder and regulatory approvals. The Company’s reported results and business expansion provide a positive basis for market attention: for the first half of 2026, the Group reported revenue of approximately HK$6.33 billion, up 56.3% year on year; gross profit of approximately HK$130 million, up 50.0% year on year; and AI chip and server revenue of approximately HK$1.047 billion. Today, as of 10:28 a.m. (Hong Kong time), a public market-data report cited an intraday gain of 10.45% for Central New Energy (01735.HK), with the Shares trading at HK$11.41 and turnover of approximately HK$84.35 million. Earnings growth, expansion of the AI computing business and data-center planning are positive factors for current observation, but do not constitute forecasts of future results or share-price performance. ———————————————————————————————————————————————————————————— HKTDC raises 2026 export forecast amid AI boom, Strong technology demand and resilient supply chains underpin growth 2026-09-28 · ACN Newswire · AI, SaaS, Energy, Retail, Telecom, Fashion & luxury, Industrial, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/110398/ HONG KONG, Sept 28, 2026 - The Hong Kong Trade Development Council (HKTDC) has substantially revised upward its forecast for Hong Kong's merchandise export growth in 2026 to 42%-47%, following significantly stronger-than-expected global demand for artificial intelligence (AI)-related technologies, prompting a major upgrade to the trade outlook. Meanwhile, the latest HKTDC Export Confidence Index (3Q26) indicates that exporter sentiment remains broadly positive despite ongoing geopolitical uncertainties. The Current Performance Index stood at 51.8, while the Expectation Index registered 51.3, with both remaining above the neutral 50-point threshold. HKTDC Director of Research Bruce Pang (left), Deputy Director of Research Wing Chu (centre) and Section Head of Special Project & Business Advisory Kenneth Lee (right) announced the latest Hong Kong’s export outlook for 2026 and HKTDC Export Confidence Index for the third quarter of the year at a press conference today. AI-driven electronics exceed expectations Commenting on the export outlook, HKTDC Director of Research, Bruce Pang, said: "The strong Hong Kong export growth recorded this year has been driven primarily by the rapid acceleration of global demand for AI-related products and infrastructure. Demand for semiconductors, memory chips, computer components, telecommunications equipment and other advanced electronics expanded much faster than expected, providing substantial support to Hong Kong's exports." HKTDC Director of Research Bruce Pang Electronics remained the dominant growth engine, accounting for approximately 80% of Hong Kong's total exports in the first eight months of 2026. Exports of electronics rose by 52.8% year-on-year, significantly outpacing overall export growth. Major markets included the Chinese Mainland, ASEAN and the US, reflecting strong demand across global technology supply chains. Particularly notable was the strong performance of items related to growing investments in AI infrastructure, cloud computing, data centres and next-generation digital technologies worldwide. AI-related electronics now account for an increasingly significant share of Hong Kong's exports. Growth with broader regional trade flows throughout Asia The strong export performance has not been confined to a narrow range of technology items. HKTDC Deputy Director of Research, Wing Chu, said: "Exports of a broad range of conventional electronic parts and components have continued to perform strongly. Regional manufacturing networks spanning the Chinese Mainland and ASEAN economies remain highly active, supporting vigorous trade flows throughout Asia. At the same time, export performance across many traditional industries has remained broadly stable, reflecting continued overseas demand and resilient consumption in major markets." HKTDC Deputy Director of Research Wing Chu ASEAN continues to be one of Hong Kong's most dynamic export destinations, while exporter sentiment towards both ASEAN and the Chinese Mainland remains firmly positive. Regional trade flows across Asia have remained exceptionally strong amid the ongoing technology upcycle, demonstrating the resilience of regional production networks and supply chains. The Chinese Mainland's high-technology manufacturing sector has remained in expansion territory, helping sustain demand for electronic components and related intermediate goods. Exports remain robust amid evolving US trade policies Recent developments in US trade policy have introduced additional uncertainty into the global trading environment. In July, the United States imposed an additional 12.5% Section 301 tariff on imports from a number of trading partners, including the Chinese Mainland and Hong Kong. Nevertheless, Hong Kong's exports to the United States have remained remarkably resilient, with US-bound exports rising by 63.4% year-on-year in the first eight months of 2026. Bruce Pang added: "While the latest Section 301 tariff measures have added a degree of uncertainty for businesses, the direct impact on Hong Kong exports is expected to be limited. A substantial share of Hong Kong's exports to the United States consists of products covered by tariff exemption arrangements, particularly in the technology and electronics sectors.” “Recent developments in China-US relations have also helped improve the trade environment. The September Xi-Trump meeting and extension of the trade truce until January 2027, coupled with the US$30 billion Reciprocal Tariff Reduction Arrangement, provide a welcome period of stability, reducing the risk of further tariff escalation in the coming months. The extended policy dialogue between the two sides has also led to further easing in bilateral trade tensions. Together with the continued strength of global demand for technology products, these developments should help underpin Hong Kong's export performance in the months ahead." Hong Kong moving up the value chain Beyond the cyclical upswing in technology demand, recent trade developments also point to a significant structural transformation in Hong Kong's trade profile. According to HKTDC research, Hong Kong's exports are increasingly concentrated in high-value, technology-intensive products such as integrated circuits, computer parts and advanced telecommunications equipment. These products are progressively replacing traditional lower-value, bulk merchandise as key contributors to export growth. At the same time, Hong Kong's trade logistics pattern is undergoing a profound shift, as the growing importance of high-value items, such as semiconductors and luxury products, has increased reliance on air freight. Hong Kong's extensive air cargo network, combined with its close land transport connectivity with advanced manufacturing clusters in Southern China, has strengthened its position as a leading high-value international trade and logistics hub, as pledged in Hong Kong’s First Five-Year Plan. Wing Chu said: "Hong Kong is increasingly handling products that are compact in size but exceptionally high in value, which are frequently transported via a combination of air cargo services serving overseas destinations and land transport links connecting Hong Kong with manufacturing centres in the Chinese Mainland. This transformation highlights Hong Kong's evolution from a traditional trading gateway into a high-value-added international trade and supply chain management centre." Outlook remains constructive Looking ahead, the HKTDC expects Hong Kong's exports to maintain solid momentum through the remainder of 2026, supported by resilient global demand for technology products, and robust manufacturing and trade activities across the Chinese Mainland and other major destinations, such as ASEAN. Nevertheless, exporters will continue to navigate a challenging and uncertain external environment. HKTDC Section Head of Special Project & Business Advisory, Kenneth Lee, said: "Businesses continue to face a range of external headwinds like geopolitical tensions, volatility in energy and commodity markets, and rising protectionist measures in certain economies. Despite these challenges, international consumption has remained relatively resilient in recent months, helping sustain demand for a broad range of consumer products. As a result, sectors such as clothing, watches and clocks, and jewellery have continued to deliver stable export performance alongside the strong growth seen in technology-related industries." HKTDC Section Head of Special Project & Business Advisory Kenneth Lee References - Hong Kong’s 2026 Export Outlook: Hong Kong Export Growth Forecast Upgraded to 42%-47% https://research.hktdc.com/en/article/MjQzNzY3NzQ4Mg - HKTDC Export Confidence Index 3Q26: Sentiment remains broadly positive https://research.hktdc.com/en/article/MjQzNzY3MzkyMw - Hong Kong's Evolution into a High Value-Added Trade Hub https://research.hktdc.com/en/article/MjQzOTM2OTY1MQ - HKTDC Research website https://research.hktdc.com/en/   Photo download: https://bit.ly/4rD4M8f Media enquiries Please contact the HKTDC’s Communications and Public Affairs Department:  Christy Lee  Tel: (852) 2584 4369  Email: christy.wn.lee@hktdc.org About HKTDC The Hong Kong Trade Development Council (HKTDC) celebrates its 60th anniversary this year. The HKTDC is a statutory body established in 1966 to promote, assist and develop Hong Kong's trade. With over 50 offices globally, including 13 in the Chinese Mainland, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus. ———————————————————————————————————————————————————————————— AMD to Acquire World Labs to Advance the Future of AI Compute 2026-09-28 · AMD · Finance, AI, Semiconductors https://newsroom.amd.com/news/amd-acquire-world-labs/ Acquisition brings leading AI model research expertise to AMD, helping to shape future AI infrastructure and strengthen the open AI ecosystem. ———————————————————————————————————————————————————————————— How Can Everyday People Participate in the AI Infrastructure Boom? 51AIpower Explains the AI Token Economy 2026-09-27 · GlobeNewswire · Crypto, AI, Semiconductors https://www.globenewswire.com/news-release/2026/09/27/3369459/0/en/how-can-everyday-people-participate-in-the-ai-infrastructure-boom-51aipower-explains-the-ai-token-economy.html London, United Kingdom, Sept. 27, 2026 -- As artificial intelligence continues to advance at a rapid pace, it is creating new companies, careers, and business opportunities. Yet for most everyday people, actually finding a way to “participate in AI” still comes with significant barriers. Beyond buying shares of AI-related companies such as NVIDIA, building an AI product requires technical expertise, training models requires specialized teams, and developing data centers or purchasing GPUs is far beyond what most individuals can realistically do. ———————————————————————————————————————————————————————————— AI Memory & Storage: The 5th GMIF2026 Innovation Summit Successfully Concludes in Shenzhen 2026-09-27 · PR Newswire · AI, Education, Travel, Semiconductors https://www.prnewswire.com/news-releases/ai-memory--storage-the-5th-gmif2026-innovation-summit-successfully-concludes-in-shenzhen-302890873.html SHENZHEN, China, Sept. 26, 2026 -- On September 23, the 5th GMIF2026 Innovation Summit successfully concluded at the Renaissance Shenzhen Bay Hotel. Co-hosted by the Shenzhen Memory Industry Association (SMIA) and School of Integrated Circuits at Peking University, the... ———————————————————————————————————————————————————————————— MetaOptics Ltd establishes American Depositary Receipt ("ADR") Programme on OTCQX in the U.S., with J.P. Morgan as the Depositary Bank 2026-09-24 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/metaoptics-ltd-establishes-american-depositary-receipt-adr-programme-on-otcqx-in-the-us-with-jp-morgan-as-the-depositary-bank-302889874.html SINGAPORE, Sept. 24, 2026 -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group"), a leading-edge semiconductor optics company, today announced the establishment of its sponsored Level 1 ADR programme in the U.S. (the... ———————————————————————————————————————————————————————————— Behind Project Suncatcher, our moonshot to put AI in space 2026-09-24 · Google · AI, Semiconductors https://blog.google/innovation-and-ai/models-and-research/google-research/google-project-suncatcher-facts/ Learn about Project Suncatcher, how we’re testing hardware survival for space, designing cooling systems for AI chips, and more. ———————————————————————————————————————————————————————————— Qualcomm Announces Renewal of Global Patent License Agreement with Apple 2026-09-24 · Qualcomm · Semiconductors https://www.prnewswire.com/news-releases/qualcomm-announces-renewal-of-global-patent-license-agreement-with-apple-302888552.html Qualcomm Incorporated today announced the renewal of its global patent license agreement with Apple, effective April 1, 2027. "We are pleased to... ———————————————————————————————————————————————————————————— Brain-Inspired Computing Processor Market Outlook 2026-2035 - Featuring Profiles of Intel, IBM, and BrainChip Holdings 2026-09-24 · GlobeNewswire · AI, Energy, Semiconductors https://www.globenewswire.com/news-release/2026/09/24/3368085/28124/en/brain-inspired-computing-processor-market-outlook-2026-2035-featuring-profiles-of-intel-ibm-and-brainchip-holdings.html Energy-Efficient Edge AI, Spiking Neural Networks and Event-Driven Vision Drive Brain-Inspired Processor Adoption Energy-Efficient Edge AI, Spiking Neural Networks and Event-Driven Vision Drive Brain-Inspired Processor Adoption ———————————————————————————————————————————————————————————— Sivers Semiconductors Makes Changes to Senior Leadership Team for Next Phase of Commercial Growth 2026-09-24 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/sivers-semiconductors-makes-changes-to-senior-leadership-team-for-next-phase-of-commercial-growth-302888690.html Industry Veterans Join Sivers as the Company Advances its Wireless And Photonics Products Toward Broader Commercialization And Scale KISTA, Sweden, Sept. 24, 2026 -- Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, today announced... ———————————————————————————————————————————————————————————— M31 and Ambiq Collaborate on TSMC N12e® Foundation IP to Address Demanding SoC Power and Area Targets 2026-09-24 · PR Newswire · AI, Real estate, Semiconductors https://www.prnewswire.com/news-releases/m31-and-ambiq-collaborate-on-tsmc-n12e-foundation-ip-to-address-demanding-soc-power-and-area-targets-302888508.html HSINCHU, Sept. 23, 2026 -- M31 Technology (M31), a global silicon intellectual property (IP) provider, and Ambiq, a technology leader in ultra-low power semiconductor solutions for edge AI, today announced a joint ultra-low-power Foundation IP solution on the TSMC N12e®... ———————————————————————————————————————————————————————————— With AMD Ryzen AI Max Series Processors, Perplexity Brings Portable Computer to Agentic PCs 2026-09-24 · AMD · AI, SaaS, Semiconductors, Software & IT, Consumer electronics https://newsroom.amd.com/news/amd-perplexity-agentic-pcs/ Systems powered by AMD Ryzen AI Max Series processors, including the AMD Ryzen AI Halo developer platform, can now run Portable Computer on Windows for Perplexity subscribers. ———————————————————————————————————————————————————————————— USD.AI Announces $128.9M GPU Financing Facility, Its Largest to Date 2026-09-23 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/usdai-announces-128-9m-gpu-financing-facility-its-largest-to-date-302888224.html GPU financing facility supports new NVIDIA GB200 NVL72 deployment in British Columbia, Canada NEW YORK, Sept. 23, 2026 -- USD.AI today announced a $128.9 million asset-backed GPU financing facility for an undisclosed borrower, marking the largest loan originated through the... ———————————————————————————————————————————————————————————— $12.8 Billion HVAC Power Semiconductors Market Forecast, 2036: Emerging Technologies, Leading Companies, Investment Opportunities 2026-09-23 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/09/23/3367650/28124/en/12-8-billion-hvac-power-semiconductors-market-forecast-2036-emerging-technologies-leading-companies-investment-opportunities.html Rising adoption of IGBTs, MOSFETs, intelligent power modules, silicon carbide and gallium nitride is improving efficiency and reliability. Asia-Pacific leads the market, while North America is expected to record the fastest growth. Rising adoption of IGBTs, MOSFETs, intelligent power modules, silicon carbide and gallium nitride is improving efficiency and reliability. Asia-Pacific leads the market, while North America is expected to record the fastest growth. ———————————————————————————————————————————————————————————— TROOPS (NASDAQ: TROO) allocates US$12 million for new unit focused on AI infrastructure in Southeast Asia 2026-09-23 · ACN Newswire · Finance, Crypto, AI, SaaS, Real estate, Automotive, Education, Telecom, Semiconductors https://www.acnnewswire.com/press-release/english/110311/ HONG KONG, Sept 23, 2026 - TROOPS, Inc. (Nasdaq: TROO) is committing US$12 million to start a new business unit focused on artificial intelligence infrastructure in Southeast Asia, a growing market that attracted more than US$55 billion of investment over the last year. The Hong Kong financial services and property group has sought a future partnership with Bfarms365 LLC, a Texas company in the USA, through which it will offer services that include GPU-as-a-Service, AI inference, edge computing, decentralized compute, cloud orchestration, and other AI developer services. The new unit is in the process of evaluating sites, partnerships, and assets across Hong Kong, Malaysia, and Indonesia. TROOPS expects to make its first allocation of US$6 million by the end of 2026. The creation of this new unit comes in response to unprecedented growth in Southeast Asia as an AI hub for Asia Pacific and beyond. Data center capacity in Malaysia’s Johor state doubled over the same twelve months, according to figures presented at the China-ASEAN Business Leaders Summit in September. Telecom operators have begun buying into the build directly. Singtel is expanding its Nxera platform across Southeast Asia, SK Telecom raised US$2.2 billion from KKR and an IMM-Stonebridge consortium for its new AI data center vehicle in August, and Reliance Jio is developing campuses of its own. “Southeast Asia has become the place where Asia’s compute is actually being built, and the capital going in is no longer only American,” said Damian Thurnheer, President and CEO of TROOPS, Inc. “Moving into this layer is a natural extension of our business, which has pioneered disruptive technologies including fintech.” The TROOPS business portfolio is anchored in property and small business cash flows in Hong Kong through two licensed money lenders, holding commercial property for rental income, and managing an insurance consultancy and an online financial technology marketplace to deliver credit and insurance products through application programming interfaces. Group revenue rose 70% to US$17.1 million in the year to December 31, 2025. The company also holds a 19.9% stake in HK Golden, Inc., operator of one of Hong Kong’s largest online forums. “This new venture provides strong unity with our existing business interests,” said Tommy Wing Ling Lui, CTO of TROOPS, Inc. “We already run machine learning inside underwriting and servicing, on infrastructure we rent. Owning capacity in the region changes what we can build, and it puts us on the right side of a market where operators, banks, and sovereign funds are all moving at once.” TROOPS will report progress as definitive terms are reached and will file with the Securities and Exchange Commission where required. About TROOPS, Inc. TROOPS, Inc. is a conglomerate group of various businesses headquartered in Hong Kong. The group is principally engaged in (a) money lending business in Hong Kong, providing mortgage loans to high-quality target borrowers; (b) property investment to generate additional rental income; and (c) the development, operation, and management of an online financial marketplace that provides one-stop financial technology solutions, including API services, by leveraging artificial intelligence, big data, blockchain, and cloud computing (SaaS). The group's vision is to operate as a conglomerate to build synergy within its own sustainable ecosystem, thereby creating value for its shareholders. For more information about TROOPS, please visit [www.troops.co](http://www.troops.co). Media Contact: Ellerton & Co. on behalf of TROOPS Inc. Michelle Bui michelle@ellerton.sg Safe Harbor and Informational Statement This announcement contains "forward-looking" statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. These statements are made under the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical fact, including, without limitation, those with respect to the objectives, plans, and strategies of the Company set forth herein and those preceded by or that include the words "believe," "expect," "anticipate," "future," "will," "intend," "plan," "estimate," or similar expressions, are "forward-looking statements." Forward-looking statements in this release include, without limitation, the effectiveness of the Company's multiple-brand, multiple-channel strategy and the transitioning of its product development and sales focus to a "light-asset" model. Although the Company's management believes that such forward-looking statements are reasonable, it cannot guarantee that such expectations are, or will be, correct. These forward-looking statements involve a number of risks and uncertainties, which could cause the Company's future results to differ materially from those anticipated. These forward-looking statements can change as a result of many possible events or factors, not all of which are known to the Company, which may include, without limitation, our ability to have effective internal control over financial reporting; our success in designing and distributing products under brands licensed from others; management of sales trends and client mix; the possibility of securing loans and other financing without efficient fixed assets as collateral; changes in government policy in China; China's overall economic conditions and local market economic conditions; our ability to expand through strategic acquisitions and the establishment of new locations; compliance with government regulations; legislation or regulatory environments; geopolitical events; and other events and/or risks outlined in TROOPS's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F and other filings. All information provided in this press release and in the attachments is as of the date of issuance, and TROOPS does not undertake any obligation to update any forward-looking statement, except as required under applicable law. ———————————————————————————————————————————————————————————— New Report Analyzes Global Deployment of Google Cloud Semiconductor ASICs, TPUs, Axion CPUs and Quantum Processing Units 2026-09-23 · GlobeNewswire · SaaS, Semiconductors https://www.globenewswire.com/news-release/2026/09/23/3367208/28124/en/new-report-analyzes-global-deployment-of-google-cloud-semiconductor-asics-tpus-axion-cpus-and-quantum-processing-units.html Google Cloud ASIC deployments are expanding globally, creating regional opportunities across next-generation TPUs, Axion CPUs and quantum processors. Google Cloud ASIC deployments are expanding globally, creating regional opportunities across next-generation TPUs, Axion CPUs and quantum processors. ———————————————————————————————————————————————————————————— ‘Advanced Insights’: How ‘Zen’ Architecture Evolves for the Agentic AI Era (Video) 2026-09-23 · AMD · AI, Media, Semiconductors https://newsroom.amd.com/news/advanced-insights-zen-architecture-agentic-ai-era/ Watch the latest video in the AMD series: Mark Papermaster and Mike Clark explore the evolution of the ‘Zen’ x86 architecture and the growing role of CPUs in AI. ———————————————————————————————————————————————————————————— Inside a decade of Amazon chip design, built workload by workload 2026-09-22 · Amazon · AI, Retail, Semiconductors https://www.aboutamazon.com/news/innovation-at-amazon/peter-desantis-amazon-ai-chips-design?utm_source=rss At AI Infra Summit, Amazon SVP Peter DeSantis explained how real customer workloads guided every generation of Amazon's chips, from Nitro to Trainium. ———————————————————————————————————————————————————————————— China Medical Semiconductor Memory Market Report 2026-2032 | Digital Healthcare, AI Diagnostics and Connected Medical Devices Drive Demand 2026-09-22 · GlobeNewswire · AI, Healthcare, Semiconductors https://www.globenewswire.com/news-release/2026/09/22/3366638/28124/en/china-medical-semiconductor-memory-market-report-2026-2032-digital-healthcare-ai-diagnostics-and-connected-medical-devices-drive-demand.html Dublin, Sept. 22, 2026 -- "China Medical Semiconductor Memory Market: Prospects, Trends Analysis, Market Size and Forecasts up to 2032" has been added to ResearchAndMarkets.com's offering. ———————————————————————————————————————————————————————————— Used Semiconductor Equipment Market Outlook 2026-2030: Investment Trends, Strategic Profiles and Revenue Share Outlook 2026-09-22 · GlobeNewswire · Finance, AI, SaaS, Energy, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/09/22/3366631/28124/en/used-semiconductor-equipment-market-outlook-2026-2030-investment-trends-strategic-profiles-and-revenue-share-outlook.html Opportunities center on modular equipment, automotive electronics, solar cells and refurbishment, supported by AI marketplaces, Industry 4.0, IoT, cloud analytics and circularity Opportunities center on modular equipment, automotive electronics, solar cells and refurbishment, supported by AI marketplaces, Industry 4.0, IoT, cloud analytics and circularity ———————————————————————————————————————————————————————————— Global X Investments Canada Opens the Market 2026-09-22 · Newsfile · Finance, Semiconductors https://www.newsfilecorp.com/release/315421/Global-X-Investments-Canada-Opens-the-Market Toronto, Ontario--(September 22, 2026) - Chris McHaney, Executive Vice President, Head of Investment Management and Strategy, Global X Investments Canada Inc. ("Global X") joined Keith Wu, Head, Exchange Traded Products, Toronto Stock Exchange ("TSX"), to open the market and celebrate the launch of their seven new ETFs:Global X Asia Semiconductor Index ETF (TSX: ACHP)Global X Canadian Universe Bond Index ETF (TSX: AGGX)Global X S&P/TSX Capped Composite Index ETF (TSX:... ———————————————————————————————————————————————————————————— ASM launches breakthrough Flowable Carbon technology for the next era of semiconductor scaling 2026-09-22 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/09/22/3366547/0/en/asm-launches-breakthrough-flowable-carbon-technology-for-the-next-era-of-semiconductor-scaling.html Almere, the Netherlands September 22, 2026 ———————————————————————————————————————————————————————————— NVIDIA Isaac ROS 5.0 Advances Agentic, Open Source Robotics Development 2026-09-22 · NVIDIA · AI, Semiconductors https://blogs.nvidia.com/blog/isaac-ros-5-0-agentic-open-source-robotics/ To build and deploy sophisticated robotics applications that can perceive, reason and act in dynamic environments, developers need new physical AI models and tools. The ROS open framework is a project from Open Robotics that helps humans build robots. NVIDIA Isaac ROS 5.0 — a collection of GPU-accelerated packages built on ROS, released today at […] ———————————————————————————————————————————————————————————— Aeonsemi Unveils Praxium™ Multi-Gigabit Ethernet PHYs for Physical AI 2026-09-22 · PR Newswire · AI, Telecom, Semiconductors https://www.prnewswire.com/news-releases/aeonsemi-unveils-praxium-multi-gigabit-ethernet-phys-for-physical-ai-302885523.html Ultra-compact, low-power 10G/5G/2.5G Ethernet PHY family brings standards-based connectivity and flexible cabling to robots, autonomous vehicles and intelligent machines SANTA CLARA, Calif., Sept. 22, 2026 -- Aeonsemi, Inc., a fabless semiconductor company specializing in... ———————————————————————————————————————————————————————————— Cleanroom Lighting Market 2026: Pharma, Biotech and Semiconductor Expansion Fuels New Growth Opportunities 2026-09-22 · GlobeNewswire · Healthcare, Biotech & pharma, Semiconductors https://www.globenewswire.com/news-release/2026/09/22/3366062/28124/en/cleanroom-lighting-market-2026-pharma-biotech-and-semiconductor-expansion-fuels-new-growth-opportunities.html LED upgrades, smart IoT controls and recessed fixtures offer opportunities as pharma, biotech and chipmaking expand cleanrooms, led by Asia-Pacific and stricter compliance. LED upgrades, smart IoT controls and recessed fixtures offer opportunities as pharma, biotech and chipmaking expand cleanrooms, led by Asia-Pacific and stricter compliance. ———————————————————————————————————————————————————————————— China Telecom AI Officially Releases Xing4.0-29B Agentic Large Model for Single-GPU Deployment 2026-09-22 · GlobeNewswire · AI, Retail, Telecom, Semiconductors https://www.globenewswire.com/news-release/2026/09/22/3365958/0/en/china-telecom-ai-officially-releases-xing4-0-29b-agentic-large-model-for-single-gpu-deployment.html Compact footprint, full-scale capability—China's lightweight agentic large model runs locally on consumer-grade hardware while also powering enterprise production systems ———————————————————————————————————————————————————————————— The Global Semiconductor Market Accelerates as AI Computing, Advanced Nodes and Automotive Electronics Reshape Global Chip Demand 2026-09-21 · GlobeNewswire · Finance, AI, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/09/21/3365916/0/en/the-global-semiconductor-market-accelerates-as-ai-computing-advanced-nodes-and-automotive-electronics-reshape-global-chip-demand.html The Global Semiconductor Industry Size, Share, Growth, Revenue Trends & Segmentation Analysis by Component, Application, and Forecast 2026-2035. ———————————————————————————————————————————————————————————— Qnity Joins PHLX Semiconductor Sector Index (SOX) 2026-09-21 · Business Wire · Finance, Semiconductors https://finance.yahoo.com/technology/articles/qnity-joins-phlx-semiconductor-sector-200500645.html WILMINGTON, Del., September 21, 2026--Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that it has been added to the PHLX Semiconductor Sector Index (SOX). ———————————————————————————————————————————————————————————— Tensormesh Heads to The AI Conference 2026 With a Solution for Redundant GPU Compute 2026-09-21 · Business Wire · AI, Semiconductors https://finance.yahoo.com/technology/ai/articles/tensormesh-heads-ai-conference-2026-172500443.html SAN FRANCISCO, September 21, 2026--Tensormesh, the company pioneering caching-accelerated inference optimization for enterprise AI, will exhibit at The AI Conference 2026, Sept. 30 through Oct. 1 at Pier 48 in San Francisco. ———————————————————————————————————————————————————————————— Axcelis Announces Sponsorship and Participation in the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026) 2026-09-21 · PR Newswire · Finance, Semiconductors https://www.prnewswire.com/news-releases/axcelis-announces-sponsorship-and-participation-in-the-23rd-international-conference-on-silicon-carbide-and-related-materials-icscrm-2026-302883758.html BEVERLY, Mass., Sept. 21, 2026 -- Axcelis Technologies, Inc. (NASDAQ: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, will be participating in the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM... ———————————————————————————————————————————————————————————— fJscaler Announces Sampling of Breakthrough 100 GHz BiCMOS TIA for Next-Generation AI and Cloud Datacenter Optical Interconnects 2026-09-21 · Business Wire · AI, SaaS, Energy, Semiconductors https://finance.yahoo.com/technology/ai/articles/fjscaler-announces-sampling-breakthrough-100-112400710.html MÁLAGA, Spain, September 21, 2026--fJscaler, Inc., an innovator in high-performance analog and photonic semiconductors for optical interconnects, today announced at ECOC 2026 that it has begun sampling to strategic customers its BiCMOS transimpedance amplifier (TIA) for intensity-modulation direct-detection (IM-DD) applications. Designed for next-generation optical interconnects powering AI and cloud datacenters, the device delivers an unprecedented combination of energy efficiency, sensitivity, ———————————————————————————————————————————————————————————— Magnachip Announces Strategic Investment by Navitas Semiconductor 2026-09-21 · Business Wire · Finance, SaaS, Semiconductors https://finance.yahoo.com/technology/articles/magnachip-announces-strategic-investment-navitas-110000556.html SEOUL, South Korea, September 21, 2026--Magnachip Semiconductor Corporation (NYSE: MX) ("Magnachip" or the "Company"), a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions, today announced that Navitas Semiconductor Corporation (Nasdaq: NVTS) ("Navitas") has agreed to make a $5 million strategic equity investment in Magnachip. ———————————————————————————————————————————————————————————— SEALSQ, WISeKey and Canton of Jura Sign MoU to Establish a Swiss Post-Quantum Semiconductor and Cybersecurity Center 2026-09-21 · GlobeNewswire · Cybersecurity, Semiconductors https://www.globenewswire.com/news-release/2026/09/21/3365127/0/en/sealsq-wisekey-and-canton-of-jura-sign-mou-to-establish-a-swiss-post-quantum-semiconductor-and-cybersecurity-center.html DELÉMONT, Switzerland, Sept. 21, 2026 -- Proposed CHF 40-60 million public-private initiative aims to establish sovereign semiconductor personalization capabilities in Switzerland and create up to 250+ direct jobs in the Canton of Jura ———————————————————————————————————————————————————————————— MetaOptics Secures up to US$10 Million Investment Facility from White Lion Capital, Its First U.S. Institutional Investor, to Onshore Metalens Technology into the U.S. 2026-09-21 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/metaoptics-secures-up-to-us10-million-investment-facility-from-white-lion-capital-its-first-us-institutional-investor-to-onshore-metalens-technology-into-the-us-302884152.html SINGAPORE, Sept. 20, 2026 -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group"), a leading-edge semiconductor optics company pioneering metalens technology, today announced that it has secured an investment facility... ———————————————————————————————————————————————————————————— Media Alert: AMD to Showcase Physical AI and Robotics Innovation at ROSCon 2026 2026-09-21 · AMD · AI, SaaS, Semiconductors, Software & IT https://newsroom.amd.com/news/media-alert-amd-roscon-2026/ AMD will show how high-performance compute and open software can help developers train, simulate and deploy intelligent robotic systems from the cloud to the edge. ———————————————————————————————————————————————————————————— GMIF 2026 Speakers Unveiled: Samsung, Sandisk, Solidigm and More on the Lineup 2026-09-20 · PR Newswire · Education, Travel, Semiconductors https://www.prnewswire.com/news-releases/gmif-2026-speakers-unveiled-samsung-sandisk-solidigm-and-more-on-the-lineup-302883969.html SHENZHEN, China, Sept. 20, 2026 -- On September 23, the 5th Global Memory Innovation Forum (GMIF2026) will be held in Shenzhen, China, at the Renaissance Shenzhen Bay Hotel. Co-hosted by the Shenzhen Memory Industry Association and School of Integrated Circuits at Peking... ———————————————————————————————————————————————————————————— Ozi Amanat, Backer of Neuralink, SpaceX, xAI, Shield AI, Lambda, and Tenstorrent, Expands K2 Global’s Frontier Technology Investments 2026-09-19 · GlobeNewswire · AI, Aerospace & defense, Semiconductors https://www.globenewswire.com/news-release/2026/09/19/3364988/0/en/ozi-amanat-backer-of-neuralink-spacex-xai-shield-ai-lambda-and-tenstorrent-expands-k2-global-s-frontier-technology-investments.html Ozi Amanat’s K2 Global expands frontier technology investments across AI, robotics, healthcare, defense, semiconductors and compute. ———————————————————————————————————————————————————————————— Italy ASIC Market Outlook 2026–2031: Demand for Customized, High-Performance Chips Unlocks New Growth Opportunities 2026-09-18 · GlobeNewswire · AI, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/09/18/3364816/28124/en/italy-asic-market-outlook-2026-2031-demand-for-customized-high-performance-chips-unlocks-new-growth-opportunities.html Italy’s ASIC opportunities center on EVs, ADAS, industrial AI, edge computing and data centers, supported by chip design investment, advanced packaging and partnerships. Italy’s ASIC opportunities center on EVs, ADAS, industrial AI, edge computing and data centers, supported by chip design investment, advanced packaging and partnerships. ———————————————————————————————————————————————————————————— UAE ASIC Market Set for Strategic Growth Through 2031, Driven by Rising Demand for Custom, High-Performance Semiconductor Solutions 2026-09-18 · GlobeNewswire · AI, Semiconductors https://www.globenewswire.com/news-release/2026/09/18/3364811/28124/en/uae-asic-market-set-for-strategic-growth-through-2031-driven-by-rising-demand-for-custom-high-performance-semiconductor-solutions.html UAE demand for advanced ASICs is rising across AI, data centers, smart cities, IoT and defense, creating opportunities in chip design, security and low-power edge processing. UAE demand for advanced ASICs is rising across AI, data centers, smart cities, IoT and defense, creating opportunities in chip design, security and low-power edge processing. ———————————————————————————————————————————————————————————— SK hynix Launches 'SK hynix Ventures' in Silicon Valley to Expand Global AI Ecosystem Investment 2026-09-18 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/sk-hynix-launches-sk-hynix-ventures-in-silicon-valley-to-expand-global-ai-ecosystem-investment-302882993.html CEO Kwak Noh-Jung and key executives, alongside global VCs and startup leaders, attend the inaugural 'SK hynix Ventures Day' in Silicon Valley Company to expand investments across the entire AI ecosystem Discussing strategies to strengthen partnerships with global venture firms and... ———————————————————————————————————————————————————————————— AMD EPYC CPUs Deliver for Every Layer of the Agentic AI Stack 2026-09-18 · AMD · AI, Semiconductors https://newsroom.amd.com/news/amd-epyc-cpus-deliver-every-layer-agentic-ai-stack/ Agentic systems combine multiple CPU roles into a workflow. The latest AMD EPYC CPU generation lets customers optimize for each task – with flexibility for the future. ———————————————————————————————————————————————————————————— NovoLINC Launches MaxLINC, Achieving Industry-Leading 0.7 mm²•K/W Thermal Resistance for Multi-Kilowatt AI Chips 2026-09-17 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/novolinc-launches-maxlinc-achieving-industry-leading-0-7-mmkw-thermal-resistance-for-multi-kilowatt-ai-chips-302882340.html PITTSBURGH, Sept. 17, 2026 -- NovoLINC, an innovator in advanced thermal interface material (TIM) solutions for high-performance computing, today announced the launch of MaxLINC, a new generation of thermal interface material engineered for the rapidly increasing power and... ———————————————————————————————————————————————————————————— Microsoft Discovery lowers barriers to chip design 2026-09-17 · Microsoft · Semiconductors https://techcommunity.microsoft.com/blog/microsoft-discovery-blog/from-ad-astra-to-semper-disco-learning-chip-design-with-microsoft-discovery/4554904 The post Microsoft Discovery lowers barriers to chip design appeared first on Source. ———————————————————————————————————————————————————————————— MACOM Introduces 3.2T Chipset Solution for High Speed Optical Connectivity 2026-09-17 · GlobeNewswire · AI, SaaS, Semiconductors https://www.globenewswire.com/news-release/2026/09/17/3363939/19814/en/macom-introduces-3-2t-chipset-solution-for-high-speed-optical-connectivity.html MACOM's new front end 3.2 T chipset accelerates development of optical interconnects for AI, cloud data centers and high speed networking applications. ———————————————————————————————————————————————————————————— Shanghai Chengwei Semiconductor Equipment Expands Production Capacity for Chemical and Slurry Delivery Systems 2026-09-15 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/09/15/3362736/0/en/shanghai-chengwei-semiconductor-equipment-expands-production-capacity-for-chemical-and-slurry-delivery-systems.html Shanghai Chengwei Semiconductor Equipment Expands Production Capacity for Chemical and Slurry Delivery Systems ———————————————————————————————————————————————————————————— SQC Appoints Semiconductor Veteran John Hollister as Chief Financial Officer 2026-09-15 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/sqc-appoints-semiconductor-veteran-john-hollister-as-chief-financial-officer-302878527.html Hollister brings 25+ years of financial leadership across the global semiconductor industry, including previous CFO roles at GlobalFoundries and Silicon Labs SYDNEY, Sept. 15, 2026 -- Silicon Quantum Computing (SQC), a pioneer in quantum computing and atomic-precision... ———————————————————————————————————————————————————————————— ROHM Launches a MOSFET with Industry-Leading* Wide-SOA for Automotive Safety Functions and Protection Circuits 2026-09-15 · GlobeNewswire · Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/09/15/3362706/0/en/rohm-launches-a-mosfet-with-industry-leading-wide-soa-for-automotive-safety-functions-and-protection-circuits.html Santa Clara, CA and Kyoto, Japan, Sept. 15, 2026 -- ROHM Semiconductor today announced it has developed the RS4P063BPHZG, a 100V MOSFET optimized for automotive safety functions and protection circuits. The new product achieves industry-leading* Wide-SOA (Safe Operating Area) across a broad voltage range in the standard HPLF5060 (5060-size) package widely used in automotive applications. By incorporating a design that effectively suppresses secondary breakdown, it delivers approximately 5 times the SOA tolerance of standard equivalent-sized products under VDS=100V and PW=100μs. This contributes to greater reliability in automotive applications subject to momentary high-power loads, including airbag inflator ignition circuits and seatbelt pretensioner drive circuits. ———————————————————————————————————————————————————————————— MediaTek Dimensity 9600 Pro Sets New Standard for Flagship Smartphone Chips 2026-09-15 · PR Newswire · AI, Gaming, Semiconductors https://www.prnewswire.com/news-releases/mediatek-dimensity-9600-pro-sets-new-standard-for-flagship-smartphone-chips-302878749.html Advanced 2nm SoC delivers leap in performance and efficiency for agentic AI, gaming, imaging, and compute, including 61% drop in multi-core power consumption HSINCHU, Sept. 15, 2026 -- MediaTek, the world's number one provider of mobile chipsets, today announced the launch of... ———————————————————————————————————————————————————————————— NOTICE TO DISREGARD — HUHUTECH International Group Inc. 2026-09-15 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/09/15/3361653/0/en/notice-to-disregard-huhutech-international-group-inc.html WUXI, China, Sept. 15, 2026 -- We are advised by HUHUTECH International Group Inc. that journalists and other readers should disregard the news release “HUHUTECH International Group Awarded Follow-On Contract from Anchor Customer to Support Continued Capacity Expansion in the Arizona Semiconductor Corridor” issued May 28, 2026 over GlobeNewswire. ———————————————————————————————————————————————————————————— Circuits Integrated Secures Pre-Seed Funding from Evercurious to Accelerate CI-ONE Commercialization 2026-09-15 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/09/15/3361625/0/en/circuits-integrated-secures-pre-seed-funding-from-evercurious-to-accelerate-ci-one-commercialization.html Investment supports CIH’s transition from design services to semiconductor product company and advances roadmap for highly integrated RF solutions Investment supports CIH’s transition from design services to semiconductor product company and advances roadmap for highly integrated RF solutions ———————————————————————————————————————————————————————————— VPG Foil Resistors Partners with Source Technologi to Expand Footprint in India’s Aerospace & Defense, Telecom, and Semiconductor Sectors 2026-09-15 · GlobeNewswire · Finance, Telecom, Industrial, Aerospace & defense, Semiconductors https://www.globenewswire.com/news-release/2026/09/15/3361622/0/en/vpg-foil-resistors-partners-with-source-technologi-to-expand-footprint-in-india-s-aerospace-defense-telecom-and-semiconductor-sectors.html BENGALURU, India, Sept. 14, 2026 -- VPG Foil Resistors, a Vishay Precision Group, Inc. (NYSE:VPG) company, has announced a strategic partnership with Source Technologi to expand its presence across India. The collaboration focuses on delivering high-precision resistors to key growth industries, including Aerospace & Defense, Industrial Automation, Telecom Infrastructure, and Semiconductors. ———————————————————————————————————————————————————————————— Perplexity Portable Computer Is Now Available on Windows, Powered by NVIDIA RTX 2026-09-14 · NVIDIA · AI, Semiconductors https://blogs.nvidia.com/blog/local-ai-perplexity-windows-pcs/ As local models become more capable, AI agents can handle more work directly on a PC while keeping sensitive information on the device. Portable Computer is a local version of the agent Perplexity Computer that plans and carries out multistep tasks. Accelerated by NVIDIA GPUs, it uses local models to analyze data, bring together information […] ———————————————————————————————————————————————————————————— F-Secure and AMD Silo AI Help Secure Agentic AI Journeys 2026-09-14 · AMD · AI, SaaS, Semiconductors, Cloud & data centers https://newsroom.amd.com/news/f-secure-amd-silo-ai-help-secure-agentic-ai-journeys/ F-Secure and AMD Silo AI explore adaptive AI routing across local, private and cloud infrastructure to help keep user data secure as AI agents work. ———————————————————————————————————————————————————————————— RaserTech.com: From Geothermal Energy to AI GPU Infrastructure 2026-09-12 · GlobeNewswire · AI, Energy, Semiconductors https://www.globenewswire.com/news-release/2026/09/12/3360585/0/en/rasertech-com-from-geothermal-energy-to-ai-gpu-infrastructure.html NEW YORK, Sept. 12, 2026 -- RaserTech.com is an example of a company that did not simply survive change — it was reshaped by it. Founded in Utah in 2002, Raser Technologies originally operated in the energy and infrastructure space, where projects demanded heavy capital, deep technical expertise, and patience for long return cycles. That background matters, because it shows Raser Technologies was built in a difficult, asset-heavy environment long before it became associated with AI infrastructure. ———————————————————————————————————————————————————————————— Arteris Announces New Employment Inducement Grants 2026-09-11 · GlobeNewswire · Finance, AI, Semiconductors https://www.globenewswire.com/news-release/2026/09/11/3360524/0/en/arteris-announces-new-employment-inducement-grants.html CAMPBELL, Calif., Sept. 11, 2026 -- Arteris, Inc. (Nasdaq: AIP), a leading technology provider for accelerating semiconductor creation in the AI era, today announced that the company’s board of directors has granted equity awards to Saurabh Sinha, the company’s Chief Financial Officer, as inducement awards material to Mr. Sinha’s acceptance of employment with the company under the company’s 2022 Employment Inducement Incentive Plan. The grants were made in accordance with Nasdaq Listing Rule 5635(c)(4). ———————————————————————————————————————————————————————————— Defiance Launches AIFR, the First U.S.-Listed ETF Dedicated to Semiconductor Foundries 2026-09-11 · GlobeNewswire · Finance, AI, Automotive, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/09/11/3360067/0/en/defiance-launches-aifr-the-first-u-s-listed-etf-dedicated-to-semiconductor-foundries.html MIAMI, Sept. 10, 2026 -- Defiance ETFs, a leader in thematic and income ETFs, today announced the launch of the Defiance Global Foundries ETF (Nasdaq: AIFR), the first U.S.-listed ETF* dedicated to semiconductor foundries. AIFR is designed to provide targeted exposure to the manufacturing layer of the AI buildout: the companies that fabricate the chips designed by everyone else, from leading-edge AI accelerators to the power, analog, and embedded semiconductors inside every server, vehicle, and device. ———————————————————————————————————————————————————————————— ROHM’s New High Anti-Surge Chip Resistors SDR01 Series Achieve 0.33W Rated Power in the 0402 Size 2026-09-10 · GlobeNewswire · AI, Retail, Automotive, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/09/10/3360016/0/en/rohm-s-new-high-anti-surge-chip-resistors-sdr01-series-achieve-0-33w-rated-power-in-the-0402-size.html Santa Clara, CA and Kyoto, Japan, Sept. 10, 2026 -- ROHM Semiconductor today announced it has developed the “SDR01 Series” of high anti-surge chip resistors, delivering a class-leading* rated power of 0.33W in the 0402 (1005 Metric) size. Designed for electronic equipment where mounting densities continue to increase, the series is well suited for automotive, industrial, consumer electronics, and AI server applications. The new products help save board space and reduce component count by enabling replacement of larger-size resistors and consolidation of resistors while maintaining the reliability required of anti-surge chip resistors. ———————————————————————————————————————————————————————————— d-Matrix Adopts NVIDIA NVLink Fusion for Rack-Scale XPU Deployment 2026-09-10 · NVIDIA · AI, SaaS, Semiconductors https://blogs.nvidia.com/blog/d-matrix-nvlink-fusion/ AI inference chipmaker d-Matrix today announced it will use NVIDIA NVLink Fusion to connect its next-generation Raptor XPUs to NVIDIA’s AI infrastructure platform — joining a growing roster of ecosystem partners. By connecting Raptor to NVIDIA NVLink scale-up and Spectrum-X scale-out networking, the NVIDIA MGX rack architecture and the broader NVIDIA AI platform, NVLink Fusion […] ———————————————————————————————————————————————————————————— Himax to Showcase Industry-Leading Automotive Display and Cutting-Edge 3D Sensing Technologies at 2026 SID Vehicle Displays and Interfaces Symposium 2026-09-10 · GlobeNewswire · Finance, Automotive, Semiconductors https://www.globenewswire.com/news-release/2026/09/10/3359189/8267/en/himax-to-showcase-industry-leading-automotive-display-and-cutting-edge-3d-sensing-technologies-at-2026-sid-vehicle-displays-and-interfaces-symposium.html TAINAN, Taiwan, Sept. 10, 2026 -- Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or the “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced it will showcase its industry-leading automotive display portfolio and state-of-the-art 3D sensing technologies at the upcoming SID Vehicle Displays and Interfaces Symposium, taking place September 15 – 16, 2026 at Huntington Place in Detroit, Michigan. Organized by the Society for Information Display (SID), the symposium is one of the premier international events dedicated to automotive display and human–machine interface (HMI) technologies. ———————————————————————————————————————————————————————————— Marvell to Showcase End-to-End AI Data Center Connectivity Portfolio at AI Infra Summit 2026 2026-09-09 · Marvell Technology · Finance, Crypto, AI, Semiconductors, Cloud & data centers https://investor.marvell.com/news-events/press-releases/detail/1032/marvell-to-showcase-end-to-end-ai-data-center-connectivity-portfolio-at-ai-infra-summit-2026 Marvell Advanced Connectivity, Switching and Memory Solutions Power AI Infrastructure Across Every Distance, Improving Utilization, Token Efficiency and ROI SANTA CLARA, Calif.--Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its comprehensive portfolio of AI data center connectivity and memory solutions at AI Infra S ———————————————————————————————————————————————————————————— ‘Advanced Insights’: The Future of AI-Powered Storytelling (Video) 2026-09-09 · AMD · AI, Media, Semiconductors https://newsroom.amd.com/news/advanced-insights-future-ai-powered-storytelling-video/ Watch the latest video in the AMD series: Mark Papermaster of AMD and Kimball Thurston of Wētā FX discuss how AI, rendering, simulation and heterogeneous computing are reshaping visual effects. ———————————————————————————————————————————————————————————— From LEAP 2026 to What Comes Next: Advancing AI Across the Middle East 2026-09-09 · AMD · AI, Semiconductors, Government & policy https://newsroom.amd.com/news/leap-2026-advancing-ai-across-the-middle-east/ At the event in Saudi Arabia, AMD’s role helping governments, enterprises and partners build open AI infrastructure and turn investments into measurable business and economic value was on display. ———————————————————————————————————————————————————————————— Samsung and Mistral AI Announce Strategic Partnership for Intelligence-Driven Semiconductor Infrastructure 2026-09-08 · Samsung · AI, Industrial, Semiconductors https://news.samsung.com/global/samsung-and-mistral-ai-announce-strategic-partnership-for-intelligence-driven-semiconductor-infrastructure Samsung Electronics today announced it has entered into a strategic partnership with Mistral AI to enhance its semiconductor engineering and manufacturing capabilities that will reinforce its leadership in AI chip technologies. The announcement of the partnership was made during the state summit held in Paris between South Korea and France. Under the agreement, Samsung will […] ———————————————————————————————————————————————————————————— F-Secure and AMD Silo AI Demonstrate Unique Approach to Helping Secure Digital Journeys in Agentic AI Era 2026-09-08 · PR Newswire · AI, SaaS, Retail, Cybersecurity, Semiconductors https://www.prnewswire.com/news-releases/f-secure-and-amd-silo-ai-demonstrate-unique-approach-to-helping-secure-digital-journeys-in-agentic-ai-era-302872682.html F-Secure TrustPath and device-to-cloud compute platforms from AMD are intended to protect every step of the consumer digital journey HELSINKI, September 8, 2026 -- Global consumer cyber security leader F-Secure and leading AI lab AMD Silo AI have demonstrated how F-Secure... ———————————————————————————————————————————————————————————— Qualcomm Announces Multi-Generational Product Collaboration with Amazon to Build Next-Generation AI Data Center Infrastructure 2026-09-08 · PR Newswire · Finance, AI, Retail, Semiconductors https://www.prnewswire.com/news-releases/qualcomm-announces-multi-generational-product-collaboration-with-amazon-to-build-next-generation-ai-data-center-infrastructure-302871895.html Highlights Qualcomm collaborating with Amazon across multiple generations of customized silicon to support AWS's growing AI infrastructure. Qualcomm advanced optical connectivity solutions will support high-bandwidth interconnects within Amazon data center networks. SAN DIEGO, Sept. 8, 2026 -- Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced a multi-generation collaboration... ———————————————————————————————————————————————————————————— Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing 2026-09-08 · Samsung · AI, Industrial, Semiconductors https://news.samsung.com/global/samsung-electronics-and-asml-expand-strategic-collaboration-for-next-generation-semiconductor-manufacturing Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era. Building on years of successful cooperation, the companies will work together to accelerate the development and deployment […] ———————————————————————————————————————————————————————————— ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV 2026-09-08 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/09/08/3357321/0/en/asml-and-tsmc-announce-initiative-to-pioneer-industry-transition-to-large-format-photomasks-for-high-na-euv.html ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV ———————————————————————————————————————————————————————————— Autoliv Advances Vehicle Safety Through Virtual Testing 2026-09-08 · PR Newswire · Finance, SaaS, Automotive, Semiconductors https://www.prnewswire.com/news-releases/autoliv-advances-vehicle-safety-through-virtual-testing-302871392.html STOCKHOLM, Sept. 8, 2026 -- Autoliv, Inc. (NYSE: ALV) (SSE: ALIVsdb), the worldwide leader in automotive safety systems, is advancing the development of virtual testing through its Human Body Model (HBM) Safety Suite. The platform is designed to support the development of... ———————————————————————————————————————————————————————————— Crealights and GlobalFoundries Deepen Global Strategic Partnership 2026-09-08 · ACN Newswire · Finance, AI, SaaS, Automotive, Telecom, Industrial, Aerospace & defense, Semiconductors, Sustainability https://www.acnnewswire.com/press-release/english/109871/ HONGKONG/BEIJING, Sept 8, 2026 - September 7, 2026, Crealights (01191.HK) today officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries (NASDAQ: GFS, "GF"), a leading global semiconductor manufacturer. Leveraging GF's industry-leading silicon photonics technology, Crealights will vigorously advance the engineering deployment and mass production of its 6.4T NPO (Near-Package Optics) products, accelerating the industrialization of next-generation AI silicon photonic interconnect technologies. This strategic move will empower Crealights to consolidate its domestic market position while continuously expanding its footprint in North America and its global business landscape, marking a new phase in the company's global commercialization journey. Currently, global AI computing clusters are rapidly evolving from horizontal scaling (Scale-out) to vertical scaling (Scale-up). Facing the extreme demands of 10,000-card-scale hyperscale data centers for bandwidth density, power efficiency, and latency, Near-Package Optics (NPO) and Co-Packaged Optics (CPO) have emerged as mainstream solutions to overcome next-generation AI interconnect bottlenecks. By integrating and packaging the optical engine directly adjacent to the compute chip, these technologies significantly shorten the optoelectronic signal transmission path. Backed by its comprehensive and mature full-stack silicon photonic technology moat in both NPO and CPO, Crealights has taken the lead in launching 3.2T and 6.4T NPO optical engine products, demonstrating a robust technological advantage in next-generation high-speed AI interconnects. To comprehensively solidify the technological foundation for high-density optical interconnects in next-generation AI systems, Crealights has entered into a deep partnership with GlobalFoundries (GF). By deeply integrating GF's silicon photonics platform with SCALE™ Co-Packaged Optics (CPO) solutions, Crealights continues to build a comprehensive advantage integrating photonic integration, high-performance RF CMOS, advanced optical devices, and fiber optic connectivity. Currently, Crealights is collaborating with GF to establish a broad ecosystem of partners spanning design, packaging, connectivity, and system layers, fully supporting the deployment and implementation of diverse next-generation optical architectures. Meanwhile, leveraging GF’s scalable global manufacturing footprint and proven high-volume production capabilities, Crealights has established a "dual-track" global manufacturing system that operates in parallel both domestically and internationally. Through the efficient synergy of capacity at home and abroad, this strong alliance has not only significantly shortened the R&D cycle for next-generation optical interconnect products, but also achieved end-to-end integration across the entire chain—from local chip design to scaled delivery for customers in North America and worldwide. Together, they are paving a clear path from technology development to large-scale commercialization, effectively addressing the increasingly urgent demand for optical connectivity in AI computing clusters and hyperscale data centers. A spokesperson for Crealights stated: "Having consolidated our position in the domestic AI computing infrastructure market, Crealights is now driving its global expansion with core NPO and CPO technologies. Adding GF's global manufacturing network and silicon photonics process technology to our current silicon photonics ecosystem ensures a stable supply of next-generation silicon photonic products and completes the commercial closed-loop from local R&D to global delivery, continuously providing core interconnect solutions for large-scale AI computing clusters worldwide." Thomas Barber, Vice President of Communications Infrastructure and Data Center End Markets at GlobalFoundries, commented: "Crealights' comprehensive full-stack silicon photonic design capabilities are highly aligned with GF's strengths in scaled wafer manufacturing. Through global capacity synergy and advanced packaging technology empowerment, both parties will drive the large-scale market deployment of Crealights' products in North America and globally, jointly promoting the widespread application of silicon photonic technology in global AI computing infrastructure." Looking ahead, Crealights will continue to deepen their collaboration with GF across three key areas: joint R&D of cutting-edge technologies, global manufacturing capacity synergy, and the industrialization of NPO and CPO, as well as the co-building of the industry ecosystem. This will drive the global scaled deployment of silicon photonic solutions, unlocking more technological possibilities for AI-driven diverse application scenarios. About Crealights Crealights is a globally leading provider of AI silicon photonic interconnect solutions, dedicated to delivering high-speed, low-power optical interconnect products for AI data centers and hyperscale computing clusters. The company possesses end-to-end technical capabilities spanning silicon photonic chip design, wafer testing, and optical module manufacturing. Its core product portfolio covers 400G, 800G and 1.6T optical modules, Active Optical Cables (AOC), as well as NPO and CPO optical engines. Backed by its deep domestic industry foundation and global capacity layout, Crealights has become a key player in global AI computing interconnects.For more information, visit www.crealights.com. About GlobalFoundries  GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, please follow the WeChat Official Account: GLOBALFOUNDRIES_CN. Media Contact Ms. Claire Zhang TEL: (852) 5427 3696 E-mail: projectcrealights.list@everbloom.com.cn ———————————————————————————————————————————————————————————— AMD and Delhi University Collaborate to Build India’s AI Talent 2026-09-08 · AMD · AI, Education, Semiconductors https://newsroom.amd.com/news/amd-delhi-university-collaborate-build-india-ai-talent/ AMD will bring its AI Engage Developer Program to the University of Delhi with a goal of training as many as 10,000 students with hands-on AI skills over the next year. ———————————————————————————————————————————————————————————— Crealights Officially Included in Stock Connect, A New Capital Market Milestone for the AI Silicon Photonics Interconnect Pioneer 2026-09-07 · ACN Newswire · Finance, AI, SaaS, Telecom, Industrial, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/109841/ HONG KONG, Sept 7, 2026 - Crealights Technology Co., Ltd. (“Crealights” or the “Company”, Stock Code: 1191.HK) has been officially included as a constituent stock of the Hang Seng Composite Index, becoming eligible for the Stock Connect trading scheme starting today. Mainland investors can now trade the Company’s shares directly through the Stock Connect channels, which is expected to further broaden the Company’s investor base and enhance its share trading liquidity. This inclusion follows the Hang Seng Index Company's quarterly review results for the period ended June 30, 2026, announced on August 21, 2026. The inclusion deepens the Company’s connection with the onshore capital market, which is expected to attract greater long-term capital interest and provide more diversified capital market support for the Company’s long-term value growth. Continuous Financial Deliverables and Accelerated Product Structure Upgrades The Company released its post-listing interim results on August 28. During the reporting period, total revenue reached RMB798.5 million, representing a year-on-year increase of 14.4% and a half-on-half growth of 52.7%. The revenue contribution from silicon photonics products surged significantly from 15.3% in the same period last year to 39.0%, as the Company’s business structure continues to upgrade toward higher-speed and higher-value-added solutions. With 800G silicon photonics modules entering the volume shipment stage—supporting maximum transmission distances of up to approximately two kilometers—the Company’s large-scale commercial application capabilities in silicon photonics technology have been further validated. During the reporting period, R&D expenses increased by 58.5% year-on-year to RMB67.8 million, raising its proportion of total revenue to 8.5%. These investments were primarily channeled into continuous R&D for high-speed optical interconnects and next-generation silicon photonics products, securing technical reserves for subsequent product iteration and commercialization. Multi-Dimensional Growth Drivers to Capture Long-Cycle AI Infrastructure Dividends The accelerated construction of AI data centers has driven a sustained surge in demand for high-speed optical interconnects. The global market for AI optical modules is projected to maintain a compound annual growth rate of approximately 30% over the next five years, unlocking long-term growth opportunities for the silicon photonics and high-speed optical interconnect industries. Leveraging its end-to-end technological capabilities spanning silicon photonics chip design to optical module manufacturing, and bolstered by the secured supply of 10 million DSP chips, the Company has successfully consolidated its supply chain advantages. On the product front, the Company’s 800G silicon photonics optical modules have achieved volume shipments, and 1.6T products are scheduled to enter large-scale mass production in the second half of 2026. Meanwhile, the Company is actively deploying next-generation high-speed interconnection solutions such as PCIe 6.0/7.0 silicon photonics AOCs and 3.2T/6.4T NPO/CPO products. On the capacity and manufacturing front, it continues to advance expansion and AI-powered smart manufacturing to further improve mass production efficiency and yield rates. On the client side, it is deepening domestic JDM cooperation while continuously breaking through major North American core customers. Looking back at the first half of 2026, multiple key milestones were densely delivered, and long-term momentum is set to be continuously released. Entering the second half of the year, the Company will persistently enhance its competitiveness across capacity, manufacturing processes, products, and clients, capturing the long-term growth opportunities of the high-speed optical interconnect industry. This inclusion in Stock Connect marks a new milestone for the Company to connect with a broader capital market and march toward long-term value growth. About Crealights Technology Co., Ltd. (1191.HK) Crealights Technology Co., Ltd. is a joint-stock company incorporated in the People's Republic of China with limited liability, whose shares are listed on the Main Board of The Stock Exchange of Hong Kong Limited (Stock Code: 1191.HK). Rooted in the forefront of optical communications, the Company focuses on the R&D, manufacturing, and sales of high-speed optical interconnection products, dedicated to providing high-performance and highly reliable optical communication solutions for global data centers, cloud computing, and telecommunication network customers. Led by its founder and CEO, Dr. Chaoyang Hu, the Company has established a solid market position and an exceptional industry reputation in the high-speed optical transmission field, underpinned by outstanding R&D innovation capabilities, rigorous quality management, and a comprehensive supply chain layout. ———————————————————————————————————————————————————————————— MINISFORUM Unveils Next-Gen Edge AI Computing Solutions Powered by AMD Ryzen AI MAX+ PRO 495 at IFA 2026 2026-09-04 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/minisforum-unveils-next-gen-edge-ai-computing-solutions-powered-by-amd-ryzen-ai-max-pro-495-at-ifa-2026-302868979.html BERLIN, Sept. 4, 2026 -- MINISFORUM, a Global Edge Computing Solution Brand & System Integrator, today unveiled two new local AI computing solutions powered by the AMD Ryzen™ AI MAX+ PRO 495 processor: the AI Mini Workstation MS-S1 MAX-P495 and the AI Agent NAS N5 MAX-P495.... ———————————————————————————————————————————————————————————— ACEMAGIC First to Introduce Ryzen AI Max+ PRO 495 AI Mini Workstation at IFA 2026 2026-09-04 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/acemagic-first-to-introduce-ryzen-ai-max-pro-495-ai-mini-workstation-at-ifa-2026-302869684.html BERLIN, Sept. 3, 2026 -- ACEMAGIC will exhibit its latest computing products at IFA 2026, taking place from September 4 to 8 at Messe Berlin, Hall 6.2, Booth 128. Among the products on display is the F9A AI mini workstation powered by the AMD Ryzen AI Max+ PRO 495 processor.... ———————————————————————————————————————————————————————————— Skyworks to Present at the Goldman Sachs Communacopia and Technology Conference 2026-09-03 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/09/03/3355872/0/en/skyworks-to-present-at-the-goldman-sachs-communacopia-and-technology-conference.html IRVINE, Calif., Sept. 03, 2026 -- Skyworks Solutions, Inc. (Nasdaq: SWKS), an innovator of high-performance analog and mixed-signal semiconductors connecting people, places and things, today announced that executives will participate in a fireside chat at the Goldman Sachs Communacopia and Technology Conference in San Francisco at 2:25p.m. PDT on Sept. 10, 2026. ———————————————————————————————————————————————————————————— Xunce Technology Launches TokenCloud, Redefining the Value of Computing Power Through Full-Chain AI Infrastructure and Securing a Leading Position in the Token Economy Era 2026-09-03 · ACN Newswire · Crypto, AI, SaaS, Real estate, Energy, Telecom, Industrial, Cybersecurity, Semiconductors https://www.acnnewswire.com/press-release/english/109762/ HONG KONG, Sept 3, 2026 - On September 3, Xunce Technology (3317.HK) officially launched the TokenCloud all-in-one AI model training and deployment computing power platform. As the hardware resources and infrastructure that facilitate the conversion of data resources into tokens, TokenCloud builds a four-tier, synergistic ecosystem based on heterogeneous computing devices, powered by mainstream algorithmic models, fueled by multi-source internal and external data, and serving vertical industry clients. It is dedicated to establishing a full-chain value pathway from data to tokens, enabling every piece of data to securely and efficiently unlock its intelligent value, and helping industries across the board transform data resources into genuine AI productivity. The launch of TokenCloud marks Xunce Technology’s formal establishment of a full-chain product closed-loop encompassing “computing power—data—tokens—models—applications.” This achievement signifies a leap from a “digital foundation” to an “AI productivity platform,” securing a strategic vantage point in the token economy era while providing the industry with a model for AI infrastructure that bridges the entire “data-to-token” value chain. Building a Scenario-Driven, End-to-End Closed Loop to Provide Out-of-the-Box AI Infrastructure As enterprise AI applications shift from “proof of technical feasibility” to “competition in engineering efficiency,” systemic challenges—such as computing power shortages, difficulties in model selection, hardware compatibility issues, challenges in optimized deployment, and significant security concerns—are becoming the biggest bottlenecks hindering AI implementation. TokenCloud was created precisely to address these pain points. Positioned as the core “hardware and energy foundation” at the upstream of the token industry chain, it adheres to the principle of “ensuring every unit of computing power precisely serves every enterprise AI scenario.” It has built a complete closed-loop process spanning “scenario identification → model selection → hardware matching → training optimization → secure delivery.” Based on business scenarios and tasks, it intelligently recommends the optimal model and matches it with the most suitable hardware. It then uses distillation optimization to enable lightweight, “specialized” models to achieve accelerated inference with high accuracy, all the way through to secure delivery. With each step seamlessly linked, it provides enterprise customers with out-of-the-box AI infrastructure. In terms of product design, TokenCloud adopts a “full-chain visualization” philosophy, integrating the previously disparate processes of model selection, computing power configuration, security management, and cost assessment in AI deployment into a unified decision-making platform. Comprising five core modules—solution selection, model distillation, data security management, computing power acceleration, and computing resource management—this platform shifts enterprise AI deployment from “rule-of-thumb” approaches to “data-driven decision-making.” It ensures that the return on investment for every computing power allocation is clearly quantifiable, achieving a dynamic balance among performance, cost, and security. Four Core Capabilities Build Competitive Barriers and Enable Deep Synergy Between Models and Computing Power The actual value of a token is determined by four key metrics: first-character latency, generation speed, concurrent processing capacity, and service stability. Through Hardware-Software Co-Optimization, TokenCloud enables the large-scale supply of high-quality tokens—ensuring that every piece of data unleashes its maximum token value through the optimal combination of models and hardware. Specifically, TokenCloud has established industry-leading technological barriers through four core capabilities: a heterogeneous hardware platform, Cloud-Edge Collaboration Architecture, model evaluation and optimization, and secure isolation: Heterogeneous Hardware Platform—Integrates diverse computing resources such as GPUs, NPUs, FPGAs, and CPUs to enable unified management and intelligent scheduling across architectures. It supports full-scenario coverage ranging from hundreds to tens of thousands of cards, abstracting underlying, disparate hardware resources into unified computing units. Cloud-Edge Synergy Architecture—Establishes a hybrid deployment model combining “cloud computing power and on-premises computing power,” enabling elastic scaling to handle large-scale training and high-concurrency inference while ensuring that enterprises’ raw data remains within secure domains. This allows enterprises to enjoy cloud computing power while maintaining full data sovereignty at all times. Model Evaluation and Optimization System—Establishes a comprehensive evaluation framework covering foundational capabilities, scenario adaptation, engineering optimization, and ecosystem value. It supports task-specific distillation optimization, transferring the core capabilities of large models to lightweight scenario-specific models, thereby significantly reducing inference latency and hardware costs while maintaining high accuracy. Of particular importance is computing power acceleration—while chip computing power continues to rise, actual effective throughput remains far below theoretical peak values. Through end-to-end acceleration capabilities, TokenCloud significantly reduces first-token latency and enhances concurrent processing capacity, transforming acceleration cards from “waiting for computation” to “continuous computation.” This enables enterprises to support larger business volumes without additional hardware, achieving the optimal balance between accuracy, speed, cost, and deployment efficiency, and enabling the large-scale supply of high-quality tokens. Security Isolation Mechanism—We build a multi-layered security protection system where data visibility is tiered and data flow is fully traceable throughout its entire journey. Highly sensitive data is 100% locked within the enterprise’s local security domain, with a three-pronged approach combining multi-tenant isolation, encrypted transmission, and access control. Unlike simple computing power rental platforms or model service platforms on the market, TokenCloud achieves deep synergy between models and computing power—the platform centrally determines the degree of model distillation and the hardware for deployment, ensuring the optimal balance of accuracy, speed, cost, and efficiency. It provides enterprise customers with a comprehensive, one-stop service solution—from model selection and hardware matching to distillation optimization—covering the entire “computing power—data—Token—model—application” chain to accelerate the implementation of enterprise AI. Software and Hardware Synergy Closes the Full-Path Loop; Full-Stack AI Products Accelerate Industry Adoption The launch of TokenCloud has enabled Xunce Technology’s full-path product ecosystem to form a complete commercial loop. Previously, the company had introduced the world’s first TokenOS operating system; the two systems have clearly defined roles and operate in synergy. TokenOS focuses on data capabilities, transforming enterprises’ multi-source, heterogeneous data into standardized scenario-based Tokens in real time, thereby addressing the issue of “data usability.” TokenCloud focuses on model training and deployment, as well as “data + model” integration capabilities. It integrates computing power scheduling, model inference optimization, and the refinement, tuning, and orchestration of enterprise-level small models, bridging the entire chain from data ingestion to application deployment and providing hardware service support for Token generation. Through this synergy between software and hardware, combined with the underlying AIDP data resource processing service system and the top-level TokenRouters model outcomes service and scenario integration and exchange center, the two solutions together form a complete “computing power—data—Token—model—application” closed-loop ecosystem. This enables enterprises to significantly reduce deployment costs and improve matching efficiency through the synergy of computing power, data, and models. Xunce Technology has also undergone a comprehensive upgrade from an AI real-time data infrastructure service provider to an integrated AI-to-B infrastructure service provider. Furthermore, Xunce Technology has partnered with multiple domestic GPU manufacturers to focus on the integration of “computing power and data.” As the localization of the full AI stack enters the stage of systematic engineering optimization, TokenCloud has become a key hub connecting domestic heterogeneous computing power with enterprise AI applications, offering significant strategic value within the ecosystem. Currently, the company has expanded into eleven high-value industries, including finance, telecommunications, power, energy, high-end manufacturing, biomedicine, robotics training, commercial space, urban operations, the low-altitude economy, and smart vehicles. In the first half of 2026, the Token business model was successfully implemented in high-value scenarios such as biomedicine, energy dispatch, and industrial quality inspection, laying the groundwork for cross-industry replication. The ultimate goal of computing power is not to simply stack chips, but to ensure that every piece of data can be securely and efficiently converted into token value. As AI transitions from the “model competition” phase to the “deployment competition” phase, enterprises need not isolated computing power or isolated models, but rather an integrated infrastructure capable of combining computing power, data, and models to truly adapt to enterprise business scenarios. Positioned as an integrated AI infrastructure, TokenCloud enables computing power to serve models, models to serve scenarios, and scenarios to generate value, thereby laying a solid computing power foundation for the AI transformation of China’s myriad industries. ———————————————————————————————————————————————————————————— Sivers Semiconductors Invests USD 30 Million to Expand European Photonics Manufacturing for AI Datacenters 2026-09-03 · PR Newswire · AI, Industrial, Semiconductors https://www.prnewswire.com/news-releases/sivers-semiconductors-invests-usd-30-million-to-expand-european-photonics-manufacturing-for-ai-datacenters-302868705.html Glasgow expansion will increase InP manufacturing capacity to more than 100 million CW DFB lasers annually, supporting anticipated AI infrastructure customer ramps KISTA, Sweden, Sept. 3, 2026 -- Sivers Semiconductors AB (STO: SIVE) today announced a USD 30 million strategic... ———————————————————————————————————————————————————————————— Scientek and Classiq Partner to Accelerate Quantum Software Adoption in Taiwan 2026-09-02 · GlobeNewswire · SaaS, Semiconductors https://www.globenewswire.com/news-release/2026/09/02/3355583/0/en/scientek-and-classiq-partner-to-accelerate-quantum-software-adoption-in-taiwan.html Scientek & Classiq agreed to expand access to Classiq’s quantum software platform in Taiwan’s semiconductor, research and academic communities. ———————————————————————————————————————————————————————————— Broadcom Inc. Announces Third Quarter Fiscal Year 2026 Financial Results and Quarterly Dividend 2026-09-02 · Broadcom · Finance, Semiconductors, Investing & markets https://www.prnewswire.com/news-releases/broadcom-inc-announces-third-quarter-fiscal-year-2026-financial-results-and-quarterly-dividend-302868129.html Revenue of $29.6 billion for the third quarter, up 86 percent from the prior year period GAAP operating income of $16.0 billion for the third... ———————————————————————————————————————————————————————————— MulticoreWare Acquires Simulus Automation to Expand Semiconductor Engineering Capabilities 2026-09-02 · PR Newswire · AI, Semiconductors https://www.prnewswire.com/news-releases/multicoreware-acquires-simulus-automation-to-expand-semiconductor-engineering-capabilities-302867811.html Bringing hardware design and verification in-house, MulticoreWare expands its silicon-to-solution capabilities from architecture to production. SAN JOSE, Calif., Sept. 2, 2026 -- MulticoreWare, Inc., a global technology company delivering AI software solutions, accelerated... ———————————————————————————————————————————————————————————— GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform 2026-09-02 · GlobeNewswire · AI, SaaS, Semiconductors https://www.globenewswire.com/news-release/2026/09/02/3355121/0/en/globalfoundries-and-raaam-memory-technologies-announce-the-joint-development-of-next-generation-gcram-technology-and-test-chip-on-fdx-platform.html Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and up to 60% power reduction compared to commodity SRAM Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and up to 60% power reduction compared to commodity SRAM ———————————————————————————————————————————————————————————— ChipAgents Helps Andes Technology Dramatically Accelerate Custom Processor Design and Verification 2026-09-02 · Business Wire · AI, Semiconductors https://finance.yahoo.com/technology/ai/articles/chipagents-helps-andes-technology-dramatically-120000570.html SANTA CLARA, Calif., September 02, 2026--ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced that Andes Technology, a leading supplier of RISC-V processor IP and a Founding Premier member of RISC-V International, has successfully deployed ChipAgents across multiple processor design and verification projects. In production deployments, Andes reduced a processor customization task from 8.5 weeks to six weeks, a 30% reduction in development time, ———————————————————————————————————————————————————————————— Linkhome Establishes AI Computing Subsidiary Linkhome Technologies and Begins Preliminary Evaluation of a Proposed European AI Computing Project That Could Involve Up to 144 NVIDIA GB300 GPUs 2026-09-02 · GlobeNewswire · Finance, AI, Semiconductors https://www.globenewswire.com/news-release/2026/09/02/3355055/0/en/linkhome-establishes-ai-computing-subsidiary-linkhome-technologies-and-begins-preliminary-evaluation-of-a-proposed-european-ai-computing-project-that-could-involve-up-to-144-nvidia.html IRVINE, Calif., Sept. 02, 2026 -- Linkhome Holdings Inc. (Nasdaq: LHAI) (“Linkhome” or the “Company”), an artificial intelligence-driven technology company, today announced the formation of its wholly owned subsidiary, Linkhome Technologies Inc. The new subsidiary is intended to focus on AI computing infrastructure, enterprise AI solutions, robotics and high-performance computing services. ———————————————————————————————————————————————————————————— Battalion Advanced Technology and Penn State University launch research collaboration focused on national security 2026-09-02 · PR Newswire · SaaS, Education, Semiconductors https://www.prnewswire.com/news-releases/battalion-advanced-technology-and-penn-state-university-launch-research-collaboration-focused-on-national-security-302866710.html Two projects led by Materials Research Institute scientists and in partnership with Battalion Advanced Technology Ltd aim to advance semiconductor integration and high temperature alloys for national security applications. LONDON, Sept. 2, 2026 --Penn State and Battalion... ———————————————————————————————————————————————————————————— Phison Expands European Operations with Regional Office and Executive Appointments 2026-09-02 · Business Wire · Semiconductors https://finance.yahoo.com/technology/articles/phison-expands-european-operations-regional-060000438.html ESCHBORN, Germany, September 02, 2026--Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced the expansion of its European operations with the opening of its inaugural local entity in Eschborn, Germany, and the appointments of Ingvar Ersson as GM & President, EMEA, and Antony Zukowski as Regional Director, EMEA, for Phison Electronics Europe GmbH. The expansion strengthens Phison's investment in Europe and reinforces its commitment to suppo ———————————————————————————————————————————————————————————— Rigaku Launches CT Lab HR160 High-Resolution X-ray CT System 2026-09-01 · Business Wire · Energy, Semiconductors https://finance.yahoo.com/technology/articles/rigaku-launches-ct-lab-hr160-150000224.html TOKYO, September 01, 2026--Rigaku Corporation, a global solutions partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (Headquarters: Akishima, Tokyo; President and CEO: Jun Kawakami; "Rigaku"), today announced the launch of the CT Lab HR160, a high-resolution X-ray computed tomography (CT) system for battery, semiconductor devices, electronic components, and advanced materials analysis. The system is developed in collaboration with Excillum AB, the global sourc ———————————————————————————————————————————————————————————— A-110: A Fully Noncontact Air Bearing Stage for Nanometer-Precision Motion in a Compact Design 2026-09-01 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/a-110-a-fully-noncontact-air-bearing-stage-for-nanometer-precision-motion-in-a-compact-design-302865092.html No Contact, No Lubrication, No Wear — Engineered for Optics, Semiconductor, and Metrology Applications SHREWSBURY, Mass., Sept. 1, 2026 -- The A-110 PIglide Linear Stage uses noncontact air bearing guidance, direct-drive motor technology, and high-resolution encoder feedback... ———————————————————————————————————————————————————————————— Navitas Delivers Latest Gen 5 GaNFast™ Manufactured in the U.S. Through GlobalFoundries Partnership to Accelerate AI Infrastructure 2026-09-01 · GlobeNewswire · AI, Industrial, Logistics, Semiconductors https://www.globenewswire.com/news-release/2026/09/01/3354123/0/en/navitas-delivers-latest-gen-5-ganfast-manufactured-in-the-u-s-through-globalfoundries-partnership-to-accelerate-ai-infrastructure.html Combining Navitas’ proprietary Gen 5 GaNFast™ technology and expertise with GlobalFoundries’ advanced U.S. 200mm manufacturing and process baseline strengthens U.S. leadership in GaN and secures the domestic supply chain for next-generation AI and critical infrastructure ———————————————————————————————————————————————————————————— Merge Labs and Butterfly Network Partner to Advance Ultrasound-Based Brain-Computer Interfaces 2026-09-01 · Business Wire · Finance, AI, SaaS, Semiconductors https://finance.yahoo.com/healthcare/articles/merge-labs-butterfly-network-partner-120500984.html BURLINGTON, Mass. & NEW YORK, September 01, 2026--Butterfly Network, Inc. ("Butterfly") (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound, programmable cloud software and AI, and Merge Labs today announced a multi-year licensing agreement through Butterfly Embedded™. ———————————————————————————————————————————————————————————— TP-Link Unveils World’s First Complete Wi-Fi 8 Lineup at IFA 2026 — Regional Pre-Orders to Start on September 30th 2026-09-01 · Business Wire · Retail, Semiconductors https://finance.yahoo.com/technology/articles/tp-unveils-world-first-complete-040000652.html BERLIN, September 01, 2026--TP-Link Systems Inc., a global provider of consumer networking products, today unveiled its first Wi-Fi 8 lineup at IFA 2026, led by the Archer 8 Ultra router and the Deco 8 Ultra mesh system. Built on the upcoming IEEE 802.11bn standard, the growing lineup will pair Wi-Fi 8 chipsets from Broadcom, Qualcomm, and MediaTek with TP-Link's U.S.-led hardware and software engineering to deliver the most reliable Wi-Fi ever built. ———————————————————————————————————————————————————————————— JF SmartInvest Holdings Ltd Announces 2026 Interim Results 2026-09-01 · ACN Newswire · Finance, Crypto, AI, SaaS, Automotive, Media, Education, Semiconductors https://www.acnnewswire.com/press-release/english/109666/ HIGHLIGHTS: - Gross billings amounted to approximately RMB1,679.8 million, representing a slight decrease of 1.5% from approximately RMB1,705.4 million in the Corresponding Period, with business fundamentals remaining robust. - Total revenue was approximately RMB1,290.0 million, and profit attributable to Shareholders was approximately RMB32.3 million. - As of the end of the Reporting Period, the balance of contract liabilities was approximately RMB1,889.4 million, which will primarily be recognized as revenue for 2026 and 2027. HONG KONG, Sep 1, 2026 - 31 August, JF SmartInvest Holdings Ltd (the "Company”; together with its subsidiaries, the "Group" or "We") announces its unaudited interim results for the six months ended 30 June 2026 (the "first half of 2026" or the "Reporting Period"). Sound Financial Performance with Contract Liabilities Rise Sharply to Support Future Performance During the Reporting Period, under the dual-driver strategy of “technology + investment research”, the Group continued to advance product innovation, AI application and investment research capabilities, maintaining a stable development momentum. Gross billings amounted to approximately RMB1,679.8 million, representing a slight decrease of approximately 1.5% from the Corresponding Period in 2025. Total revenue was approximately RMB1,290.0 million, the non-HKFRS adjusted profit for the period (i.e. excluding the share-based compensation expense) amounted to approximately RMB113.7 million, the profit for the period was approximately RMB31.9 million, and the profit attributable to Shareholders was approximately RMB32.3 million. The changes in revenue and profit were primarily because the majority of orders during the Reporting Period were derived from repurchases by existing customers, and the provision of services for most of these orders had not yet commenced. Such order amounts are expected to be gradually recognized as revenue in subsequent reporting periods upon the commencement of services.  As of the end of the Reporting Period, the balance of contract liabilities amounted to approximately RMB1,889.4 million, representing a substantial year-on-year increase of approximately 133.6%. These contract liabilities will primarily be recognized as revenue for 2026 and 2027, providing solid support for subsequent performance. Leveraging its sound financial position and ample cash reserves, the Group consistently places great emphasis on Shareholder returns. During the Reporting Period, it repurchased a total of 4,440,800 Shares at an aggregate consideration of approximately HK$134 million, fully demonstrating the management’s confidence in the Company’s long-term development prospects. Overseas Business Breakthrough and Globalizations Advancement During the Reporting Period, the Group continued to deepen its strategy of “diversifying product layout domestically + exploring business overseas”. In terms of overseas business, the Group completed the strategic acquisitions of entities including Forthright Securities and Forthright Capital (collectively referred to as “Forthright”) in January 2026. The Group established “dedicated investment advisory”, “in-depth investment research” and “AI intelligent investment” as its core engines, and adopted a dual-track approach to serve mass and private wealth clients by integrating online efficiency with offline trust, advancing various business integrations and infrastructure development in an orderly manner. Since the beginning of 2026, Forthright SmartInvest App successively launched batch trading functions for US stocks and Hong Kong stocks, with core functions such as AI assistant, AI stock diagnosis, intelligent stock selection, and AI account analysis deeply integrated into usage scenarios. The Forthright AI Stock Machine was officially launched in July 2026. The flagship store located in Sheung Wan, Hong Kong, has been put into operation, reaching a broader customer base through pop-up stores and shopping mall events. In terms of licences and qualifications, Forthright have been approved by the SFC for the addition of virtual asset-related service qualifications, and virtual asset dealing services were launched in July 2026, forming a full-chain service capability covering virtual asset dealing, investment advisory, and asset management. AI Agent Full-Stack AI Technology System Empowers as Intelligent Investment Advisory Services Enter the Application Stage With “AI+” as its core, the Group focused on the three major pillars of multi-agents, large models, and high-quality financial data to establish a full-stack AI product system, driving the paradigm shift in AI capabilities from “tool-based applications” to an “agent ecosystem”. During the Reporting Period, the number of FinSphere AI Agent users increased by approximately 50.9% year-on-year, with the number of effective interactions reaching 20.335 million, representing a year-on-year increase of approximately 50.5%. The To-C AI Q&A token consumption reached approximately 254.3 billion, roughly 8 times the level in the Corresponding Period, signalling that intelligent investment advisory services have entered the phase of large-scale application. In August 2026, FinSphere AI Agent was officially integrated into Tencent WorkBuddy and Alibaba Qwen Platform, becoming an officially certified securities domain expert on the platforms. In the first half of the year, the Group continued to drive the deep integration of AI technologies with specific business scenarios and product service workflows, extending AI capabilities from single-point products to the full business matrix. The Group concurrently upgraded “AI Xiaojiu Steward”, launching features including AI stock diagnosis, AI stock selection, AI stock monitoring, and AI post-investment review; Decision Master upgraded its exclusive Q&A intelligent agent “AI Xiaoce”; and Forthright SmartInvest App launched exclusive functions such as AI account diagnosis and AI position analysis. During the Period, the Group also launched the digital employee assistant “AIX” and built an AI content centre reaching 3.109 million users, processing a daily average of approximately 1.5 million customer messages. Research and development expenses for the Reporting Period amounted to approximately RMB167.1 million (representing approximately 13.0% of revenue), with 657 R&D personnel. As of the end of the Reporting Period, the Group had 167 software copyrights and patents, representing a year-on-year increase of 28. Upgrading Product Matrix with AI and Quantitative Capabilities In the first half of 2026, the Group continued to deepen its diversified product strategy, and the synergistic effects of its multi-level product system gradually emerged. The VIP products steadily iterated around “AI + Quantitative”, launching the Xingtou Quantitative Platform and introducing multiple quantitative indicators such as the Sentiment Barometer , as well as 6 AI quantitative strategy portfolios. Decision Master launched the “Premium Version”, achieving an upgrade from delivery of viewpoints and content to full-process decision-making support, with AI services covering approximately 55% of active users during the Reporting Period. The Enjoy-Stock Pad launched the new-generation “Intelligent Navigation Edition”, covering six core AI functions. Jiuyao Stocks continuously enriched its small-denomination product matrix, with the AI upgrade coverage rate of its products reaching 43%. Star-tier Services created a closed-loop ecosystem of “tools-services-trading”, continuously enriched premium functional modules. Through its tiered product matrix, the Group precisely addressed the differentiated needs of investors ranging from entry-level to advanced users. The enhancement of product capabilities directly drove steady growth in user scale and operational performance. During the Reporting Period, the number of paying users reached 462,217. The Group operated approximately 1,180 accounts on different internet platforms, attracting over 73 million followers. Monthly active users of SmartInvest App increased by approximately 15% year-on-year, with a 30-day retention rate exceeding 60%. Service quality improved simultaneously, with the refund rate for VIP products further optimized to approximately 19.8%, representing a decrease of 4.8 percentage points from the Corresponding Period, and user satisfaction steadily increased. Deepening Investment Research with Breakthroughs in Density and Depth The Group continuously deepened its “1 research institute and N business lines” investment research system, with JF Financial Research Institute as the core. It adhered to the “buyer-side investment advisory” philosophy and combined AI technology for service efficiency enhancement. This empowered user service scenarios, product capability optimization, and employees” professional standards. During the Reporting Period, the institute cumulatively conducted 336 research sessions on listed companies, representing a year-on-year increase of approximately 270 sessions. It also undertook on-site visits to more than 20 cities nationwide, covering more than 10 trending industries including biomedical science, mechanical equipment, and electronic semiconductors. Concurrently, the institute newly established a quantitative research team, supported by a supercomputing system and a quantitative factor library covering A-shares and ETFs. The quantitative products have been incorporated into the VIP business service system. As of the end of the Reporting Pemachinriod, the Group had 625 employees who possessed qualifications for securities investment advisors and 2,745 employees who possessed qualifications for securities practitioners. Adopting postdoctoral cultivation as a long-term talent strategy, the Group continuously enhances its competitiveness in investment research. Future Outlook The chairman of the Board and chief executive officer of JF SmartInvest Holdings Ltd, Mr. Chen Wenbin said: “In the first half of 2026, we consistently adhered to the dual-driver strategy of “technology + investment research”, and our overall development remained robust. During the Reporting Period, gross billings remained generally stable year-on-year, and contract liabilities grew substantially, accumulating ample momentum for subsequent performance release. We successfully completed the strategic acquisitions of Forthright, achieving a key milestone in our overseas expansion. AI capabilities are accelerating their penetration across the entire product matrix, the “1+N” investment research system continues to deepen with significant improvements in research density and depth, and all strategic deployments have made substantial progress. Looking ahead, the Group will firmly implement its Group-wide AI technology strategy, driving the continuous evolution of AI capabilities from “tool-based applications” to an “agent ecosystem”. At the same time, we will deepen our globalization strategy, leveraging Forthright as platforms and taking “dedicated investment advisory”, “in-depth investment research” and “AI intelligent investment” as core engines to build a new generation of internet securities brokerage and cultivate a second growth curve. We will continue upgrading product functions, enriching our product matrix, and precisely addressing investors' diverse needs across all levels and markets. In addition, we will optimize our omni-domain traffic system to drive synergy between public and private channels, further strengthening user stickiness. We are committed to making investment and wealth management simpler and more professional, and enhancing the sense of happiness in investment and wealth management.” About JF SmartInvest Holdings Ltd (Stock Code: 9636) JF SmartInvest Holdings Ltd is a next-generation stock investing assistant, providing individual investors with equity investment tools, securities investment advisory, investor education and other services, with product offerings including Stock Navigator, Super Investor, Decision Master, Enjoy-Stock Pad, Jiuyao Stocks and Star-tier Services. Through the “Technology + Investment Research” model, the Company develops AI products such as FinSphere AI Agent based on artificial intelligence (AI) and big data technology, achieving innovative industry practices and scenario applications. Overseas, the Company conducts securities-related businesses in Hong Kong through licensed entities such as Forthright Securities and Forthright Capital. Taking “dedicated investment advisory”, “in-depth investment research” and “AI intelligent investment” as its core engines, the Company is committed to building a new generation of internet securities brokerage in the AI era. For enquiries, please contact: Financial PR (HK) Limited Email: ir@financialpr.hk Tel: 852 2610 0846 Fax: 852 2610 0842 ———————————————————————————————————————————————————————————— Samsung Expands the Galaxy Book6 Lineup, Making Galaxy Book More Accessible 2026-09-01 · Samsung · AI, Energy, Semiconductors https://news.samsung.com/global/samsung-expands-the-galaxy-book6-lineup-making-galaxy-book-more-accessible Samsung Electronics today announced a new 14-inch Galaxy Book6, expanding the Galaxy Book6 lineup with a more accessible model designed for everyday computing. Starting at $799, Galaxy Book6 combines up to 25 hours of battery life, Intel® Core™ 3 and Core™ 5 performance, Galaxy AI-enabled features, and the design language of the Galaxy Book6 family. […] ———————————————————————————————————————————————————————————— Pairing Google Antigravity with Gemini 3.7 Flash solves notable multi-agent math and engineering problems. 2026-08-31 · Google · Semiconductors https://blog.google/innovation-and-ai/technology/developers-tools/antigravity-teamwork-multi-agent/ Gemini 3.7 Flash powers autonomous agent teams in Antigravity to solve open math problems, build CPU emulators, and optimize OSS. ———————————————————————————————————————————————————————————— Gench Education Announces 2026 Interim Results, High-Quality Education Delivers Steady Business Growth 2026-08-31 · ACN Newswire · Finance, AI, SaaS, Healthcare, Media, Education, Telecom, Fashion & luxury, Industrial, Semiconductors https://www.acnnewswire.com/press-release/english/109644/ HONG KONG, August 31, 2026 - Shanghai Gench Education Group Limited (“Gench Education” or the “Company”, together with its subsidiaries, the “Group”, Stock Code:1525.HK) -- the leading higher vocational education group in East China and the largest higher vocational education group in Shanghai, delightedly announced the unaudited consolidated interim results for the six months ended 30 June, 2026 (the “Reporting Period”). During the Reporting Period, the Group recorded revenue of approximately RMB569 million, representing an increase of 6.6% year-on-year (“YoY”). Gross profit was RMB354 million, up 11.7% YoY; Profit for the year was RMB179 million, a YoY rise of 10.2%. Basic and diluted earnings per share attributable to ordinary equity holders of the parent were RMB0.45, compared to RMB0.41 in the same period last year. The growth in performance was primarily attributable to the rise in average tuition fees, boarding fees per student, and revenue from education-related services during the Reporting Period. The Board has resolved the payment of an interim dividend of HKD$0.04 per ordinary share for the six months ended 30 June 2026, maintaining a stable dividend policy. Policy Dividends Continued to Be Released, Lingang’s Location Advantages Solidified Growth Foundation As the largest private university in Shanghai, Shanghai Jian Qiao University (the “University”) has fully benefited from dual support from national vocational education policy and Lingang special area policy. In February 2025, the Management Committee of Lingang New Area issued “the Action Plan for High-Quality Development of Industry-Education Integration in Lingang New Area of China (Shanghai) Pilot Free Trade Zone (2025-2027)”, explicitly supporting the University in building itself into an industry-education integration university. In December 2025, “Shanghai Lingang Science and Technology Innovation City Construction Plan” was launched, encouraging universities to participate in regional innovation development and bringing the Group opportunities in terms of policy support and resources. At the national level, in February 2026, the Ministry of Education issued the “Opinions of the Ministry of Education on Deepening the Reform of Key Elements in Vocational Education and Teaching”, which focuses on the key links of industry-education integration. In June 2026, the State Council issued the “Education Development Plan for the Fifteenth Five-Year Plan Period” (the “Plan”), which proposes launching the “Dual Excellence” construction of high-level application-oriented undergraduate universities, and leading and driving universities to focus on cultivating distinctive disciplinary specialty clusters around key industrial chains. Driven by these multiple policies, the University has leveraged its location in Lingang’s emerging industry agglomeration to transform its geographical advantages into institutional competitiveness. As of 31 August 2025, 77.5% of the University’s 2025 graduates were employed in the Yangtze River Delta region and 59.2% in Shanghai, which fully demonstrated the University’s effective integration into the regional development ecosystem through its educational outcomes. Teaching Quality Has Been Steadily Enhanced, While Digital and Intelligent Transformation Has Been Vigorously Advanced The University remains committed to teaching quality as its core priority, with ongoing efforts to strengthen faculty capacity building, curriculum development and smart campus construction. In terms of faculty, as of 30 September 2025, among the full-time teachers, the master degree or higher accounted for 86.4%, the doctoral degree accounted for 28.8%, the senior title accounted for 38.6%, and the double-position accounted for 47.8%. Grounded in its positioning as an application-oriented technological university, the University vigorously promotes professional teachers to practice in enterprises, organizes thematic workshops on industry education integration, and enhances teachers’ awareness and competence in industry-education integration. In terms of program and curriculum development, in the 2026/27 school year, the University has introduced two undergraduate majors, namely the Artificial Intelligence and the Electronic Packaging Technology, closely aligning with the demands of key industries such as integrated circuits and artificial intelligence. The University focuses on courses connotative construction, constructs “school level – city level – national level” 3-level courses building system, and enhances practical teaching and quality teaching. In 2025, 12 courses were selected as Shanghai first class undergraduate courses - the number of approved courses showed a YoY increase of 50%, reaching a historic new high. Besides, 26 courses were approved as Shanghai higher education municipal level key courses - the number of approved courses ranked the 7th place among higher education institutions in Shanghai, and thus became the only private university in the top 10. The courses cover various types including “AI+courses” and “industry-education integration courses”. In 2025, the “Fundamentals of Gemstone Geology and Crystallography” course of the College of Jewelry was selected as a “Online/Offline Hybrid First-Class Course”, achieving a breakthrough for the University in the construction of national first-class courses. In May 2026, the “Fundamentals of Intelligent Manufacturing Equipment” course of the College of Mechanical and Electronic Engineering was included in the national case collection of “Excellent Intelligent Manufacturing Courses”. The Group continues to deepen the upgrading and renovation of teaching and research instruments and equipment as well as teaching laboratories. The University has deployed smart classrooms integrated with high-definition cameras, intelligent audio devices and high-speed networks, and has built a smart teaching system covering the entire process of talent cultivation, curriculum teaching and quality monitoring. Furthermore, the Group has actively explored the deep integration of AI and education, embedded technologies such as AI, 5G, and VR into the teaching process, and initiated the construction of a DeepSeek-based large model for vertical-domain educational applications, thereby creating three intelligent agents for services, management, and teaching. Industry-Education Integration Has Been Further Deepened, While the Diversified Education Ecosystem Has Been Continuously Improved The Group is fully committed to building an industry-education integrated university. It implements a tripartite operational model integrating “academic schools + industrial colleges + corporate entities”, striving to achieve the synergistic development of “industry, academia, research, and innovation” as an integrated whole. As of 30 June 2026, the University has successively launched seven key industry-education integration projects covering the College of Mechanical and Electronic Engineering, the College of Journalism and Communications, the Business College, the College of Art Design and the College of Jewelry. It has established Medical Engineering Industrial College, the Live Streaming Economy Industrial College, and Big Data Industrial College, is actively preparing for the establishment of the Integrated Circuit Industrial College and the Intelligent Manufacturing Industrial College, and endeavors to create a distinctive educational framework featuring multi-track industry and college collaboration and comprehensive industry-education integration. International cooperation has made steady progress, while external exchanges have continued to expand. The University works with Vaughn College of Aeronautics and Technology, The Kyoto College of Graduate Studies for Informatics, Teesside University, among others, in junior college to master’s program, undergraduate to master’s program, dual bachelor’s program and other programs. In 2025, the University contracted with 11 overseas famous universities/colleges in Germany, United Kingdom, New Zealand, Thailand and other countries, to expand teachers and students’ overseas exchange channels. As the first private university in Shanghai that has obtained the qualification to recruit international students, the University also attracts international students from many countries around the world and forms an international student education system that combines long-term and short-term programs. The University has a well-established lifelong education system. With the Shanghai “Dual-system” Pilot Base for Continuing Education of Employees in Higher Education Institutions (Incubation) as a platform, the University has built an integrated, multi-field and cross-age lifelong education system for knowledge updating and ability enhancement, covering adult higher education, vocational skills training, and youth science and innovation education. As of 30 June 2026, the number of in-service students enrolled in the University’s adult continuing education programs amounted to 3,316, and a total of over 400 types of vocational skill certificate training had been provided. Financial Position Remains Sound, While the Asset-Liability Structure Has Been Continuously Optimized During the Reporting Period, finance costs of the Group decreased by 69.0% YoY, which was primarily due to the result of early repayment of most of long-term interest-bearing bank borrowings by the end of 2025. As at 30 June 2026, the scale of interest-bearing borrowings decreased to RMB276.7 million, with the gearing ratio remaining at 0.1. The financial position has become more robust. Looking forward, Mr. Zhao Donghui, Chairman of the Board and Executive Director of Gench Education, stated: “The Group’s performance in the first half of 2026 achieved steady growth, validating the feasibility of its high-quality development strategy. In the future, we will continue to adhere to the educational philosophy of ‘student-oriented, teaching-centred, undergraduate-focused’ and the work ideology of ‘quality as the core, teaching as the centre, students as the base, teachers as the principal’ to promote the high-quality development of our undertakings. We will also fully capitalize on this historic opportunity by proactively aligning with the national strategy of promoting the high-quality development of vocational education and with Lingang’s regional initiative of becoming a ‘Global Hub of Power’, cultivate more high-quality technical and skilled talents, and accelerate the transformation to an industry-education integration university, and strive to build our University into a first-class private university in China with more unique features and international standing and a long-distance runner for the high-quality development of higher education in China.” About Shanghai Gench Education Group Limited Gench Education (Stock Code: 1525.HK) is a higher vocational education group which provides undergraduate education and junior college education, focusing on high-quality schooling for the provision of excellent education for students. The Group operates Shanghai Jian Qiao University, being the domestic leading private university, at Lingang New Area of China (Shanghai) Pilot Free Trade Zone. As measured by the number of full-time students enrolled in the 2025/26 school year, the University is the largest private university in Shanghai and is also a leading private university in the entire Yangtze River Delta. According to CUAA.net , the University ranked third among all category I private universities in China for five consecutive years and first among private universities in the Yangtze River Delta for seven consecutive years. Over 26 years of operation, the schooling quality of the University ranked in the forefront of peer universities, which has accumulated a solid brand reputation. Since 2004, the University has been consecutively awarded “Shanghai Civilized Unit” over 18 years. The University has won numerous honorary titles such as “National Model Unit of Civilization ”, “Shanghai Garden Unit”, “Shanghai Safe and Civilized Campus”, etc. The University has also been granted reputable title of “Lei Feng Spirit College Demonstration Education Base” among the first batch of universities in the PRC in April 2024, and was awarded the “Contribution Award for Promoting Lei Feng Spirit in the New Era ” in September 2024. In February and March 2025, the University was successively recognized as an “Outstanding Unit in Information Disclosure Work among Shanghai Higher Education Institutions for 2023-2024” and an “Outstanding Unit in Petition Work within the Shanghai Education System for 2024”. This press release is issued by Porda Havas International Finance Communications Group on behalf of Shanghai Gench Education Group Limited. For further information, please contact: Porda Havas International Finance Communications Group E-mail: gench.hk@pordahavas.com ———————————————————————————————————————————————————————————— AMD, Cisco and HUMAIN Expand Saudi Arabia’s AI Infrastructure as AMD Instinct Systems Go Live 2026-08-31 · Cisco · AI, Semiconductors https://newsroom.cisco.com/c/r/newsroom/en/us/a/y2026/m08/amd-cisco-and-humain-expand-saudi-arabia-ai-infrastructure.html?source=rss Cisco and HUMAIN, announced that AMD Instinct MI355X GPU-based AI infrastructure built on Cisco Silicon One-based AI networking is now live in Saudi Arabia and serving HUMAIN customers in the Kingdom and beyond.  More RSS Feeds: https://newsroom.cisco.com/c/r/newsroom/en/us/rss-feeds.html ———————————————————————————————————————————————————————————— Rigaku to Showcase Advanced X-ray Metrology and Inspection Solutions at SEMICON Taiwan 2026 2026-08-31 · Business Wire · Semiconductors https://finance.yahoo.com/technology/articles/rigaku-showcase-advanced-x-ray-020000271.html HSINCHU, Taiwan, August 31, 2026--Rigaku will showcase advanced X-ray metrology and inspection solutions for advanced logic, HBM and advanced packaging at SEMICON Taiwan 2026. ———————————————————————————————————————————————————————————— AMD Instinct GPUs and EPYC CPUs to Power Europe’s Next-Generation LUMI-AI Supercomputer 2026-08-31 · AMD · AI, Semiconductors https://newsroom.amd.com/news/amd-instinct-gpus-epyc-cpus-power-lumi-ai-supercomputer/ Built on AMD Instinct MI430X GPUs and 6th Gen AMD EPYC CPUs, LUMI-AI will expand AI and HPC capacity for researchers, startups and industry across Europe. ———————————————————————————————————————————————————————————— AMD, Saudi Arabia’s Ministry of Communications and Information Technology and Digital Cooperation Organization Launch an Open Developer Ecosystem to Advance AI Innovation 2026-08-31 · AMD · AI, Semiconductors, Government & policy https://newsroom.amd.com/news/amd-saudi-arabia-digital-cooperation-organization-open-developer-ecosystem/ AMD, Saudi Arabia’s Ministry of Communications and Information Technology and Digital Cooperation Organization Launch an Open Developer Ecosystem to Advance AI Innovation ———————————————————————————————————————————————————————————— Hudbay Files Early Warning Report for Panoro Minerals Ltd. 2026-08-28 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/08/28/3352891/0/en/hudbay-files-early-warning-report-for-panoro-minerals-ltd.html TORONTO, Aug. 28, 2026 -- Hudbay Minerals Inc. (“Hudbay” or the “Company”) (TSX, NYSE: HBM) today announced that the Company has filed an early warning report in respect of its holdings in Panoro Minerals Ltd. (“Panoro”) due to an increase in the number of issued and outstanding common shares in the capital of Panoro (“Common Shares”). Hudbay has not sold or disposed of any Common Shares. ———————————————————————————————————————————————————————————— NXP Semiconductors Announces Quarterly Dividend 2026-08-28 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/08/28/3352885/0/en/nxp-semiconductors-announces-quarterly-dividend.html EINDHOVEN, The Netherlands, Aug. 28, 2026 -- As part of its ongoing capital return program, NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that its board of directors has approved the payment of an interim dividend. The actions are based on the continued and significant strength of the NXP capital structure, and the board’s confidence in the company’s ability to drive long-term growth and strong cash flow. ———————————————————————————————————————————————————————————— Corvex Appoints Garrett Brams to Lead Data Center Infrastructure Development 2026-08-28 · PR Newswire · Finance, AI, SaaS, Industrial, Semiconductors https://www.prnewswire.com/news-releases/corvex-appoints-garrett-brams-to-lead-data-center-infrastructure-development-302862912.html Cushman & Wakefield managing director joins Corvex — will source the sites and power behind the company's expanding AI Factory platform ARLINGTON, Va., Aug. 28, 2026 -- Corvex, Inc. (Nasdaq: MOVE), an engineering-led AI computing platform specializing in GPU-accelerated... ———————————————————————————————————————————————————————————— GIGABYTE Collaborates with NVIDIA to Enhance Gaming with GeForce RTX™ 50 Series and CONTROL Resonant Bundle 2026-08-28 · PR Newswire · Gaming, Semiconductors https://www.prnewswire.com/news-releases/gigabyte-collaborates-with-nvidia-to-enhance-gaming-with-geforce-rtx-50-series-and-control-resonant-bundle-302858857.html TAIPEI, Aug. 28, 2026 -- GIGABYTE, the world's leading computer brand, announced a collaboration with NVIDIA for the CONTROL Resonant game bundle across eligible graphics cards, laptops, and gaming desktops powered by NVIDIA® GeForce RTX™ 5070 or above GPUs and Laptop GPUs.... ———————————————————————————————————————————————————————————— CIMC Group Announces 2026 Interim Results 2026-08-28 · ACN Newswire · Finance, AI, SaaS, Healthcare, Energy, Retail, Automotive, Travel, Food & drink, Industrial, Aerospace & defense, Logistics, Semiconductors, Sustainability https://www.acnnewswire.com/press-release/english/109593/ Financial Highlights RMB (million) 1H2025 1H2026 1Q2026 2Q2026 Quarter-on-Quarter Change Revenue 76,090 78,913 32,664 46,249 +42% Operating Profit 2,817 1,962 607 1,355 +123% Foreign Exchange Losses 47 803 228 574 The expanded loss is attributable to the expansion of business scale. Pre-FX Loss Operating Profit [1] 2,864 2,764 835 1,929 +131% Profit Before Income Tax 2,798 1,969 615 1,353 +120% Gross Profit 9,643 9,380 3,770 5,611 +49% Gross Profit Margin 12.67% 11.89% 11.54% 12.13% +0.6pct Net Profit 1,764 1,373 412 961 +133% Net Profit Attributable to Shareholders and Other Equity Holders of the Company [2] 1,278 740 209 531 +154% Notes: 1. Pre-FX Loss Operating Profit = Operating Profit + Foreign Exchange Losses 2. Net profit attributable to shareholders and other equity holders of the Company, with interest on perpetual bonds of approximately RMB47.8 million Results Highlights 1. Profitability of energy-related businesses continued to be released, with net profit increasing by RMB1.36 billion: The combined net profit of the offshore engineering segment and the finance and asset management segment (mainly drilling rig leasing) increased by approximately RMB1.339 billion, while that of the energy, chemical and liquid food equipment segment increased by RMB20 million. Among them, the gross profit margin of the offshore engineering segment increased by 10.1 percentage points year-on-year (“YoY”) to 20.9%, with net profit reaching RMB718 million, making it the Company’s largest profit-generating segment. The finance and asset management segment successfully turned losses into profits, with a net profit margin of 9.8%. As at the end of June, total orders on hand amounted to approximately RMB83.6 billion, with production schedules extending to 2030: orders on hand for the offshore engineering and energy, chemical and liquid food equipment segments amounted to US$7.62 billion and RMB31.77 billion, respectively. In particular, CIMC Raffles secured one FPSO and one FLNG EPCIC / EPC general contracting order during the year, making it the first offshore engineering enterprise in China with dual-project general contracting capabilities (EPCIC / EPC). Benefiting from rising demand for increased deepwater oil and gas production, new orders accelerated in the third quarter. 2. Double breakthroughs in modular data center deliveries and orders: The modular data center business recorded explosive growth, with revenue increasing by more than five times YoY. During the Reporting Period, new contracts were signed for 200MW of cloud computing and AI computing power data center projects. 3. Logistics-related businesses consolidated their industry positions, with demand bottoming out and recovering quarter-on-quarter: Core products including standard dry containers, reefer containers, chemical tank containers and semi-trailers maintained their global No. 1 positions. During the Reporting Period, the overall gross profit margin declined due to exchange rate fluctuations and pressure on demand, while demand for containers, road transportation vehicles, airport facilities and logistics equipment, and recycled load bottomed out and recovered quarter-on-quarter. 4. Interest expenses continued to be optimised, with a more robust financial structure: As at the end of Reporting Period, interest-bearing debt amounted to RMB34.8 billion, down RMB6.4 billion from the end of June 2025, with the interest-bearing debt ratio at approximately 20%. Benefiting from the optimisation of financing rates and scale, net interest expenses decreased by approximately RMB218 million YoY during the Reporting Period, and the financial structure continued to be optimised. HONG KONG, August 28, 2026 - China International Marine Containers (Group) Co., Ltd. (“CIMC Group” or the “Group”, stock code: 000039.SZ/02039.HK) is pleased to announce its unaudited interim results for the six months ended 30 June 2026 (the “Reporting Period”). The management of CIMC Group stated that in the first half of 2026, global changes unseen in a century accelerated, geopolitical conflicts reshaped the energy and trade landscape, while global merchandise trade demonstrated resilience amid fluctuations. Against a backdrop of opportunities and challenges, the Group closely followed the main business tone of “focusing on high-quality development and cultivating new growth drivers”, coordinated the reasonable growth of “quantity” and the effective improvement of “quality”, and, leveraging its diversified business portfolio and global operating platform, mitigated fluctuations in individual regions to achieve steady and high-quality development. In the first half of 2026, the Group achieved revenue of RMB78.9 billion and net profit of RMB1.37 billion, while net profit attributable to shareholders and other equity holders of the Company amounted to RMB740 million. During the Reporting Period, domestic revenue accounted for approximately 53.62%, while overseas revenue accounted for approximately 46.38%, maintaining a balanced market structure. To effectively safeguard shareholder value and convey confidence in long-term development, the Company repurchased H Shares amounting to approximately HKD173 million during the first half of 2026, with approximately 19.28 million H Shares repurchased in aggregate. As at the end of June, the Company had completed the implementation of its 2025 H Share repurchase plan. Meanwhile, to further enhance shareholder confidence, the Company announced in July 2026 its plan to repurchase a portion of its H Shares, with the total repurchase amount not exceeding HKD173 million. In respect of A Shares, the Company recently announced a proposal to change the use of the A Shares repurchased in 2023 and cancel such shares and reduce its registered capital, namely, to cancel the 24.65 million A Shares repurchased by the Company in 2023 and correspondingly reduce the registered capital of the Company, thereby adopting multiple measures to safeguard the interests of its investors. Segments Results (RMB million) 1H2026 Business Indicators Revenue % of Total Revenue Gross Profit % of Total Gross Profit Gross Profit Margin Net Profit Container manufacturing 21,920 27.78% 1,827 19.48% 8.34% 272 Road transportation vehicles 10,737 13.61% 1,551 16.53% 14.44% 356 Energy, chemical, and liquid food equipment 13,396 16.98% 1,962 20.92% 14.65% 480 Offshore engineering 7,935 10.06% 1,659 17.69% 20.91% 718 Airport facilities and logistics equipment, fire safety and rescue equipment 3,357 4.25% 706 7.52% 21.03% 71 Logistics services 13,945 17.67% 910 9.70% 6.53% 240 Finance and asset management 1,710 2.17% 287 3.06% 16.77% 167 The above major segments 72,999 92.52% 8,902 94.90% 12.19% 2,304 Core Business Performance 1. In the Logistics Field Container Manufacturing Business: During the Reporting Period, although global trade continued to face adverse factors such as high inflation and geopolitical frictions, the growth of global merchandise trade continued to maintain a certain degree of resilience. According to Container Trades Statistics, global container trade volume increased by approximately 5.2% YoY in the first half of 2026, mainly benefiting from the growth of trade related to the global technology industry. Meanwhile, the low efficiency of container shipping caused by the blockage of the Strait of Hormuz, disruption to the resumption of shipping routes in the Red Sea and port congestion supported demand for containers. During the Reporting Period, the growth in demand for container shipping together with the replacement and renewal requirements for the massive existing container fleet drove a steady rebound in new container sales across the industry in the second quarter, reversing the downward trend seen in the first quarter, while prices also stabilised simultaneously. During the Reporting Period, the Group’s container manufacturing business achieved growth in both production and sales volume. In particular, the accumulated sales volume of dry containers reached 1.1385 million TEUs, representing a YoY increase of approximately 1.12%; meanwhile, benefiting from the bountiful harvest of fresh fruits in South America and the harvest season in the Northern Hemisphere, sales volume of reefer containers reached 108,200 TEUs, representing a YoY increase of approximately 17.61%. During the Reporting Period, the container segment recorded revenue of RMB21.920 billion, representing a YoY increase of 0.85%, and net profit of RMB272 million, mainly affected by the YoY decline in the price of standard containers and exchange rates. Logistics Services Business: During the Reporting Period, the multimodal transport market environment gradually improved, particularly the container shipping market, where freight rates continued to rise since March. During the Reporting Period, the segment achieved revenue of RMB13.945 billion, representing a YoY increase of 2.70%, and net profit of RMB240 million, representing a YoY increase of 18.81%. CIMC Wetrans actively captured the upward trend by deepening customer relationship management, optimising product mix, accelerating overseas expansion and strengthening operational efficiency. During the Reporting Period, the proportion of direct customers in the sea transportation business continued to increase; the port logistics business added route, extra sailing and vessel space agency services for multiple leading shipping companies; the industry logistics business added new cold chain equipment deployment, with cold chain business volume increasing by 14% YoY; the customer structure of the air transportation business continued to be optimised, with business volume increasing by 11% YoY; and the service network of the land transportation business continued to expand. CIMC Wetrans ranked TOP 13 in the 2026 Top 50 Ocean Freight Forwarders list issued by Transport Topics, an authoritative magazine in the global logistics industry, up one place from last year and ranking fifth among Chinese enterprises. Road Transportation Vehicles Business: During the Reporting Period, CIMC Vehicles achieved revenue of RMB10.737 billion, representing a YoY increase of 10.09%, and net profit of RMB356 million. Among them, the global semi-trailer business achieved revenue of RMB7.602 billion, representing a YoY increase of 9.79%. In 2026, CIMC Vehicles continued to extend the production and marketing models of the StarLink Project to more product lines and regions, deepening ecosystem cooperation while improving efficiency and reducing costs. The core production efficiency of the semi-trailer business under the StarLink Project continued to improve, and its domestic market share remained No. 1 for seven consecutive years. In overseas markets, revenue and sales volume in the Global South increased significantly, while gross profit margin remained basically flat due to fluctuations in ocean freight rates; production in the European market recovered, while freight rates and equipment orders in the North American market showed marginal improvement in the second quarter. The market share of core DTB products further increased, with a total of 13,238 truck bodies products products sold. Meanwhile, sales volume of EV-DTB truck bodies products for new energy heavy-duty trucks increased significantly, with deliveries of EV-DTB dump truck and mixer truck truck bodies products continuing to rise. The pure electric tractor and trailer business officially established the world’s first EV-RT offline experience center. Airport Facilities & Logistics Equipment / Fire Safety & Rescue Equipment Business: During the Reporting Period, revenue amounted to RMB3.357 billion, representing a YoY increase of 7.58%; net profit amounted to RMB71 million, representing a YoY decrease of 11.25%, mainly due to exchange rate fluctuations. During the Reporting Period, orders on hand maintained steady growth. The airport facilities and logistics equipment business secured a series of major benchmark orders, including boarding bridge projects worth hundreds of millions of RMB for Paris Airport and Orly Airport in France, as well as bulk orders for A380 catering vehicles in Singapore, further enhancing its global competitiveness. The logistics automation business successfully implemented multiple e-commerce projects in Southeast Asia, and also secured new orders and contracts in newly expanded industries such as State Grid and China Tobacco. The operating results of the fire safety and rescue equipment business showed significant improvement, with the successful securing of a major procurement order for 13 dual-boom water tower fire trucks under the national government subsidy-funded project for hazardous chemical emergency rescue teams. Cumulative new orders reached RMB1.675 billion, achieving steady growth. II. In the Energy Industries Field In respect of the energy, chemical and liquid food equipment business, revenue amounted to RMB13.396 billion, representing a YoY increase of 2.98%; net profit amounted to RMB480 million, representing a YoY increase of 4.35%. Among them, CIMC Enric achieved revenue of RMB12.87 billion, representing a YoY increase of 2.0%; newly signed orders amounted to RMB13.71 billion, representing a significant YoY increase of 27.7%; and as at the end of June, orders on hand amounted to RMB31.77 billion, representing a YoY increase of 8.9%. Specifically, revenue of the clean energy segment grew steadily. Benefiting from expanding demand in areas such as semiconductors and off-grid distributed power generation, the segment delivered electronic specialty gas clean gas cylinders (Y-type cylinders) and specialty tube skid containers in batches, and launched new hydrogen-rich power generation module products. CIMC Enric successfully delivered an integrated LNG liquefaction plant in Indonesia, while implementing its third benchmark steelmaking coke integrated project — the Shougang Shuicheng Steel project in Liupanshui, Guizhou. It also secured newly signed domestic Panzhihua Iron and Steel projects and its first overseas steelmaking coke integrated project with Tsingshan in Indonesia. In the hydrogen energy field, it contributed to the construction of Hong Kong’s first commercial building hydrogen energy charging station and launched China’s first 20-foot Type IV cylinder hydrogen tube skid container. During the Reporting Period, the clean energy segment recorded newly signed orders of RMB10.61 billion, representing a YoY increase of 18.3%, among which newly signed orders for waterborne clean energy reached RMB4.535 billion, representing a significant YoY increase of 40.1%, with shipbuilding orders scheduled through 2029. The chemical and environment segment benefited from the recovery of the chemical industry and high-growth industries such as semiconductors, with demand for tank containers improving, while the medical equipment components business maintained steady growth. As at the end of June 2026, orders on hand increased by 86.8% YoY to RMB1.57 billion. The liquid food segment focused on the non-alcoholic beverage and new consumption sectors, successfully securing and signing multiple turnkey projects, including projects for Japanese breweries and Chinese whisky distilleries. Cumulative newly signed orders reached RMB1.44 billion, representing a strong YoY increase of 108.4%. In respect of the offshore engineering business, benefiting from the cost advantages of deepwater locations, the deepwater offshore engineering market for FPSO/FLNG continued to strengthen. CIMC Raffles, the main operating entity, achieved an important breakthrough in the international high-end offshore engineering general contracting market by signing China’s first FPSO EPCIC general contracting contract, further enhancing its industry competitiveness. During the Reporting Period, revenue amounted to RMB7.935 billion, representing a YoY decrease of 0.98%; net profit amounted to RMB718 million, representing a YoY increase of 155.52%. In terms of market orders, new orders amounted to US$3.2 billion during the Reporting Period, a substantial increase from US$106 million in the same period last year. As at the end of June, CIMC Raffles had cumulative orders on hand of US$7.62 billion, reaching a record high. In terms of project construction and delivery, in January, the PCTC with a capacity of 7,000 vehicles, “NOCC ADRIATIC”, constructed for a Norwegian shipowner, was delivered 70 days ahead of its contractual delivery schedule; in February, the Norse Energi, the world’s largest fully DC wind turbine installation vessel in terms of lifting capacity, completed its seaworthiness delivery; in March, construction commenced on the first vessel of a new generation of seabed rock dumping vessels built for Van Oord, a leading Dutch offshore engineering company; in April, the fore-body module of the P85 hull was slid onto a barge at the Haiyang base, laying a solid foundation for the subsequent successful major assembly of the P85 project; in May, construction of the VLCC tanker officially commenced, entering the substantive construction stage; and in June, the main upper module structure of the project constructed for Golar was successfully capped, marking a key milestone in the project’s construction. In respect of the offshore engineering asset operation and management business, all offshore engineering assets of the Group currently under lease have been operating normally under their respective lease contracts, and the Group continued to provide high-quality services to customers. Benefiting from the successful lease of the Blue Whale No. 1 platform, increased prices upon the renewal of contracts for multiple drilling platforms, and lower operating costs resulting from refined management, operating profit improved during the Reporting Period. During the Reporting Period, the sixth-generation semi-submersible drilling platform “Deepsea Yantai” secured a new drilling contract, injecting momentum into revenue growth; the semi-submersible lifting/life support platform Blue Gretha successfully arrived at its designated operating area to provide high-quality services to clients. Meanwhile, several semi-submersible drilling and life support platforms and other offshore engineering assets of the Group actively pursued new contracts. Future Development and Prospects The management of the Group stated, “2026 is the first year of the ‘15th Five-Year Plan’. The Group will be based on the new development stage, closely follow national policy guidance, and closely focus on ‘focusing on high-quality development and cultivating new growth drivers’. With a more proactive strategic approach, we will cultivate new opportunities and open up new prospects amid complex changes, striving to build ‘a high-quality and respected world-class enterprise’.” About China International Marine Containers (Group) Co., Ltd. The CIMC Group is a world-leading equipment and solution provider in the logistics and energy industries, and its industry clusters mainly cover the logistics and energy fields. In the logistics field, the Group has established a general transportation equipment portfolio covering “sea, land and air”: its container manufacturing business provides key circulation equipment for the container shipping industry; its road transportation vehicles business connects the arteries of land transportation; its airport facilities and logistics equipment/fire safety and rescue equipment businesses expand into aviation hubs and specialised scenarios; its logistics services business provides professional services across the entire-value chain; and its recycled load business provides professional supporting services. In the energy field, the Group is principally engaged in the energy, chemical, and liquid food equipment business and offshore engineering business. Meanwhile, the Group also continuously develops emerging industries and has finance and asset management businesses that serve the Group itself. As a diversified multinational industrial group serving the global market, CIMC has over 300 member enterprises across Asia, North America, Europe, and Australia, with a total of four listed companies, and customers and sales networks covering more than 100 countries and regions worldwide. In 2025, the Group recorded revenue of RMB 156.6 billion, ranking 154th on the 2025 Fortune 500 China list. The Group has maintained the world’s No.1 position for many consecutive years in core products such as standard dry containers, reefer containers, tank containers and semi-trailers. For more information, please visit http://www.cimc.com/. ———————————————————————————————————————————————————————————— Deepening Implementation of Technological Innovation, Accelerating Transformation of Productive Forces 2026-08-28 · ACN Newswire · Finance, AI, SaaS, Energy, Automotive, Education, Industrial, Aerospace & defense, Biotech & pharma, Semiconductors, Sustainability https://www.acnnewswire.com/press-release/english/109563/ HONG KONG, August 28, 2026 - Legend Holdings Corporation (“Legend Holdings” or the “Company”; Stock Code: 3396.HK) announced the unaudited condensed consolidated interim results for the six months ended June 30, 2026 (the “Reporting Period”). During the Reporting Period, the Company recorded revenue of RMB362.935 billion, representing a 29% year-on-year increase, primarily driven by the significant revenue growth of its subsidiaries Lenovo and Levima Advanced Materials; net profit attributable to equity holders of the Company was RMB2.230 billion, up 219% year-on-year, driven by the recovery in portfolio value of the industrial incubations and investments segment. Excluding the impact of a one-off item, net profit attributable to equity holders of Legend Holdings was RMB5.812 billion, a year-on-year increase of 834%. In the first half of 2026, Legend Holdings remained committed to technological innovation as the key driver for high-quality development and continued to enhance its distinctive technological innovation system. The Company actively drove the coordinated advancement of “anchoring diversified-industries operations in technology-focused core businesses, extending ecosystem coverage through technology innovation funds, and driving the very early-stage industrialization of forward-looking technologies.” This expedited the transformation from scientific and technological achievements into real productive forces, and drove a steady improvement in the Company's core competitiveness, with significant performance growth, laying a solid foundation for the Company’s sustainable development. RMB 10 Billion in R&D Investment, Together with a Solidified Technology Foundation During the Reporting Period, Legend Holdings’ total R&D investment exceeded RMB10 billion, a historical record high for its midyear report. Its portfolio companies continued to deliver steady growth with solid fundamentals. Lenovo capitalized on the surge in hybrid AI, with all three major business segments delivering double-digit revenue growth and reaching record highs for the same period. AI has become Lenovo’s core growth engine, with AI-related revenue increasing by 64% for the same period and accounted for 36% of Lenovo’s total revenue. Levima Advanced Materials posted significant performance growth and made breakthroughs in a number of major projects. Among them, the m-Xylylene Diisocyanate (XDI) project was listed under the National Key R&D Program. Built on Levima’s technical expertise and R&D experience, the PEEK project has entered the construction phase. Both projects are expected to be completed and put into operation in 2027, filling domestic technology gaps. Technology Ecosystem Bearing Fruit, and 12 Portfolio Companies Successfully Listed Leveraging years of dedicated efforts in technology innovation, Legend Holdings has cultivated a robust ecosystem spanning emerging and future industries. This ecosystem is now delivering tangible returns, not only driving significant performance growth for the Company, but also accumulating momentum for long-term development. During the Reporting Period, the industrial incubations and investments segment’s depth of technology asset pipeline and ability to realize value from these assets both improved. In the first half of 2026, the Legend Holdings Family Group supported the listing of 12 portfolio companies. These listed companies spanned sectors including artificial intelligence, semiconductors, advanced manufacturing, and healthcare. More than 30 additional portfolio companies are currently in the pre-listing pipeline. The Company invested in over 80 technology projects in the first half of the year across frontier fields such as artificial intelligence, quantum computing, optical interconnects, embodied artificial intelligence, chips and semiconductors, biopharmaceuticals, and commercial aerospace. To date, Legend Holdings has invested in over 300 AI-related companies. The Company has also established a systematic presence in other frontier fields, having invested in over 110 companies in pharmaceuticals and healthcare, over 60 companies in sustainable industries and future energy, and more than 50 companies in embodied artificial intelligence. Fostering Industry-Academia-Research Collaborative Innovation and Exploring New Pathways for Commercializing Original Technologies Responding to the call to “accelerate the translation from technological advances into productive forces”, Legend Holdings leverages its Forward-Looking Technology Research Institute to actively promote industry-academia-research collaborative innovation and explore new pathways for the commercialization of pioneering technologies. In the first half of the year, Legend Holdings established the Advanced Photonic Integration Joint Laboratory with a National Key Laboratory at Peking University. Together with the research team, the Company published co-authored papers and filed joint patents, while making preparations to establish a dedicated operating entity. In addition, led by the Chinese Information Processing Society of China (CIPS), and jointly initiated by Legend Holdings and other organizations, the Industry University Research Working Committee of the Chinese Information Processing Society of China was established, focusing on frontier areas of artificial intelligence. The Committee translates real-world industry needs into concrete workstreams. The Company has built a “Covalent Innovation” model that brings real-world industry needs into the earliest stages of R&D, enabling businesses and researchers to jointly set priorities and develop solutions. It aims to create a replicable pathway for translating more creative innovation into new quality productive forces. ESG Practices Gaining Authoritative Recognition, Corporate Responsibility Underpinning the Foundation for Sustainability Legend Holdings prioritizes ecological conservation and green development. Lenovo has repeatedly received authoritative recognition both domestically and internationally in the ESG field. It has retained the highest global 3A rating in the MSCI ESG Ratings and received the EcoVadis Platinum Medal, its highest distinction, for two consecutive years. It was also included in the Fortune China ESG Impact List for five consecutive years. Its green operations continued to deliver strong results: over 90% of the electricity used in Lenovo’s global operations came from renewable energy sources. More than 360 million kilograms of end-of-life products have been recovered and reused. In photovoltaic materials, Levima Advanced Materials operates two major product lines for photovoltaic adhesive film materials, EVA and POE, with an annual production capacity exceeding 350,000 tons. In new energy battery materials, the company has built a comprehensive portfolio. In green investment, Legend Holdings has invested in more than 60 companies across new energy, energy decarbonization and so on. The Legend Star CEO Training Program has been running for over 18 years, nurturing up to 1,429 startup founders with 77 listed companies, 217 national-level specialized and innovative “Little Giant” enterprises, 930 High-and New-Technology Enterprises (HNTE), and more than 460,000 jobs created. Looking ahead, Legend Holdings will continue to closely align with national strategic needs, adhere to the main thread of technological innovation driving high-quality development, steadily improve its distinctive technological innovation system, deepen its focus on technology as its core business, and accelerate the promotion of the transformation of scientific achievements into real productive forces, making unremitting contributions to Chinese modernization and self-reliance and strength in science and technology. ———————————————————————————————————————————————————————————— Marvell Technology, Inc. Reports Second Quarter of Fiscal Year 2027 Financial Results 2026-08-27 · Marvell Technology · Finance, Semiconductors https://investor.marvell.com/news-events/press-releases/detail/1031/marvell-technology-inc-reports-second-quarter-of-fiscal-year-2027-financial-results Q2 Net Revenue: $2.739 billion, a new record, grew by 37% year-on-year Q2 Gross Margin: 53.1% GAAP gross margin; 58.9% non-GAAP gross margin Q2 Diluted income per share: $0.33 GAAP diluted income per share; $0.94 non-GAAP diluted income per share SANTA CLARA, Calif.--Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today reported financial results for ———————————————————————————————————————————————————————————— UPDATE -- Canada-Japan Support Advances Xanadu and Mitsubishi Chemical Partnership on Quantum Semiconductor Research 2026-08-27 · GlobeNewswire · Finance, Semiconductors https://www.globenewswire.com/news-release/2026/08/27/3352338/0/en/update-canada-japan-support-advances-xanadu-and-mitsubishi-chemical-partnership-on-quantum-semiconductor-research.html TORONTO, Aug. 27, 2026 -- Xanadu Quantum Technologies Limited ("Xanadu"; NASDAQ/TSX: XNDU), a leading photonic quantum computing company, has announced the next phase of its collaboration with Mitsubishi Chemical, a major Japanese chemical manufacturer, to advance semiconductor fabrication technologies using quantum computing algorithms. This next phase is supported by national innovation programs from both the Canadian and Japanese governments, aiming to scale Xanadu and Mitsubishi’s previous work in simulating a vital process in next-generation semiconductor fabrication: extreme ultraviolet (EUV) lithography. Bringing together both Canadian and Japanese expertise in quantum computing and materials science, this collaboration underscores a shared commitment to driving global innovation in the semiconductor industry through quantum technologies. ———————————————————————————————————————————————————————————— AI Integration Reshapes the 5G Chipset Landscape as Global AI Spending Surpasses $300 Billion, Unlocking a New Era of Silicon Investment 2026-08-27 · GlobeNewswire · AI, SaaS, Energy, Telecom, Semiconductors https://www.globenewswire.com/news-release/2026/08/27/3352209/0/en/ai-integration-reshapes-the-5g-chipset-landscape-as-global-ai-spending-surpasses-300-billion-unlocking-a-new-era-of-silicon-investment.html “AI and 5G are converging at the silicon level, creating new demand for faster, smarter and more energy-efficient chip architectures.” ———————————————————————————————————————————————————————————— Enablence Technologies and ShunYun Technology Complete Volume Production Readiness at Vietnam Fab Designed to Support AI Data Centers Growth 2026-08-27 · Newsfile · AI, Telecom, Industrial, Semiconductors https://www.newsfilecorp.com/release/311744/Enablence-Technologies-and-ShunYun-Technology-Complete-Volume-Production-Readiness-at-Vietnam-Fab-Designed-to-Support-AI-Data-Centers-Growth Fremont, California--(August 26, 2026) - Enablence Technologies Inc. (TSXV: ENA) ("Enablence" or the "Company"), a leading supplier of planar lightwave circuit (PLC) optical chips for datacom, telecommunications, artificial intelligence (AI), and advanced vision applications, and semiconductor assembly (OSAT) leader ShunYun Technology ("SYT"), announced today the volume production launch of Enablence's advanced optical manufacturing facility in Vietnam with production samples... ———————————————————————————————————————————————————————————— AMD ROCm 10: Bringing ROCm.AI’s AI-Native Developer Experiences to AMD Platforms 2026-08-27 · AMD · AI, Semiconductors https://newsroom.amd.com/news/rocm-10-software-ai-native-developer-experiences/ AMD ROCm 10: Bringing ROCm.AI’s AI-Native Developer Experiences to AMD Platforms ———————————————————————————————————————————————————————————— AWS and NVIDIA expand partnership for next-gen AI infrastructure 2026-08-26 · Amazon · AI, Semiconductors https://www.aboutamazon.com/news/aws/aws-nvidia-2-million-gpus-ai?utm_source=rss AWS and NVIDIA will deploy 2 million additional GPUs and deepen collaboration across CPUs, networking, and robotics. ———————————————————————————————————————————————————————————— AWS and NVIDIA to Deliver 2 Million Additional GPUs and Next-Generation Infrastructure for Agentic and Physical AI 2026-08-26 · NVIDIA · Finance, AI, Retail, Semiconductors https://nvidianews.nvidia.com/news/aws-and-nvidia-to-deliver-2-million-additional-gpus-and-next-generation-infrastructure-for-agentic-and-physical-ai Amazon Web Services (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), and NVIDIA (NASDAQ: NVDA) today announced a major expansion of their strategic collaboration to meet surging global demand for AI infrastructure as demand continues to accelerate. ———————————————————————————————————————————————————————————— Tema Launches First-Ever MLCC & Power Semiconductor ETF (PSOX) 2026-08-26 · Business Wire · Semiconductors https://finance.yahoo.com/technology/ai/articles/tema-launches-first-ever-mlcc-171200712.html NEW YORK, August 26, 2026--Tema ETFs ("Tema"), a leader in actively managed exchange-traded funds, today announced the launch of the Tema MLCC & PowerSemi ETF (PSOX), the first ETF of its kind. ———————————————————————————————————————————————————————————— Intel at AI Infra Summit 2026 2026-08-26 · Intel · AI, SaaS, Semiconductors https://newsroom.intel.com/artificial-intelligence/intel-at-ai-infra-summit-2026 At AI Infra Summit 2026, Intel will showcase its progress executing its vision for AI infrastructure at scale, demonstrating momentum across edge, enterprise, cloud, and physical AI environments. Intel CEO Lip-Bu Tan joins moderator Edmund (Ed) Nelson, co-founder & strategy director of AI Infra Summit, for a fireside chat on September 15 to discuss how … The post Intel at AI Infra Summit 2026 appeared first on Newsroom. ———————————————————————————————————————————————————————————— E&R Engineering Launches New High-Precision Laser Drilling and Advanced Hybrid Plasma Solutions for CPO and Advanced Packaging at SEMICON Taiwan 2026 2026-08-26 · PR Newswire · Semiconductors https://www.prnewswire.com/news-releases/er-engineering-launches-new-high-precision-laser-drilling-and-advanced-hybrid-plasma-solutions-for-cpo-and-advanced-packaging-at-semicon-taiwan-2026-302860379.html KAOHSIUNG, Aug. 26, 2026 -- E&R Engineering Corp. (Taipei Exchange: 8027), a specialist in semiconductor laser and plasma processing equipment, will showcase its latest technologies at SEMICON Taiwan 2026. Highlights will include high-precision laser drilling for Fiber Array... ———————————————————————————————————————————————————————————— GPU-as-a-Service Market Till 2040: Distribution by Type of Component, Deployment Model, Business Model, Enterprise Size, Application, End User, Geographical Regions, and Key Players 2026-08-26 · GlobeNewswire · AI, Semiconductors https://www.globenewswire.com/news-release/2026/08/26/3351114/28124/en/gpu-as-a-service-market-till-2040-distribution-by-type-of-component-deployment-model-business-model-enterprise-size-application-end-user-geographical-regions-and-key-players.html Key opportunities include AI-ready data centers, liquid-cooled GPU clusters, hybrid and sovereign clouds, fractional GPU access, orchestration and optimization software, inference infrastructure, decentralized marketplaces, and services for SMEs and regulated industries. Key opportunities include AI-ready data centers, liquid-cooled GPU clusters, hybrid and sovereign clouds, fractional GPU access, orchestration and optimization software, inference infrastructure, decentralized marketplaces, and services for SMEs and regulated industries. ———————————————————————————————————————————————————————————— Hyundai Motor Company Charts Profit-Driven Growth Roadmap at 2026 CEO Investor Day 2026-08-26 · Hyundai Motor Company · Finance, AI, Energy, Automotive, Fashion & luxury, Industrial, Semiconductors, Investing & markets, Cloud & data centers https://www.hyundai.com/worldwide/en/newsroom/detail/0000001260 Hyundai Motor reaffirms its 2030 target of 5.55 million global vehicle sales, representing a global market share of 6% Electrified vehicles to reach 60% of sales mix by 2030, up from 23% in 2025 More than 100 global product launches (49 in Korea) and refreshes planned by 2030, including 18+ entries into new products and market segments. Seven new vehicles are arriving in the next eight months alone. First Extended Range Electric Vehicle (EREV) models launch from the first half of 2027 targeting more than 600 miles of range Ramping up U.S. production; SANTA FE EREV to be built in the United States at Hyundai Motor Manufacturing Alabama. North America adds 500,000 units with end-part localization rising above 80%. Global manufacturing capacity expanding by 1.27 million units by 2030 Scaling robotics commercialization with Boston Dynamics, exploring distribution and financing, RMAC to expand ten-fold by end of year Hyundai N, Hyundai’s Performance lineup targeting enthusiasts who crave engagement and high performance, will expand to 100,000 annual sales by 2030, joined by a new volume high-performance tier Genesis, Hyundai Motor Company’s luxury brand, opens its second decade with its first hybrid, its first Extended Range EV and the GV90 flagship SUV, targeting 350,000 annual sales across more than 40 markets by 2030 Robotaxi supply scales with Waymo deliveries beginning in the fourth quarter of 2026; U.S. robot production begins in 2028 with 30,000 units of annual capacity Autonomous driving roadmap set out in stages: Atria AI begins real-world data collection in Korea this year, Level 2+ arrives on the company’s first mass-produced SDV in 2028 in collaboration with NVIDIA, and a 100-megawatt AI data center with more than 50,000 GPUs comes online from 2029 In-house battery cells deliver more than double the output of previous high-nickel cells with 40% faster charging; new Thermal Runaway Protection technology debuts on the Genesis GV90 2030 operating profit margin target raised to above 9%, from the 8–9% guided previously, supported by a 3 percentage point reduction in the cost of sales ratio First-half 2026 results: 95.2 trillion won in revenue, a 5.6% operating profit margin, and market capitalization averaging 105 trillion won year to date ———————————————————————————————————————————————————————————— Vishay Intertechnology to Showcase Solutions for AI Infrastructure and Physical AI at PCIM Asia 2026 2026-08-26 · GlobeNewswire · AI, Energy, Semiconductors https://www.globenewswire.com/news-release/2026/08/26/3351067/0/en/vishay-intertechnology-to-showcase-solutions-for-ai-infrastructure-and-physical-ai-at-pcim-asia-2026.html Company to Highlight Broad Portfolio of Semiconductor and Passive Technologies in a Series of Reference Designs and Product Demonstrations Focused on Grid to Board AI Power Delivery, Software-Defined Vehicles, and Humanoid Robotics Company to Highlight Broad Portfolio of Semiconductor and Passive Technologies in a Series of Reference Designs and Product Demonstrations Focused on Grid to Board AI Power Delivery, Software-Defined Vehicles, and Humanoid Robotics ———————————————————————————————————————————————————————————— ROHM Introduces 650V IGBTs Achieving Industry-Leading* Low Loss Characteristics 2026-08-25 · GlobeNewswire · Automotive, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/08/25/3350890/0/en/rohm-introduces-650v-igbts-achieving-industry-leading-low-loss-characteristics.html Santa Clara, CA and Kyoto, Japan, Aug. 25, 2026 -- ROHM Semiconductor today announced it has developed 4th Generation 650V IGBTs ideal for automotive electric compressors and HV heaters, as well as inverters for industrial equipment. As automotive-grade 650V-class products, new IGBTs achieve class-leading* low conduction loss with VCE(sat)= 1.55V, while providing high short-circuit tolerance and complying with the AEC-Q101 automotive reliability standard. ———————————————————————————————————————————————————————————— GPPC Partners with Japanese Industrial Gas Giant AWI to Enter the High-Growth Semiconductor Specialty Materials Market 2026-08-25 · Business Wire · Energy, Industrial, Semiconductors https://finance.yahoo.com/technology/articles/gppc-partners-japanese-industrial-gas-071700386.html TAIPEI, Taiwan, August 25, 2026--Amid growing demand for advanced semiconductor materials, Grand Pacific Petrochemical Corporation (GPPC) (TWSE: 1312) announced today (August 25) that it has partnered with Japanese industrial gas manufacturer AIR WATER INC. (AWI) to participate in Hong-Kuang Hi-Tech, Corp.’s capital increase, a manufacturer of specialty gases for the semiconductor industry. GPPC and AWI will each hold a 35% stake, making them the company’s two largest shareholders. ———————————————————————————————————————————————————————————— Nordson Electronics Solutions Launches the New ASYMTEK Vantage® XL Fluid Dispensing System for Panel-Level Packaging at SEMICON Taiwan 2026 2026-08-25 · Business Wire · Semiconductors https://finance.yahoo.com/technology/articles/nordson-electronics-solutions-launches-asymtek-051700714.html CARLSBAD, Calif., August 25, 2026--The new ASYMTEK Vantage XL fluid dispensing system for panel-level packaging meets throughput demands during semiconductor applications ———————————————————————————————————————————————————————————— Mech-Mind Launches IPO: Baillie Gifford Leads 9 Top Cornerstone Investors, HK$2.7B for AI R&D & Global Commercialization 2026-08-25 · ACN Newswire · Finance, AI, Energy, Retail, Automotive, Education, Industrial, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/109383/ HONG KONG, August 25, 2026 - Mech-Mind Robot (stock code: 09615.HK) today officially commenced its initial public offering, with a proposed price range of HK$95.30 to HK$101.70 per share and an offering of approximately 23.14 million shares. Should the over-allotment option be exercised in full, the maximum gross proceeds could reach HK$2.706 billion. The offering has attracted a stellar cornerstone investor line-up, led by Baillie Gifford, the century-old Scottish asset management giant renowned for its long-term holdings in technology leaders such as Tesla and Nvidia. Other participating cornerstone investors include Taikang Life, a leading Chinese insurance asset manager; Jane Street, the legendary quantitative trading firm on Wall Street; Golden Link, the industrial capital arm of BYD; as well as Invus, Ghisallo, Ruihua, NGS Super Fund, and E Fund, among other well-known institutions. Standardized Robot “Eye-Brain-Hand”: Global Market Share Ranked First for Four Consecutive Years by a Dominant Margin Mech-Mind focuses on providing robots with a complete closed-loop execution system comprising “eyes” (3D vision), “brain” (AI decision-making), and “hands” (dexterous manipulation). The Company is committed to leveraging standardized, universal product components to break the long-standing industry challenge of high-cost, hard-to-replicate customized solutions. With highly standardized hardware and software suites, its products offer exceptional versatility and reusability, enabling flexible adaptation to diverse industrial scenarios, including automotive, new energy, consumer electronics, education, and general manufacturing. According to CIC Report, in 2025 Mech-Mind ranked first in the global AI + 3D vision-guided non-specialty intelligent robot component market with a market share of approximately 22.1% (revenue of approximately RMB389 million), with its revenue scale nearly 2.6 times that of the second-placed player (8.5%). In terms of shipment volume, the Company captured a 27.5% market share, exceeding the combined total of the next four manufacturers. Mech-Mind ranked first in the China, Japan, and North American markets, and also held a leading position in Southeast Asia, Europe, and South Korea, maintaining the No.1 global market share for four consecutive years. As of March 31, 2026, Mech-Mind has served more than 100 Fortune Global 500 companies in total, with over 29.000 units deployed globally, covering more than 50 different application scenarios across dozens of industries, and capable of handling over 100,000 types of goods. Its client portfolio encompasses global manufacturing giants including CATL, BYD, Midea, Foxconn, Toyota, Volkswagen, and suppliers within Tesla’s supply chain. The Company maintains exceptionally high customer retention. Revenue contribution from existing customers accounted for 78% of total revenue in 2025, and further increased to 86% as at March 31, 2026. Its products are deeply integrated into customers’ production processes, resulting in significant switching costs and underpinning long-term growth momentum. Furthermore, leveraging an extensive, efficient network comprising 1,369 system integrators across the globe, the Company serves end customers in close to 50 countries and regions. Robust Financial Growth: Gross Margin Surges to 64.6% with a Clear Profitability Path Financial data indicates that Mech-Mind is in a critical phase of rapid growth with markedly improved profitability quality. From 2023 to 2025, the Company’s revenue surged from RMB181 million to RMB389 million, representing a compound annual growth rate (CAGR) of 46.6%. In the first quarter of 2026, revenue jumped 73.1% year-on-year to RMB107 million, demonstrating robust resilience amid slowing investment across the global manufacturing sector. Driven by the realization of economies of scale, supply chain cost optimization and an increased revenue share from overseas markets with favorable gross margin profile, the Company’s gross margin rose substantially from 39.1% in 2023 to 51.1% in 2024, further climbing to 64.6% in 2025, and hitting 64.8% in the first quarter of 2026. In terms of gross profit, it registered a year-on-year increase of 94.5% in 2024, 82.8% in 2025 and 79.7% in the first quarter of 2026, demonstrating strong growth momentum. Excluding non-operating factors such as fair value changes in redemption liabilities, the Company’s adjusted net loss narrowed significantly from RMB334 million in 2023 to RMB214 million in 2024, and further declined to RMB109 million in 2025. The adjusted net loss stood at merely RMB33 million in the first quarter of 2026, representing a 14.6% year-on-year contraction with sustained sequential quarterly improvement, which points to a clear path toward profitability. Meanwhile, operating leverage continued to strengthen. The sales expense ratio dropped substantially from 102.7% in 2023 to 42.4% in the first quarter of 2026; the administrative expense ratio fell from 58.2% to 29.9%; and the R&D expense ratio declined from 65.6% to 36.0%. Product sales volume and customer base expanded in tandem. Sales of intelligent robotic guidance products increased from 3,654 units in 2023 to 5,852 units in 2024, reaching 8,268 units in 2025 and 2,412 units in the first quarter of 2026. The number of ordering customers for the respective periods grew from 509 in 2023 to 605 in 2024 and 625 in 2025, and hit 258 in the first quarter of 2026. Globalization Gathers Pace: Over Half of Revenue Generated Overseas, Spanning Around 50 Countries and Regions Breakthrough progress in overseas markets has become a key pillar for Mech-Mind’s value rerating. Between 2023 and 2025, revenue from overseas customers rose from RMB58.6 million to RMB196 million, representing a CAGR of approximately 83%, well above the Company’s overall growth rate. In 2025, overseas markets contributed RMB196 million in revenue, accounting for 50.3% of total revenue — crossing the 50% threshold for the first time. Overseas gross profit also made up more than half of total gross profit, a clear reflection of the Company’s technical premium and pricing power. The Company embraced a globalization strategy from its early days. Back in 2019, it established its German subsidiary. To date, subsidiaries have been set up in the United States, Germany, Japan, South Korea and Hong Kong. More than ten business centers operate in Tokyo, Seoul, Chicago, Munich and other locations, with business footprint covering roughly 50 countries and regions and over 900 cumulative overseas customers served. The Company has obtained major international certifications, including FCC, CE, IC, UKCA, VCCI, KC and NRTL. Its overseas organization is structured across three major regions: AsiaPacific, Europe and the Americas. It is progressively moving into the phase of penetrating lowertier geographic markets and accelerating indepth local cultivation. Tsinghua-Founded Core Team & World-Class R&D Capabilities Mech-Mind was founded in 2016 by Shao Tianlan, an alumnus of Tsinghua University. Its founding team boasts top-tier technical expertise and a global vision. Shao Tianlan, founder and chief executive officer, earned his bachelor’s degree from the School of Software, Tsinghua University, followed by a master’s degree in robotics from the Technical University of Munich (Technische Universitat Munchen) in Germany. Fu Ao, co-founder and vice president of business, holds a bachelor’s degree from the Department of Precision Instrument and a master’s degree from the Department of Mechanical Engineering, Tsinghua University, and previously worked at ABB prior to co-founding the Company. Ding Youshuang, co-founder and vice president of R&D, obtained his doctorate from the Department of Electrical Engineering, Tsinghua University. Zhang Jianwei, Chief Scientist, is an International Member of the Chinese Academy of Engineering and a Member of the German National Academy of Engineering Sciences, a leading authority in intelligent robotics. As of March 31, 2026, the Company employed 229 R&D personnel, accounting for 36% of its total headcount. From 2023 to 2025, cumulative R&D expenditure represented 40.6% of total operating revenue over the period. As of the Latest Practicable Date, the Company held 162 invention patents, 152 utility model patents, 33 design patents and 70 software copyrights. Mech-GPT, its large multimodal model, was recognized by the World Economic Forum as World Economic Forum MINDS Programme. Blue Ocean Market Surges: Proceeds to Fuel AI R&D and Accelerate Global Commercialization From an industry perspective, global AI + 3D visionguided non-specialty intelligent robot component market is experiencing explosive growth. According to data from CIC, this market is expected to grow from RMB1.8 billion in 2025 to RMB10.6 billion in 2030, representing a CAGR of 43.2%, and is projected to further expand to RMB102.5 billion by 2035. Over the same period, the global non-specialty intelligent robot market is expected to grow from 590,000 units in 2025 to 2.25 million units in 2030, and reach 12.08 million units by 2035. As a specialist technology company applying for listing under Chapter 18C of the Listing Rules, Mech-Mind has crossed the critical watershed from technology validation to scaled commercialization. The Company possesses a stable and rapidly growing revenue base, a high gross margin level, and a clear path to profitability, standing in stark contrast to many technology enterprises that are still in the R&D-intensive stage and remain heavily reliant on external financing to sustain operations. Since its establishment, Mech-Mind has secured investments from a number of premier financial investors and industrial capital players. Under the Chapter 18C regime, the Company’s Pathfinder Sophisticated Independent Investor(s)” or “Pathfinder SII(s)” are Sequoia China and Qiming Venture Partners; its Other Sophisticated Independent Investor is Intel. In addition, Mech-Mind’s investor base also includes Meituan, IDG Capital, GIC, Source Code Capital, China Growth Capital, CICC-Porsche Fund, Coatue, among others. Through this IPO, the net proceeds will be precisely allocated to the following core strategic areas: approximately 31.8% for the continued enhancement of R&D investment (of which 14.6% for strengthening AI-centric software capabilities, 9.4% for optimizing core hardware competitiveness, and 7.7% for building scalable R&D infrastructure); approximately 29.4% for expanding global presence and accelerating commercialization (23.7% for overseas business development and 6.3% for domestic business expansion); approximately 25.2% or enriching product portfolios and broadening application scenarios (14.5% for the development of the next-generation “eye-brain-hand” solutions, and 10.7% for expanding into more scenarios such as services and households); approximately 5.0% for capacity expansion and operational efficiency improvement; and approximately 8.6% or working capital and general corporate purposes. ———————————————————————————————————————————————————————————— Semtech Hosts LoRa® Ecosystem Forum at IOTE 2026 2026-08-25 · Business Wire · Finance, AI, Semiconductors https://finance.yahoo.com/technology/articles/semtech-hosts-lora-ecosystem-forum-010000614.html CAMARILLO, Calif., August 25, 2026--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things ("IoT") devices worldwide, will host the LoRa® Global Ecosystem Forum at the 2026 International Internet of Things Exhibition (IOTE), taking place at the Shenzhen World Exhibition & Convention Center (Bao’an District) from Aug. 26-28. The company is exhibiting in Hall 10, Booth #10C51. ———————————————————————————————————————————————————————————— AMD to Bring UCIe Connectivity to Select AMD Versal Adaptive SoCs 2026-08-25 · AMD · Semiconductors https://newsroom.amd.com/news/amd-brings-ucie-connectivity-versal-adaptive-socs/ AMD will offer the first Versal adaptive SoCs supporting Universal Chiplet Interconnect Express connectivity, enabling direct communication with co-packaged chiplets built for specialized workloads. ———————————————————————————————————————————————————————————— Micron Opens State-of-the-Art Training Center in Boise to Strengthen America’s Semiconductor Workforce 2026-08-24 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/08/24/3349992/14450/en/micron-opens-state-of-the-art-training-center-in-boise-to-strengthen-america-s-semiconductor-workforce.html Highlights: ———————————————————————————————————————————————————————————— AI Chip Market to Reach USD 564.87 Billion by 2032, Growing at 15.7% CAGR, Says MarketsandMarkets™ 2026-08-24 · GlobeNewswire · AI, SaaS, Education, Semiconductors https://www.globenewswire.com/news-release/2026/08/24/3349958/0/en/ai-chip-market-to-reach-usd-564-87-billion-by-2032-growing-at-15-7-cagr-says-marketsandmarkets.html Delray Beach, FL, Aug. 24, 2026 -- The global AI Chip Market is projected to reach USD 564.87 billion by 2032 from USD 203.24 billion in 2025, at a CAGR of 15.7% from 2025 to 2032, according to a new report by MarketsandMarkets™. Growth is driven by the pressing need for large-scale data handling and real-time analytics, the surging use of GPUs and ASICs in AI servers, and continuous advancements in machine learning and deep learning technologies, as cloud providers, enterprises, and governments race to build out the compute infrastructure underpinning modern AI applications. ———————————————————————————————————————————————————————————— Luxor Energy and Bentaus Complete First AI GPU Response to ERCOT 4CP Signals 2026-08-24 · PR Newswire · AI, SaaS, Energy, Semiconductors https://www.prnewswire.com/news-releases/luxor-energy-and-bentaus-complete-first-ai-gpu-response-to-ercot-4cp-signals-302857859.html Luxor Energy and Bentaus's Ziani™ platform cut a live GPU's power draw to 25% in under 500 milliseconds with no disruption to inference workloads. HOUSTON, Aug. 24, 2026 -- Luxor Energy, the energy division of Luxor Technology Corporation, and Bentaus, developer of the Ziani™... ———————————————————————————————————————————————————————————— SpaceXAI Adopts NVIDIA Vera CPU to Accelerate Agentic AI at Massive Scale 2026-08-24 · NVIDIA · AI, Semiconductors https://nvidianews.nvidia.com/news/spacexai-adopts-nvidia-vera-cpu-to-accelerate-agentic-ai-at-massive-scale NVIDIA today announced that SpaceXAI will deploy NVIDIA Vera CPUs to accelerate its next generation of agentic AI applications, bringing the first CPU built for AI agents to one of the world’s most ambitious AI deployments. ———————————————————————————————————————————————————————————— Spirit Electronics Adds Texas Instruments and Microchip Technology Space-Grade Components to Online Store Ahead of SmallSat 2026 2026-08-24 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/08/24/3349941/0/en/spirit-electronics-adds-texas-instruments-and-microchip-technology-space-grade-components-to-online-store-ahead-of-smallsat-2026.html Spirit Electronics adds Texas Instruments & Microchip components to its online store, supporting mission‑ready sourcing ahead of SmallSat Conference 2026. ———————————————————————————————————————————————————————————— Intel Outlines Architectures for Agentic AI at Hot Chips 2026 2026-08-24 · Intel · AI, Semiconductors https://newsroom.intel.com/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026 What’s New: Intel is showcasing three architectures for Agentic AI and Enterprise-scale workloads, combining the Diamond Rapids processor for high-performance orchestration, the Crescent Island GPU for efficient inference and the Wildcat Lake SoC for intelligent client and edge computing.“Agentic AI is fundamentally changing how we design and deliver computing – from the transistor and package … The post Intel Outlines Architectures for Agentic AI at Hot Chips 2026 appeared first on Newsroom. ———————————————————————————————————————————————————————————— Canatu receives further reactor order from FST, validating its CNT technology for pellicle manufacturing 2026-08-24 · GlobeNewswire · Finance, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/08/24/3349656/0/en/canatu-receives-further-reactor-order-from-fst-validating-its-cnt-technology-for-pellicle-manufacturing.html Vantaa, Finland, Aug. 24, 2026 -- Canatu Plc (CANATU, Nasdaq First North Growth Market Finland) has received an order for further CNT100 SEMI reactor from Korean semiconductor company FINE SEMITECH CORPORATION (FST). ———————————————————————————————————————————————————————————— AAC Technologies CFO Guo Dan: Full-Year 2026 Revenue is Expected to deliver Double-Digit Growth, AI New Businesses Poised to Exceed RMB8 Billion in 2027 2026-08-24 · ACN Newswire · Finance, AI, SaaS, Retail, Automotive, Industrial, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/109356/ SINGAPORE, August 24, 2026 - 20 August 2026, AAC Technologies Holdings Inc. (stock code: 2018.HK; “AAC Technologies” or the “Group”) today released its interim results for the six months ended 30 June 2026. Revenue for the first half of 2026 (“1H 2026”) reached a record RMB14.51 billion, up 8.9% year-on-year (“YoY”). Net profit attributable to owners of the Company rose 2.9% YoY to RMB901 million. After excluding other gains and losses related to fair value gains and losses, the growth rate of net profit for the first half of the year stood at 37.4%. This marks the third consecutive year the Group has achieved a record first-half revenue since pivoting toward AI-related new businesses. At the results briefing, CFO Guo Dan highlighted that AI new businesses have become the core driver of the Group’s top-line growth. As specialized business segments including liquid-cooling coolant distribution units (CDUs), wafer-level glass (WLG) optical communications, AR optical waveguide lenses and robotic motors ramp, the Group’s multi-engine growth model is accelerating, and the contribution from new businesses is set to expand further. Full-year 2026 revenue is expected to deliver double-digit growth, with the scale of AI new businesses potentially exceeding RMB8 billion in 2027. ( AAC Technologies CFO Guo Dan) Full-year revenue is expected to deliver double-digit growth Dan stated that despite external market pressures, management remains cautiously optimistic regarding full-year operations, expecting double-digit revenue growth with gross profit margin to improve steadily from the 22.4% recorded in 1H 2026. By segment, the acoustics and electromagnetic drives business is expected to deliver single-digit full-year revenue growth, with gross margin likely to improve further from the 28.6% recorded in the first half. The precision mechanics and heat dissipation business continues to be a powerful  growth engine, with full-year revenue expected to increase by more than 30%. Gross margin in this segment reached 23.1% in the first half and is expected to rise further in the second half. The optics business saw a YoY decline in revenue, reflecting industry conditions and customer mix, but overall gross margin remained resilient. Gross margin of plastic lenses and G+P hybrid lenses improved by more than 5 percentage points YoY, driven by yield and process optimization. The Group is increasing the shipment mix of 6P-and-above high-end lenses and accelerating certification and onboarding with overseas customers. The sensor and semiconductor business, benefiting from AI-driven upgrades in end devices, is expected to grow full-year revenue by 15%–20%, with gross margin improving steadily. Automotive acoustics, leveraging vertically integrated solutions spanning speakers, amplifiers and professional tuning, is expected to grow full-year revenue by 15%–20% despite a weaker auto market. Gross margin may decline by around 2 percentage points YoY, reflecting intensified industry competition and changes in product mix. Among the global leaders in AI thermal management Rapid advances in the AI industry have triggered a surge in thermal-management demand. In 1H 2026, AAC Technologies’ heat dissipation revenue surged approximately 400% YoY to RMB1.10 billion, highlighting its strong growth momentum. According to Dan, AAC Technologies now ranks among the global leaders in consumer-electronics thermal management and among China’s top-three AI-server liquid-cooling providers by market size. In consumer electronics, shipments of the Group’s high-performance innovative vapor chambers (VCs) continued to ramp, and mass-production preparations for next-generation products are progressing smoothly. In AI computing, the Group is pursuing a dual-market expansion strategy covering both domestic and overseas markets. Yuandi (Guangzhou) Digital Technology Co., Ltd., a subsidiary of the Group, has commenced scaled mass production and global batch deliveries of high-power centralized liquid-cooling CDUs, with monthly delivery capacity exceeding 600 units, firmly placing it among the industry’s leading players. Proprietary WLG technology enters optical communications Dan noted that co-packaged optics (CPO), a key technology direction for next-generation high-speed optical interconnects, imposes more stringent requirements on optical alignment — opening an important application scenario for WLG technology. AAC Technologies’ proprietary, self-developed WLG wafer-level glass molding technology offers advantages in high precision, superior consistency and large-scale mass production. The Group is actively engaging in technical exchanges, factory audits and sample submissions with leading overseas optical communications companies, including top-tier players providing high-speed interconnect chips for AI and cloud infrastructure. In AR optics, AAC Technologies has built a one-stop optical system design and simulation solution covering waveguides and light engines. Dan said the Group has become the industry’s first company to achieve volume delivery of full-color light engines serving top-tier customers. In single-layer surface relief grating (SRG) diffractive optical waveguides, it is also the first in the industry to achieve mass production using etching processes. First-ever integration of acoustics and electromagnetic drives To capture AI industry growth opportunities, AAC Technologies has combined its former acoustics and electromagnetic drives businesses — the first organizational integration of these two core segments since the Company’s listing. The combined segment generated revenue of RMB6.01 billion in the first half, up 14.2% YoY, with a gross profit margin of 28.6%. During the reporting period, the segment secured key breakthroughs across several new business lines. Projects related to active cooling fans have successfully passed customer certification and are expected to become standard configurations for high-end models over time, with further expansion into servers, robotics and other markets. Robotic motors and modules secured project design wins from several leading global customers, with certain projects already entering mass production. In addition, AAC Technologies is strategically expanding into the robot systems business, with relevant projects expected to enter mass production by the end of 2026. “One of the Group’s core strengths is its technology platforms plus cross-scenario reuse,” Dan said. Going forward, the Group will further deepen the integration of the acoustics and electromagnetic drives segment, unlocking synergies across technologies, production capacity and customer resources. While solidifying its core position in consumer electronics, the Group will deliver comprehensive solutions into emerging tracks such as automotive, humanoid robotics and AI terminals, continuously unlocking product value-add and long-term growth potential. Robotics business expected to reach RMB400–700 million in 2027 Regarding the development pace of the robotics industry, Dan noted that the ultimate form of embodied AI remains unsettled. Beyond humanoid robots, task-specific robots for professional scenarios, desktop AI interactive devices and other form factors are being explored in parallel, with product maturity and commercialization timelines varying significantly across use cases. Leveraging its long-standing expertise in precision electromagnetic drives, the Group is building capability moats around universal core components for robots — including motors, rotary joints and gimbal modules. It has already established deep partnerships with several leading overseas robotics companies, spanning core-component supply and joint technology development, and can flexibly address the differentiated needs of different robot form factors. Based on the current project pipeline, Dan said the Group’s robotics-related business is expected to reach RMB400–700 million in 2027. Looking ahead, as large AI models migrate to the edge and multi-form robot applications penetrate faster with accelerating commercialization, the segment is expected to see even stronger growth in the coming years. AI new businesses poised to exceed RMB8 billion next year Addressing market concerns over the impact of rising memory chip prices on the smartphone supply chain, Dan said that, despite industry pressure, AAC Technologies’ traditional smartphone businesses maintained a stable-to-improving gross margin, thanks to the Company’s solid core technology foundation and continuous improvements in internal operational efficiency. Dan further noted that, based on first-half operating performance and the internal outlook for the second half, AAC Technologies has effectively withstood the pressure from declining smartphone shipments and managed the impact of this round of memory-chip price increases on the handset supply chain. Looking at the Company’s medium- to long-term strategic roadmap, Dan revealed that the overall scale of the Company’s AI-related new businesses is expected to reach RMB8–9 billion by 2027, transforming these emerging segments into AAC Technologies' core growth engine. By business line, 2027 scale is expected as follows: - Vapor chambers (VCs) and active cooling: around RMB5 billion - AI devices and gimbal modules: around RMB1.5 billion - CDU liquid cooling and cold plates: around RMB1 billion - robotic core components: RMB400–700 million - new automotive acoustics initiatives: around RMB500 million - WLG optical communications: around RMB100 million in initial revenue “The RMB8–9 billion scale is only a beginning,” Dan emphasized. AI-driven industry transformation is just getting started. The new businesses the Company is focused on — including edge AI hardware, data center liquid cooling, XR, robotics and intelligent cockpits — are expected to grow far faster than traditional businesses over the next three to five years, continuously unlocking growth momentum. Source: Hong Kong Commercial Daily Original article: https://www.hkcd.com.hk/content_app/2026-08/21/content_8770919.html ———————————————————————————————————————————————————————————— Advantech Unveils Qualcomm® Dragonwing™ IQ9-Based Solutions for Industrial Vision Intelligence 2026-08-24 · PR Newswire · AI, Industrial, Semiconductors https://www.prnewswire.com/news-releases/advantech-unveils-qualcomm-dragonwing-iq9-based-solutions-for-industrial-vision-intelligence-302857919.html TAIPEI, Aug. 21, 2026 -- Advantech announced its latest edge AI solutions powered by the Qualcomm® Dragonwing™ IQ-9075 processor, including the AOM-6741 SMARC module, ASR-A503/AFE-A503 robotic controllers, and AIR-055 edge AI system. Designed for industrial-grade vision... ———————————————————————————————————————————————————————————— Empowering the Next Generation: AMD Learning Labs in Action 2026-08-24 · AMD · Education, Semiconductors https://newsroom.amd.com/news/empowering-next-generation-amd-learning-labs/ Empowering the Next Generation: AMD Learning Labs in Action ———————————————————————————————————————————————————————————— HostColor Adds New POPs for AMD Dedicated Servers 2026-08-22 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/08/22/3349360/0/en/hostcolor-adds-new-pops-for-amd-dedicated-servers.html HostColor.com (HC) has updated its AMD hosting service by adding new locations for delivering AMD Ryzen- and AMD EPYC-powered dedicated servers with bandwidth quotas of up to 100 Gbps. HostColor.com (HC) has updated its AMD hosting service by adding new locations for delivering AMD Ryzen- and AMD EPYC-powered dedicated servers with bandwidth quotas of up to 100 Gbps. ———————————————————————————————————————————————————————————— Photronics, Inc. (PLAB) Notice of September 4, 2026 Application Deadline for Class Action Lawsuit - Contact Reed Kathrein at Hagens Berman Sobol Shapiro LLP Before Application Deadline 2026-08-21 · Newsfile · Finance, Semiconductors https://www.newsfilecorp.com/release/310893/Photronics-Inc.-PLAB-Notice-of-September-4-2026-Application-Deadline-for-Class-Action-Lawsuit-Contact-Reed-Kathrein-at-Hagens-Berman-Sobol-Shapiro-LLP-Before-Application-Deadline San Francisco, California--(August 21, 2026) - Hagens Berman, a leading national shareholder rights law firm, is conducting an investigation into Photronics, Inc. (NASDAQ: PLAB) regarding alleged violations of federal securities laws. This investigation follows the recent filing of a class action lawsuit, which alleges that Photronics misled investors concerning the demand and outlook for its high-end integrated circuit (IC) photomask product line.SUBMIT YOUR LOSSES TO HAGENS... ———————————————————————————————————————————————————————————— Qnity to Present at the Goldman Sachs Communacopia and Technology Conference 2026-08-21 · Business Wire · Finance, Semiconductors https://finance.yahoo.com/technology/articles/qnity-present-goldman-sachs-communacopia-203000238.html WILMINGTON, Del., August 21, 2026--Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will have a fireside chat at the 2026 Goldman Sachs Communacopia and Technology Conference on September 10, at 8:10am PST. ———————————————————————————————————————————————————————————— Semiconductor Manufacturing Equipment Market to Reach USD 344.36 Billion by 2032, Growing at 11.0% CAGR, Says MarketsandMarkets™ 2026-08-21 · GlobeNewswire · AI, Industrial, Semiconductors https://www.globenewswire.com/news-release/2026/08/21/3349205/0/en/semiconductor-manufacturing-equipment-market-to-reach-usd-344-36-billion-by-2032-growing-at-11-0-cagr-says-marketsandmarkets.html Delray Beach, FL , Aug. 21, 2026 -- The global Semiconductor Manufacturing Equipment Market was valued at USD 166.35 billion in 2025 and is projected to reach USD 344.36 billion by 2032, growing at a CAGR of 11.0% from 2025 to 2032, according to a new report by MarketsandMarkets™. The rapid adoption of artificial intelligence (AI) and high-performance computing (HPC) applications is significantly driving demand for advanced-node, high-performance semiconductors, as the expansion of data centers for AI training and inference fuels investment in cutting-edge logic and memory capacities, requiring increasingly sophisticated manufacturing equipment. ———————————————————————————————————————————————————————————— Qnity Appoints Semiconductor Finance Veteran Ken Rizvi Chief Financial Officer 2026-08-21 · Business Wire · Finance, Semiconductors https://finance.yahoo.com/technology/articles/qnity-appoints-semiconductor-finance-veteran-110500952.html WILMINGTON, Del., August 21, 2026--Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that it has appointed Ken Rizvi, a seasoned semiconductor finance executive, as Senior Vice President and Chief Financial Officer, effective October 1. Michael Goss, who has been serving as interim Chief Financial Officer, will assume the role of Qnity’s Vice President, Finance and Controllership, at that time. ———————————————————————————————————————————————————————————— Leading Across All Metrics: Xunce Technology Reports Record-High Mid-Year Revenue and Net Profit; AI-to-B Platform Enters a New Cycle of Exponential Growth 2026-08-21 · ACN Newswire · Finance, Crypto, AI, SaaS, Energy, Automotive, Telecom, Industrial, Logistics, Semiconductors https://www.acnnewswire.com/press-release/english/109316/ HONG KONG, Aug 21, 2026 - On August 21, Xunce Technology (03317.HK) released its 2026 interim results report: In the first half of the year, the company achieved revenue of 967 million yuan, a significant year-over-year increase of 389%, setting a new record high for the same period; net profit attributable to shareholders was 72.5 million yuan, compared to a net loss attributable to shareholders of 89.4 million yuan in the same period last year, marking the company’s first profitable first half of the year; Adjusted net profit was 67 million yuan, compared to an adjusted net loss of 105 million yuan in the same period last year, marking a comprehensive turnaround from loss to profit; the gross profit margin reached 60.1%, remaining stable at a high level; total assets were approximately 3514 million yuan, net assets were approximately 2482 million yuan, and with ample cash on hand, reflecting a significant improvement in operational quality. As a leading provider of AI real-time data infrastructure and analytics services in China, Xunce Technology made breakthrough progress in the first half of the year across business models, product innovation, industry penetration, and international expansion. The company led the industry across all key metrics, officially transitioning from the “investment phase” to the “profit realization phase,” while also exploring new avenues for profitability. Four Key Drivers Fuel Strong Revenue Growth and Continued Improvements in Operational Efficiency In the first half of 2026, against the backdrop of the 15th Five-Year Plan designating artificial intelligence as a national strategic priority, enterprise-level AI is accelerating its transition from model training to practical inference deployment, and from general-purpose capabilities to industry-specific applications. As a result, demand from enterprises for high-quality, structured, scenario-based real-time data is growing exponentially. Facing these significant development opportunities, Xunce Technology based on the FDE model, has expanded its end-to-end data processing and tokenization capabilities—covering everything from data acquisition to large-model fine-tuning—to transform dispersed and heterogeneous enterprise data into data tokens. This helps clients reduce costs, improve efficiency, maximize the business value per token, and achieve more agile, data-driven decision-making. Currently, the company has penetrated eleven high-value, high-barrier industries and developed over 400 functional modules. It has refined three core technological advantages: millisecond- and second-level real-time response, 100% accurate data processing, and data tokenization, connecting computing power to algorithms and taking responsibility for clients’ business outcomes. The company delivered strong performance in the first half of the year, with both revenue and net profit reaching all-time highs. The high revenue growth was primarily driven by the synergistic effect of four key drivers: accelerated deployment of enterprise-grade AI real-time data infrastructure, accelerated penetration into diverse industries, the implementation of the Token business model, and the expansion of international operations and ecosystem development. The significant turnaround in profitability was driven by a steady increase in the proportion of high-margin businesses; the realization of economies of scale from a platform-based and modular product architecture, leading to significantly improved operational efficiency and further optimization of the structure of R&D, sales, and general and administrative expenses; improved cash management efficiency, and investment income contributing to incremental profits. At the same time, the company’s operational efficiency has continued to rise. It has established a data development system centered on the AIDP platform, automating data development tasks. Its solutions are deeply integrated into clients’ self-managed cloud or on-premises systems, serving as a “data hub” that deeply embeds AI into corporate clients’ core business processes, supports high-quality business decision-making, and thereby continuously enhances clients’ willingness to pay;In the first half of the year, the company’s ARPU jumped from 1.64 million yuan to 5.56 million yuan, marking a significant year-over-year increase of 240 percent. Customer retention rates have long remained above 90%, fully demonstrating the strong lock-in effect and high customer stickiness resulting from the deep integration of the product into clients’ business processes, with per-capita revenue surged by 379% year-over-year, placing its labor efficiency among the highest in the AI technology sector. Driven by the dual engines of TokenOS and TokenCloud, revenue from the Token business accounts for over 10% In the first half of this year, the company proactively pioneered the Token business model, enabling data token calls to drive AI-based business decisions. Currently, the Token business model has been implemented in multiple high-value scenarios and has undergone successful commercial validation. During the first half of the year, revenue from the Token business model surpassed 10% of total revenue, with strong growth in ARR (Annual Recurring Revenue). It has become a new engine for revenue growth, and the commercialization of the token economy has far exceeded expectations. The company launched the world’s first TokenOS operating system, which focuses on data capabilities. It transforms enterprises’ multi-source, heterogeneous data in real time into standardized, measurable, and priceable scenario-based tokens, establishing a seamless end-to-end pipeline from data ingestion to model invocation. This enables enterprise data to be directly utilized as tokens and drives the implementation of token factories across various industries. Building on this foundation, the company has also launched the TokenCloud platform, which focuses on model capabilities and “data + model” capabilities. This accelerates the development of an integrated, end-to-end product and service ecosystem spanning “computing power—data—tokens—models—applications,” covering the entire lifecycle from underlying computing power scheduling and data tokenization to model inference optimization, as well as the refinement, tuning, and deployment of enterprise-specific small models. This drives the transformation of AI from a general-purpose capability into enterprise-specific productivity. TokenOS and TokenCloud work in tandem to provide enterprise customers with a one-stop AI infrastructure, enabling them to reduce deployment costs and improve matching efficiency across computing power, data, and models. This “operating system + cloud platform” dual-drive architecture forms the company’s strong competitive barrier, helping it become the computing infrastructure partner for enterprise AI transformation. Accelerated Penetration Across Diverse Industries and Substantial Progress Toward Internationalization Xunce Technology began in the asset management industry, which has the most stringent requirements for data real-time performance. It has now extended its AI real-time data processing capabilities to eleven high-value, high-barrier industries, including telecommunications, electric power, energy, urban operations, and high-end manufacturing. The company is accelerating its penetration across diverse industries, and its ability to replicate solutions across sectors continues to be validated. In the first half of this year, the company collaborated with PATEO Connect and Saimo Technology to jointly develop a token-based physical AI and world model, entering the smart connected vehicle sector; it partnered with three major domestic GPU manufacturers—MetaX, Iluvatar CoreX, and Biren Technology—to build a “computing power + data” closed-loop system; and through a strategic partnership with Shenzhen Kaihong, it implemented tokenization capabilities within the HarmonyOS ecosystem to explore world models and physical AI. The “Scenario Token Factory” model continues to be validated across multiple industries, scenarios, and ecosystems. As a result, the company’s revenue from diversified industries rose to 87.6%, making its business structure more diversified and opening up broader growth opportunities for the company. In addition, the company is actively expanding its overseas operations, accelerating the global rollout of the TokenOS operating system and its tokenization business model; it has also entered into strategic partnerships with the Shenzhen Data Exchange and the Beijing International Data Exchange, laying the foundation for global expansion. In the first half of the year, the company’s overseas revenue reached 11.86 million yuan，year-over-year increase of 264%. Four-Stage Evolution of AI Data Infrastructure: Strategic Initiatives Across Five Key Directions Looking ahead, Xunce Technology has established a strategic evolution path for the four-stage transformation of AI data infrastructure: starting with data governance (1.0), progressing through the tokenization phase (2.0), and moving toward a global token exchange platform (3.0) in the future, while accelerating the training and large-scale deployment of enterprise-level small models (4.0). Specifically, in Phase 1.0, the company began in the asset management industry and expanded across sectors, fully validating its cross-industry data governance capabilities. In Phase 2.0, the company used TokenOS to refine enterprise private data into high-quality scenario-based tokens and provided one-stop services through the end-to-end integrated cloud service platform TokenCloud, opening up a growth channel for its token business. In Phase 3.0, the company will launch a global Token exchange platform to break down barriers to Token circulation across enterprises, industries, and scenarios. In Phase 4.0, the company will use enterprise-grade small models to bridge the “last mile” of AI implementation, forming a complete closed-loop ecosystem of “computing power—data—Tokens—models—applications.” At the same time, the company will implement strategic initiatives across five key areas: First, deepening the evolution of its business model by accelerating the transition from project-based and subscription-based models to exploring a Token-based business model; second, accelerating cross-industry replication through a “high barriers, high value” expansion strategy to continuously unlock growth opportunities across diverse industries; third, pioneering cutting-edge applications to secure a leading position in future industries; fourth, building a strategic partnership ecosystem to forge deep ties with upstream and downstream players in computing power and algorithms; and fifth, steadily expanding overseas operations to lay the groundwork for a global footprint. By implementing strategic initiatives across these five key areas, the company will continue to create commercial value for its customers and usher in a new cycle of exponential growth. These impressive financial results mark a turning point for Xunce Technology as it officially begins to realize its value. At a time when demand for high-quality industry data is surging due to the inference requirements of large AI models, the company has built a solid competitive moat through its proprietary token system and opened up vast opportunities for revenue growth through “in-depth cross-industry development and international expansion.” In the future, as the ecosystem of token exchange platforms matures and enterprise-level small-model applications are implemented, this will significantly expand the potential for profit growth, propelling Xunce Technology onto a fast track of rapid development. ———————————————————————————————————————————————————————————— CrowdStrike’s Fal.Con 2026 Unites Cybersecurity’s Ecosystem to Secure the AI Revolution 2026-08-20 · Business Wire · Finance, AI, SaaS, Retail, Cybersecurity, Semiconductors https://finance.yahoo.com/technology/ai/articles/crowdstrike-fal-con-2026-unites-150000651.html AUSTIN, Texas, August 20, 2026--CrowdStrike (NASDAQ: CRWD) today announced that Fal.Con 2026 will feature a record 150+ ecosystem sponsors, led by Amazon Web Services (AWS), Accenture, Anthropic, Dell Technologies, Ernst & Young LLP (EY US), Google Cloud, Horizon3, Intel, NVIDIA, and OpenAI. The sold-out conference will bring together more than 10,000 attendees from 4,000 organizations across 71 countries. Fal.Con is now the largest vendor-hosted conference in cybersecurity. ———————————————————————————————————————————————————————————— COSMOS, Intel, and Airspan to Test and Evaluate OCUDU in End-to-End, 5G/NextG Deployment Scenarios 2026-08-20 · Business Wire · SaaS, Education, Telecom, Semiconductors https://finance.yahoo.com/technology/articles/cosmos-intel-airspan-test-evaluate-120300823.html PLANO, Texas, August 20, 2026--The Cloud Enhanced Open Software Defined Mobile Wireless Testbed for City-Scale Deployment (COSMOS), a National Science Foundation PAWR (Platform for Advanced Wireless Research) platform led by Rutgers University/WINLAB together with Columbia University and New York University, has embarked on a collaboration with Intel and Airspan Networks to integrate, test, and evaluate the OCUDU (open source CU/DU) software stack in the context of end-to-to open source 5G deplo ———————————————————————————————————————————————————————————— Invitation to Presentation of Sivers Semiconductors' Q2 2026 Report 2026-08-20 · PR Newswire · Finance, Semiconductors https://www.prnewswire.com/news-releases/invitation-to-presentation-of-sivers-semiconductors-q2-2026-report-302856046.html NEW YORK, Aug. 20, 2026 -- Sivers Semiconductors AB (STO: SIVE) will publish its interim report for the second quarter of 2026 on 27 August 2026 at approx. 6:00 PM CET. In connection with the earnings release, a presentation will be held starting at 7:00 PM CET. As Sivers'... ———————————————————————————————————————————————————————————— proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems 2026-08-19 · Business Wire · Healthcare, Semiconductors https://finance.yahoo.com/technology/articles/proteantecs-unveils-advanced-packaging-solutions-150000008.html HAIFA, Israel, August 19, 2026--proteanTecs®, the leading provider of deep data visibility for advanced electronics, today unveiled a dedicated suite of health, power and performance management solutions for multi-die systems. Based on the company’s unique on-chip monitoring technology, semiconductor and system companies can now improve yield, reduce risk and protect investments in high-value systems-in-package. ———————————————————————————————————————————————————————————— xETFs Launches ETF to Capture Leading Firms Across the Full Korea AI Semiconductor Ecosystem: KSMH 2026-08-19 · Business Wire · AI, Semiconductors https://finance.yahoo.com/technology/ai/articles/xetfs-launches-etf-capture-leading-143400566.html NEW YORK, August 19, 2026--xETFs launches KSMH, provides single-ticker access and exposure to Korea’s largest AI chipmakers and broader Korean semiconductor industry. ———————————————————————————————————————————————————————————— Semtech Expands LoRa Plus™ Family: LR2022 and LR2012 Now in Production 2026-08-19 · Business Wire · Finance, AI, Semiconductors https://finance.yahoo.com/technology/articles/semtech-expands-lora-plus-family-120000783.html CAMARILLO, Calif., August 19, 2026--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things ("IoT") devices worldwide, today announced the expansion of its LoRa Plus family with the introduction of the LR2022 and LR2012 transceivers, both now available in production. ———————————————————————————————————————————————————————————— Cerebras Unveils CS-4: Up to 30 Times Faster than GPU-based Solutions 2026-08-19 · GlobeNewswire · Semiconductors https://www.globenewswire.com/news-release/2026/08/19/3347356/0/en/cerebras-unveils-cs-4-up-to-30-times-faster-than-gpu-based-solutions.html Cerebras Unveils CS-4: Up to 30 Times Faster than GPU-based Solutions ———————————————————————————————————————————————————————————— Intel Corporation to Participate in Upcoming Investor Conference 2026-08-18 · Intel · Semiconductors https://newsroom.intel.com/corporate/intel-corporation-to-participate-in-upcoming-investor-conference-august-2026 SANTA CLARA, Calif., August 18, 2026 – Intel Corporation today announced that David Zinsner, executive vice president and chief financial officer, and John Pitzer, corporate vice president, global treasury and investor relations, will participate in a fireside chat on Intel’s business and strategy at the Deutsche Bank's 2026 Technology Conference on August 26 at 10:35 a.m. PDTA live webcast and replay can be accessed publicly on Intel's Investor … The post Intel Corporation to Participate in Upcoming Investor Conference appeared first on Newsroom. ———————————————————————————————————————————————————————————— CesiumAstro Acquires Jariet Technologies to Advance Vertically Integrated Communications and ISR from Silicon to Missions 2026-08-18 · Business Wire · Finance, Semiconductors https://finance.yahoo.com/technology/articles/cesiumastro-acquires-jariet-technologies-advance-010000490.html AUSTIN, Texas, August 18, 2026--CesiumAstro Inc., a global leader in advanced space communications and intelligence, surveillance, and reconnaissance (ISR) systems, has announced the acquisition of Jariet Technologies, a leading mmWave RF System-on-Chip (RF-SoC) semiconductor company specializing in leading integrated solutions for SATCOM, electronic warfare (EW), and radar systems. ———————————————————————————————————————————————————————————— The Generative AI Hardware Materials Market 2026-2036: Semiconductors, Memory, Packaging, and Thermal Management 2026-08-17 · GlobeNewswire · AI, Logistics, Semiconductors https://www.globenewswire.com/news-release/2026/08/17/3346267/28124/en/the-generative-ai-hardware-materials-market-2026-2036-semiconductors-memory-packaging-and-thermal-management.html The Generative AI Hardware Materials Market 2026–2036 report forecasts opportunities across AI accelerators, HBM, advanced packaging, silicon photonics, liquid cooling, GaN/SiC power and edge AI. It maps capacity bottlenecks, supplier competition, regional market share and geopolitical risks shaping the Asia-led AI infrastructure supply chain. The Generative AI Hardware Materials Market 2026–2036 report forecasts opportunities across AI accelerators, HBM, advanced packaging, silicon photonics, liquid cooling, GaN/SiC power and edge AI. It maps capacity bottlenecks, supplier competition, regional market share and geopolitical risks shaping the Asia-led AI infrastructure supply chain. ———————————————————————————————————————————————————————————— HIVE Reports Q1 2027 Revenue of $79.1 Million; Contracted GPU Cloud ARR(1) Reaches Approximately $110 million 2026-08-15 · Newsfile · Finance, SaaS, Semiconductors https://www.newsfilecorp.com/release/309810/HIVE-Reports-Q1-2027-Revenue-of-79.1-Million-Contracted-GPU-Cloud-ARR1-Reaches-Approximately-110-million San Antonio, Texas--(August 15, 2026) - HIVE Digital Technologies Ltd. (TSX: HIVE) (Nasdaq: HIVE) (BVC: HIVECO) (the "Company" or "HIVE"), a global leader in sustainable data center infrastructure, today announced its results for the first quarter of fiscal 2027, ended June 30, 2026 (all amounts in US dollars, unless otherwise indicated).Q1 FY2027 Financial HighlightsTotal Revenue: $79.1 million, up 73.5% year-over-year and 10.2% sequentially reflecting strong contributions from... ———————————————————————————————————————————————————————————— Why Scaling AI Compute Performance Requires a New Power Architecture 2026-08-11 · NVIDIA · AI, Energy, Travel, Semiconductors https://blogs.nvidia.com/blog/800-vdc-power-architecture-ai-factory/ Every new generation of accelerated computing demands more from the infrastructure underneath it — more compute performance, higher rack density and more efficient, scalable power distribution. The bottleneck isn’t just wattage. It’s how power gets from the grid to the GPU.  In traditional power delivery, electricity travels from the grid as an alternating current (AC) […] ———————————————————————————————————————————————————————————— Intel Announces Upsize and Pricing of $20 Billion Common Stock Offering 2026-08-11 · Intel · Finance, Semiconductors https://newsroom.intel.com/corporate/intel-announces-upsize-and-pricing-of-20-billion-common-stock-offering Intel today announced the pricing of its previously announced registered public offering of common stock.Intel priced the underwritten public offering of 210,526,315 shares of common stock at a public offering price of $95 per share. Intel has granted to the underwriters a 30-day option to purchase up to 31,578,947 additional shares of common stock at … The post Intel Announces Upsize and Pricing of $20 Billion Common Stock Offering appeared first on Newsroom. ———————————————————————————————————————————————————————————— Intel Gamer Days 2026 Kicking Off with AAA Gaming Bundle & Partnerships 2026-08-10 · Intel · Retail, Gaming, Media, Semiconductors https://newsroom.intel.com/client-computing/intel-gamer-days-2026-kicking-off-with-aaa-gaming-bundle-partnerships What’s New: Intel’s annual Gamer Days campaign officially kicks off today, bringing gamers around the globe exciting new retail promotions, giveaways, and content collaborations with participating partners.Headlining this year’s Intel® Gamer Days campaign is the Intel retail bundle running August 10th through September 13th. With this bundle, gamers can secure their own digital copies of … The post Intel Gamer Days 2026 Kicking Off with AAA Gaming Bundle & Partnerships appeared first on Newsroom. ———————————————————————————————————————————————————————————— Intel Announces Proposed $15 Billion Common Stock Offering 2026-08-10 · Intel · Finance, AI, Semiconductors https://newsroom.intel.com/corporate/intel-announces-proposed-15-billion-common-stock-offering SANTA CLARA, Calif., August 10, 2026 - Intel Corporation (Nasdaq: INTC) today announced a $15 billion underwritten public offering of common stock.Why NowCustomers continue to signal a strong and sustainable demand environment, driven by unprecedented investment in AI compute. Progress in emerging areas including physical AI, purpose-built silicon, advanced packaging and external wafers represent significant … The post Intel Announces Proposed $15 Billion Common Stock Offering appeared first on Newsroom. ———————————————————————————————————————————————————————————— Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth 2026-08-07 · Intel · AI, Semiconductors https://newsroom.intel.com/corporate/intel-announces-leadership-appointment-to-strengthen-customer-engagement-and-accelerate-growth SANTA CLARA, Calif., August 7, 2026 – Intel Corporation today announced the appointment of Dean Jarnac as executive vice president and chief sales officer. Jarnac will lead Intel's global sales organization— strengthening Intel's customer relationships and go-to-market execution across its product portfolio, including client, data center, AI, networking, and ASICs.“Customer focus and execution are central to Intel's strategy and … The post Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth appeared first on Newsroom. ———————————————————————————————————————————————————————————— Creating Pathways to Semiconductor Careers: Intel Launches SEPP 2026-08-06 · Intel · Education, Semiconductors https://newsroom.intel.com/corporate/creating-pathways-to-semiconductor-careers-intel-launches-sepp As the semiconductor industry continues to drive innovation across nearly every aspect of modern life, Intel is investing in the next generation of talent through the launch of the Semiconductor Education Pathways Program (SEPP) — a comprehensive workforce development initiative designed to strengthen education pathways from K-12 through post-secondary education and into semiconductor careers.SEPP is … The post Creating Pathways to Semiconductor Careers: Intel Launches SEPP appeared first on Newsroom. ———————————————————————————————————————————————————————————— Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure 2026-08-05 · Samsung · AI, Semiconductors https://news.samsung.com/global/samsung-unveils-next-gen-3d-memory-vision-at-fms-2026-charting-the-future-of-ai-infrastructure Samsung Electronics a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterprise storage and relevant advanced semiconductor technologies, Samsung presented its latest AI memory portfolio and technology roadmap, including a preview of […] ———————————————————————————————————————————————————————————— Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference 2026-08-04 · Marvell Technology · AI, Semiconductors https://investor.marvell.com/news-events/press-releases/detail/1030/marvell-advances-ai-memory-infrastructure-portfolio-to-accelerate-agentic-ai-inference Industry’s broadest portfolio: New Marvell® Bravera® and Photonic Fabric™ innovations build on Marvell Structera™ CXL memory leadership across AI storage, rack-scale memory expansion and pooling, and pod-level optical shared memory. Overcoming memory bottlenecks: Increased access to high-capacity, high-bandwidth memory across AI infrastructure helps address growing KV cache demands, reduce GPU stalls, improve utiliza ———————————————————————————————————————————————————————————— Broadcom Inc. to Announce Third Quarter Fiscal Year 2026 Financial Results on Wednesday, September 2, 2026 2026-08-03 · Broadcom · Finance, Semiconductors, Software & IT https://www.prnewswire.com/news-releases/broadcom-inc-to-announce-third-quarter-fiscal-year-2026-financial-results-on-wednesday-september-2-2026-302840343.html Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions,... ———————————————————————————————————————————————————————————— Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors 2026-07-29 · Intel · AI, Semiconductors https://newsroom.intel.com/intel-foundry/intels-us-advanced-packaging-enables-next-generation-ai-semiconductors As AI demands unprecedented "brain power," the semiconductor industry is moving past the era of relying on single, massive chips. Advanced packaging is the essential craft of interconnecting multiple specialized chips together. This allows them to function as a single, powerful unit that runs faster handling the massive workloads of the future.Intel’s been doing advanced … The post Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors appeared first on Newsroom. ———————————————————————————————————————————————————————————— Qualcomm Completes Acquisition of Modular 2026-07-29 · Qualcomm · Finance, AI, Semiconductors, Software & IT https://www.prnewswire.com/news-releases/qualcomm-completes-acquisition-of-modular-302837286.html Qualcomm Incorporated (NASDAQ: QCOM) today announced that it has completed its acquisition of Modular Inc, a leading innovator in AI-native software... ———————————————————————————————————————————————————————————— Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave 2026-07-28 · Intel · Industrial, Semiconductors https://newsroom.intel.com/intel-foundry/intel-completes-ramp-c-program-accelerating-momentum-for-secure-enclave What’s New: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology and manufacturing in the United States, establishing a foundation for expanded trusted domestic semiconductor manufacturing.“The collaboration between the DoW and Intel on the Trusted & Assured Microelectronics … The post Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave appeared first on Newsroom. ———————————————————————————————————————————————————————————— Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies 2026-07-25 · Samsung · AI, Semiconductors https://news.samsung.com/global/samsung-electronics-and-broadcom-expand-strategic-collaboration-across-memory-and-foundry-technologies Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MOU was announced during the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and Head of Samsung […] ———————————————————————————————————————————————————————————— Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era 2026-07-24 · Intel · AI, Semiconductors https://newsroom.intel.com/new-technologies/intel-and-lens-technology-collaborate-to-enable-advanced-semiconductor-packaging-for-the-ai-era SANTA CLARA, Calif. & CHANGSHA, China — Intel Corporation and Lens Technology today announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging. Through this work, the companies intend to explore opportunities to accelerate the development of glass substrate-based packaging solutions that can help enable higher performance, increased interconnect density, and improved … The post Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era appeared first on Newsroom. ———————————————————————————————————————————————————————————— Intel Reports Second-Quarter 2026 Financial Results 2026-07-23 · Intel · Finance, Semiconductors https://newsroom.intel.com/corporate/intel-reports-second-quarter-2026-financial-results Intel Corporation’s second-quarter 2026 earnings news release and presentation are available on the company’s Investor Relations website. The earnings conference call for investors begins at 2 p.m. PDT today; a public webcast will be available at www.intc.com.More: Earnings News Release | Earnings Call Comments from CEO Lip-Bu Tan and CFO Dave Zinsner The post Intel Reports Second-Quarter 2026 Financial Results appeared first on Newsroom. ———————————————————————————————————————————————————————————— Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience 2026-07-21 · Intel · Finance, Industrial, Logistics, Cybersecurity, Semiconductors https://newsroom.intel.com/manufacturing/intel-and-fortinet-collaborate-to-advance-cybersecurity-innovation-and-strengthen-global-supply-chain-resilience SANTA CLARA AND SUNNYVALE, Calif. – July 21, 2026 – Intel Corporation (NASDAQ: INTC) and Fortinet (NASDAQ: FTNT), today announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6). Expanding a long-standing relationship between the two companies, this collaboration combines Fortinet’s proprietary, purpose-built security processor expertise with Intel’s advanced design, packaging, and manufacturing capabilities … The post Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience appeared first on Newsroom. ———————————————————————————————————————————————————————————— Apple to increase spend with Broadcom to produce billions more U.S. chips 2026-07-08 · Apple · Semiconductors https://www.apple.com/newsroom/2026/07/apple-to-increase-spend-with-broadcom-to-produce-billions-more-us-chips/ Apple announced a new six-year commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies. ———————————————————————————————————————————————————————————— IBM Debuts World's First Sub-1 Nanometer Chip Technology 2026-06-25 · IBM · Finance, Semiconductors https://www.prnewswire.com/news-releases/ibm-debuts-worlds-first-sub-1-nanometer-chip-technology-302809961.html IBM (NYSE: IBM) today unveiled a major semiconductor breakthrough with the introduction of the world's first sub-1 nanometer (nm) chip technology,... ———————————————————————————————————————————————————————————— OpenAI and Broadcom unveil LLM-optimized inference chip 2026-06-24 · OpenAI · AI, Semiconductors https://openai.com/index/openai-broadcom-jalapeno-inference-chip OpenAI and Broadcom introduce Jalapeño, a custom AI chip built for LLM inference to improve performance, efficiency, and scale across AI systems. ———————————————————————————————————————————————————————————— Broadcom Inc. Announces Results and Upsize of Offers to Purchase for Cash Certain of its Outstanding Debt Securities 2026-06-18 · Broadcom · Finance, Semiconductors https://www.prnewswire.com/news-releases/broadcom-inc-announces-results-and-upsize-of-offers-to-purchase-for-cash-certain-of-its-outstanding-debt-securities-302803781.html Broadcom Inc. (NASDAQ: AVGO) ("Broadcom") today announced the expiration and results of its previously announced cash tender offers (collectively,... ———————————————————————————————————————————————————————————— Broadcom Inc. Announces Pricing Terms of Offers to Purchase for Cash Certain of its Outstanding Debt Securities 2026-06-17 · Broadcom · Finance, Semiconductors https://www.prnewswire.com/news-releases/broadcom-inc-announces-pricing-terms-of-offers-to-purchase-for-cash-certain-of-its-outstanding-debt-securities-302803433.html Broadcom Inc. (NASDAQ: AVGO) ("Broadcom") today announced the pricing terms of its previously announced cash tender offers (collectively, the... ———————————————————————————————————————————————————————————— Broadcom Inc. Commences Offers to Purchase for Cash Certain of its Outstanding Debt Securities 2026-06-11 · Broadcom · Finance, Semiconductors https://www.prnewswire.com/news-releases/broadcom-inc-commences-offers-to-purchase-for-cash-certain-of-its-outstanding-debt-securities-302798039.html Broadcom Inc. (NASDAQ: AVGO) ("Broadcom") today announced that it has commenced cash tender offers (collectively, the "Offers") to purchase the... ———————————————————————————————————————————————————————————— Broadcom, Apollo, and Blackstone Establish Landmark Strategic Platform to Accelerate More Than 20 Gigawatts of Global AI Deployments 2026-06-09 · Broadcom · Finance, AI, SaaS, Semiconductors, Investing & markets, Software & IT https://www.prnewswire.com/news-releases/broadcom-apollo-and-blackstone-establish-landmark-strategic-platform-to-accelerate-more-than-20-gigawatts-of-global-ai-deployments-302795286.html Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions,... ———————————————————————————————————————————————————————————— Broadcom Inc. Announces Second Quarter Fiscal Year 2026 Financial Results and Quarterly Dividend 2026-06-03 · Broadcom · Finance, Semiconductors, Investing & markets https://www.prnewswire.com/news-releases/broadcom-inc-announces-second-quarter-fiscal-year-2026-financial-results-and-quarterly-dividend-302790698.html Revenue of $22,187 million for the second quarter, up 48 percent from the prior year period GAAP net income of $9,310 million for the second quarter; ... ———————————————————————————————————————————————————————————— Oracle Java to Power Samsung Electronics' Global Semiconductor Development 2026-05-12 · Oracle · Semiconductors https://www.prnewswire.com/news-releases/oracle-java-to-power-samsung-electronics-global-semiconductor-development-302768823.html Oracle today announced that the Oracle Java SE Universal Subscription will help standardize global software development at Samsung Electronics, a... ———————————————————————————————————————————————————————————— Broadcom Inc. to Announce Second Quarter Fiscal Year 2026 Financial Results on Wednesday, June 3, 2026 2026-05-04 · Broadcom · Finance, Semiconductors, Software & IT https://www.prnewswire.com/news-releases/broadcom-inc-to-announce-second-quarter-fiscal-year-2026-financial-results-on-wednesday-june-3-2026-302761260.html Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions,... ———————————————————————————————————————————————————————————— OpenAI and Broadcom announce strategic collaboration to deploy 10 gigawatts of OpenAI-designed AI accelerators 2025-10-13 · OpenAI · AI, Energy, Semiconductors https://openai.com/index/openai-and-broadcom-announce-strategic-collaboration OpenAI and Broadcom announce a multi-year partnership to deploy 10 gigawatts of OpenAI-designed AI accelerators, co-developing next-generation systems and Ethernet solutions to power scalable, energy-efficient AI infrastructure by 2029. ———————————————————————————————————————————————————————————— AMD and OpenAI announce strategic partnership to deploy 6 gigawatts of AMD GPUs 2025-10-06 · OpenAI · AI, Semiconductors https://openai.com/index/openai-amd-strategic-partnership AMD and OpenAI have announced a multi-year partnership to deploy 6 gigawatts of AMD Instinct GPUs, beginning with 1 gigawatt in 2026, to power OpenAI’s next-generation AI infrastructure and accelerate global AI innovation. ———————————————————————————————————————————————————————————— Samsung and SK join OpenAI’s Stargate initiative to advance global AI infrastructure 2025-10-01 · OpenAI · AI, Semiconductors https://openai.com/index/samsung-and-sk-join-stargate Samsung and SK join OpenAI’s Stargate initiative to expand global AI infrastructure, scaling advanced memory chip production and building next-gen data centers in Korea. ———————————————————————————————————————————————————————————— Point-E: A system for generating 3D point clouds from complex prompts 2022-12-16 · OpenAI · AI, Semiconductors https://openai.com/index/point-e Abstract While recent work on text-conditional 3D object generation has shown promising results, the state-of-the-art methods typically require multiple GPU-hours to produce a single sample. This is in stark contrast to state-of-the-art generative image models, which produce samples in a number of seconds or minutes. In this paper, we explore an alternative method for 3D object generation which produces 3D models in ———————————————————————————————————————————————————————————— Techniques for training large neural networks 2022-06-09 · OpenAI · AI, Semiconductors https://openai.com/index/techniques-for-training-large-neural-networks Large neural networks are at the core of many recent advances in AI, but training them is a difficult engineering and research challenge which requires orchestrating a cluster of GPUs to perform a single synchronized calculation. ———————————————————————————————————————————————————————————— Introducing Triton: Open-source GPU programming for neural networks 2021-07-28 · OpenAI · Semiconductors https://openai.com/index/triton We’re releasing Triton 1.0, an open-source Python-like programming language which enables researchers with no CUDA experience to write highly efficient GPU code—most of the time on par with what an expert would be able to produce. ———————————————————————————————————————————————————————————— Block-sparse GPU kernels 2017-12-06 · OpenAI · AI, Semiconductors https://openai.com/index/block-sparse-gpu-kernels We’re releasing highly-optimized GPU kernels for an underexplored class of neural network architectures: networks with block-sparse weights. Depending on the chosen sparsity, these kernels can run orders of magnitude faster than cuBLAS or cuSPARSE. We’ve used them to attain state-of-the-art results in text sentiment analysis and generative modeling of text and images. ———————————————————————————————————————————————————————————— Extensions and limitations of the neural GPU 2016-11-02 · OpenAI · Semiconductors https://openai.com/index/extensions-and-limitations-of-the-neural-gpu Abstract The Neural GPU is a recent model that can learn algorithms such as multi-digit binary addition and binary multiplication in a way that generalizes to inputs of arbitrary length. We show that there are two simple ways of improving the performance of the Neural GPU: by carefully designing a curriculum, and by increasing model size. The latter requires a memory efficient implementation, as a naive implementatio