401 press releases in English indexed under semiconductors.
Power device delivers 20A of continuous current in a compact form factor for new space and traditional space applications Power device delivers 20A of continuous current in a compact form factor for new space and traditional space applications
Invest in energy-efficient, IoT-enabled vacuum pumps, target semiconductor demand and expand across Asia-Pacific to reduce downtime and gain a competitive edge Invest in energy-efficient, IoT-enabled vacuum pumps, target semiconductor demand and expand across Asia-Pacific to reduce downtime and gain a competitive edge
TOKYO, Oct. 14, 2026 -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced a global call for papers for its VOICE 2027 Developer Conference, focusing on leading-edge technologies and future trends. The conference will be held in San Jose, Calif., at the Signia by Hilton on June 14-16, 2027. VOICE is the leading conference for the growing global community of users and strategic partners involved with Advantest’s V93000 and T2000 SoC test platforms, handlers, test cell solutions, product engineering and technology development. The annual conference brings together semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to discuss the latest technological advancements and network with peers. “The semiconductor industry is experiencing an extraordinary period of growth,” said Daniel Grzeda, VOICE 2027 General Chair, Test Quality Director, Texas Instruments. “Meeting the demands of this rapid evolution in artificial intelligence (AI) and high-performance compute (HPC) technology requires continuous innovation across the entire ecosystem, from design and manufacturing to test and measurement. VOICE 2027 provides a unique forum for engineers, researchers and industry leaders to share knowledge, exchange best practices and collaborate on the technologies that will enable the next generation of semiconductor innovation.” Like in previous years, VOICE 2027 will offer a wide array of learning opportunities through technical presentations, keynote addresses and technology kiosks. Advantest’s VOICE 2027 call for papers focuses on these technology tracks and suggested topic areas:
SAN JOSE, Calif., Oct. 13, 2026 -- MSI showcases its open data center and AI infrastructure at the 2026 OCP Global Summit (Booth #A49), led by new 21-inch ORv3 systems and DC-MHS modular building blocks, alongside NVIDIA MGX rack and GPU server platforms and the XpertStation...
Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027, featuring 1.5 �m resolution *1 (L/S *2 ) and throughput of 72 panels / hour *3. The DSP-110 also supports large substrates and achieves approximately 40% higher throughput than the DSP-100, which offers resolution of 1.0 �m (L/S) *4. - - *1: 1 �m (micrometer) represents one-millionth of a meter (one-thousandth of a millimeter). - - *2: Abbreviation for Line and Space. Re... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=362788
Capitalize on advanced chip demand with insights into high-purity materials, regional opportunities, competitive strategies, product innovation, and new revenue streams. Capitalize on advanced chip demand with insights into high-purity materials, regional opportunities, competitive strategies, product innovation, and new revenue streams.
Capitalize on mandatory pet identification, rising safety awareness and pet humanization, with opportunities across veterinary clinics, retail and E-Commerce. Capitalize on mandatory pet identification, rising safety awareness and pet humanization, with opportunities across veterinary clinics, retail and E-Commerce.
Buying GPUs clears one hurdle in the AI race. Keeping them powered clears another. As AI services expand from chat into reasoning, video generation, and automated tasks, competition increasingly extends to electricity supply, grid connections, and data center operations. The […]
MIAMI BEACH, FL, Oct 13, 2026 - Digi Power X Inc. (Nasdaq:DGXX)(Cboe Canada:DGX) ("Digi Power X" or the "Company"), an AI data center infrastructure operator, today announced that it has received a commitment letter from a major lending institution for US$200 million in debt financing to support the development of its 40 MW AI data center in Columbiana, Alabama. The financing, syndicated by Goldman Sachs, is expected to close within 90 days, subject to definitive documentation and satisfaction of various conditions, including the lender's completion of its diligence efforts. The financing is to be structured at a project special purpose vehicle ("SPV") level, with an unsecured Company guarantee through project completion and other limited matters. Proceeds are intended to support completion of the Alabama project and related project costs, helping preserve corporate liquidity, mitigate shareholder dilution and position the Company to pursue additional customer contracts. "This financing commitment is an important step toward completing our Alabama campus while limiting dilution for our shareholders. We are progressing from infrastructure development toward revenue generation, with construction on schedule in Alabama, our first modular GPU deployment operating successfully, and expansion plans advancing across our portfolio." - Michel Amar, Chairman & Chief Executive Officer, Digi Power X Inc. Financial Position and Alabama Construction Update As of the date hereof, Digi Power X held approximately US$135 million in cash and invested approximately US$153 million in capital expenditures year to date in 2026. The Company did not issue any shares under its at-the-market ("ATM") equity offering program during the third quarter of 2026, resulting in no ATM-related shareholder dilution during the quarter. Construction at the 40 MW Alabama campus remains on target, with Phase 1 expected to be completed in December 2026 and Phase 2 in March 2027. ARMS 200 Operations and Supermicro Partnership The Company's first ARMS 200 modular data center has been operating successfully since May 2026, supporting its GPU bare-metal business. The deployment demonstrates Digi Power X's ability to manage the infrastructure supporting these services, including power, cooling, data center operations and GPU systems. Digi Power X's partnership with Super Micro Computer, Inc. ("Supermicro") supports dedicated, bare-metal access to NVIDIA Blackwell GPUs, enabling customers to deploy AI workloads without building or managing the underlying infrastructure themselves. Supermicro recently highlighted the collaboration publicly, underscoring its role in powering Digi Power X's full-stack AI offering. Digi Power X: Expanding the AI Token Factory Through NeoCloudz Digi Power X plans to expand its AI token factory infrastructure through its NeoCloudz platform, using the proprietary ARMS modular data center systems of US Data Center, Inc., a subsidiary of which the Company is the largest shareholder, to support fast deployment. This expansion is intended to support the Company's planned growth in GPU bare-metal services and AI token generation. Building on its initial ARMS 200 deployment, the Company intends to deploy additional modular capacity to meet customer demand and grow recurring AI infrastructure revenue. "We're excited to unveil our AI token factory at NVIDIA GTC Berlin. Digi Power X owns the whole stack, from the power to the data center to the computer, and that's how we deliver fast, affordable inference at scale." - Alec Amar, President, Digi Power X Inc. New York Transition to AI Token Factories Digi Power X is in the planning phase to repurpose its New York State sites into AI token factories, expanding capacity for GPU bare-metal services and AI token generation. The planned conversion is designed to reduce site noise levels and incorporate closed-loop cooling systems designed to minimize water consumption by recirculating coolant without routine evaporative water use. Silicon Valley Development Lab The Company has also acquired an office and laboratory facility in Silicon Valley to develop the technology and operational intelligence supporting its AI token factory strategy. Digi Power X is bringing together top talent in engineering, artificial intelligence and software development to accelerate innovation and strengthen its capabilities as it expands its GPU infrastructure and AI services. About Digi Power X Digi Power X is a fully integrated AI infrastructure company that owns and operates the whole stack, from power generation and data centers to the computers that run AI workloads. The Company offers colocation for enterprise and hyperscale customers, bare metal GPU rental and a token factory that delivers AI inference at scale. Because it controls the power, the infrastructure and the compute, Digi Power X can bring capacity online faster and more affordably. For more information, visit www.digipowerx.com. Investor Relations For further information, please contact: Michel Amar, Chief Executive Officer Digi Power X Inc. www.digipowerx.com Investor Relations: T: 888-474-9222 | Email: IR@digihostpower.com Cautionary Statement Trading in the securities of the Company should be considered highly speculative. No stock exchange, securities commission or other regulatory authority has approved or disapproved the information contained herein. Cboe Canada does not accept responsibility for the adequacy or accuracy of this release. Cautionary Note and Forward-Looking Statements This press release contains "forward-looking statements" within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, and "forward-looking information" within the meaning of applicable Canadian securities laws (collectively, "forward-looking statements"). All statements other than statements of historical fact are forward-looking statements. Words such as "anticipate," "believe," "continue," "estimate," "expect," "intend," "may," "plan," "potential," "proposed," "should," "target," "will," "would" and similar expressions are intended to identify forward-looking statements, although not all forward-looking statements contain these words. Forward-looking statements in this press release include, without limitation, statements regarding: the proposed $200 million debt financing, including the timing of closing and funding, and the satisfaction of conditions to closing, including lender satisfaction of its diligence requirements; the expected use of proceeds, including the funding of remaining construction and related project costs, and the anticipated effects on corporate liquidity and shareholder dilution; the progress, schedule and completion of Phase 1 and Phase 2 of the Company's 40 MW AI data center in Columbiana, Alabama, the Company's ability to pursue additional customer contracts and generate recurring revenue; the planned expansion of the Company's AI token factory infrastructure, including through USDC and the ARMS modular data center platform; the planned conversion of the Company's New York State sites and the anticipated noise and water use benefits of that conversion; the anticipated use and benefits of the Company's Silicon Valley facility; and the execution of the Company's AI infrastructure strategy. These statements are based on management's current expectations, estimates and assumptions and are subject to known and unknown risks, uncertainties and other factors that could cause actual results to differ materially, including, among others: the risk that the conditions to closing under the commitment letter are not satisfied or waived on a timely basis or at all, or that the financing is not completed on the anticipated terms or at all; the risk that the lender's commitment terminates or is modified; the possibility that financing proceeds will be insufficient to fund all remaining construction and project costs; the risk that preliminary financial information differs from final reported results; construction delays, cost overruns, supply chain disruptions and the availability of equipment, GPUs, labor and power; permitting, zoning, environmental and other regulatory approvals; the performance of contractors, partners and counterparties; the ability of the Company and its customers to perform under the Company's colocation and other customer agreements; obligations under the financing; demand for AI and high-performance computing infrastructure; general economic, market and interest rate conditions; and the other risks and uncertainties described under "Risk Factors" in the Company's most recent Annual Report on Form 10-K and other filings with the U.S. Securities and Exchange Commission. Readers are cautioned not to place undue reliance on forward-looking statements, which speak only as of the date of this press release. Except as required by applicable law, the Company undertakes no obligation to update or revise any forward-looking statement, whether as a result of new information, future events or otherwise. SOURCE: Digi Power X Inc.
BEIJING, Oct 13, 2026 - On September 14, Gartner released its Magic Quadrant™ for Server Virtualization Platforms. H3C CAS is positioned as a Visionary in the 2026 Gartner® Magic Quadrant™ for Server Virtualization Platforms, making H3C one of the few Chinese vendors included in the report. This recognition reflects H3C CAS's continued innovation and capabilities in server virtualization. Beyond Virtualization: A Stable Foundation for Mission-Critical Workloads As cloud computing continues to evolve, server virtualization remains a key foundation for enterprise IT infrastructure. At the same time, the growth of AI, diverse computing architectures, and the coexistence of virtual machines and containers are creating new requirements for virtualization platforms. H3C CAS has evolved from a compute virtualization platform into an enterprise virtualization and cloud management platform covering compute, storage, networking, security, and unified management. It supports x86, ARM, and a broad range of operating systems and hardware. Key capabilities include: 1. Improved resource utilization with NVMe SSD-based intelligent memory overcommitment. 2. Optimized VM scheduling with automatic VM NUMA binding. 3. Support for AI workloads with capabilities such as vGPU live migration. From Virtual Machines to Containers: One Platform for Application Modernization As virtual machines and containers increasingly coexist in enterprise data centers, organizations need a unified infrastructure platform to support both traditional and cloud-native applications. H3C CAS integrates virtualization and cloud-native technologies through native Kubernetes integration and container cluster services, enabling unified management of VM and container resources. CAS also provides virtual networking and network services, including Open vSwitch, bandwidth management, traffic prioritization, firewalls, load balancing, and micro-segmentation. Support for RoCE v2 and SR-IOV further enables high-performance and AI workloads. Evolving Virtualization for the AI Era As IT infrastructure evolves from server virtualization to cloud and AI infrastructure, enterprises continue to require stable, secure, efficient, and future-ready platforms. The Visionary positioning in the Gartner Magic Quadrant reflects the global competitiveness of H3C CAS in server virtualization. Today, CAS serves more than 15,000 customers, with 500,000+ CPUs running online, across industries including government, finance, education, and broadcasting and television. Looking ahead, H3C will continue to integrate server virtualization with AI computing, GPU resource management, and cloud-native technologies, helping customers build more efficient and intelligent infrastructure for next-generation data centers. Disclaimer: Source:Gartner, Magic Quadrant for Server Virtualization Platforms, 14 September 2026 GARTNER and Magic Quadrant are registered trademarks of Gartner, Inc. and/or its affiliates in the U.S. and internationally and are used herein with permission. All rights reserved. Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner's research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability or fitness for a particular purpose. H3C Jingwen Zeng zeng.jingwen@h3c.com https://www.h3c.com/en/
New AI-Native Wi-Fi 8 Gateway combines next-generation connectivity, local AI computing, and intelligent software TAIPEI, Oct. 13, 2026 -- Gemtek Technology Co., Ltd. announced it is highlighting an AI-native Wi-Fi 8 broadband gateway at Network X 2026, developed in...
Tower will issue its third quarter 2026 earnings release on Nov 2, 2026. Tower will hold a conference call to discuss its third quarter financial results.