Semiconductors
Microsoft Discovery lowers barriers to chip design
The post Microsoft Discovery lowers barriers to chip design appeared first on Source.
Sep 17 · 14:12Microsoft
401 press releases in English indexed under semiconductors.
The post Microsoft Discovery lowers barriers to chip design appeared first on Source.
MACOM's new front end 3.2 T chipset accelerates development of optical interconnects for AI, cloud data centers and high speed networking applications.
Shanghai Chengwei Semiconductor Equipment Expands Production Capacity for Chemical and Slurry Delivery Systems
Hollister brings 25+ years of financial leadership across the global semiconductor industry, including previous CFO roles at GlobalFoundries and Silicon Labs SYDNEY, Sept. 15, 2026 -- Silicon Quantum Computing (SQC), a pioneer in quantum computing and atomic-precision...
Santa Clara, CA and Kyoto, Japan, Sept. 15, 2026 -- ROHM Semiconductor today announced it has developed the RS4P063BPHZG, a 100V MOSFET optimized for automotive safety functions and protection circuits. The new product achieves industry-leading* Wide-SOA (Safe Operating Area) across a broad voltage range in the standard HPLF5060 (5060-size) package widely used in automotive applications. By incorporating a design that effectively suppresses secondary breakdown, it delivers approximately 5 times the SOA tolerance of standard equivalent-sized products under VDS=100V and PW=100μs. This contributes to greater reliability in automotive applications subject to momentary high-power loads, including airbag inflator ignition circuits and seatbelt pretensioner drive circuits.
Advanced 2nm SoC delivers leap in performance and efficiency for agentic AI, gaming, imaging, and compute, including 61% drop in multi-core power consumption HSINCHU, Sept. 15, 2026 -- MediaTek, the world's number one provider of mobile chipsets, today announced the launch of...
WUXI, China, Sept. 15, 2026 -- We are advised by HUHUTECH International Group Inc. that journalists and other readers should disregard the news release “HUHUTECH International Group Awarded Follow-On Contract from Anchor Customer to Support Continued Capacity Expansion in the Arizona Semiconductor Corridor” issued May 28, 2026 over GlobeNewswire.
Investment supports CIH’s transition from design services to semiconductor product company and advances roadmap for highly integrated RF solutions Investment supports CIH’s transition from design services to semiconductor product company and advances roadmap for highly integrated RF solutions
BENGALURU, India, Sept. 14, 2026 -- VPG Foil Resistors, a Vishay Precision Group, Inc. (NYSE:VPG) company, has announced a strategic partnership with Source Technologi to expand its presence across India. The collaboration focuses on delivering high-precision resistors to key growth industries, including Aerospace & Defense, Industrial Automation, Telecom Infrastructure, and Semiconductors.
As local models become more capable, AI agents can handle more work directly on a PC while keeping sensitive information on the device. Portable Computer is a local version of the agent Perplexity Computer that plans and carries out multistep tasks. Accelerated by NVIDIA GPUs, it uses local models to analyze data, bring together information […]
F-Secure and AMD Silo AI explore adaptive AI routing across local, private and cloud infrastructure to help keep user data secure as AI agents work.
NEW YORK, Sept. 12, 2026 -- RaserTech.com is an example of a company that did not simply survive change — it was reshaped by it. Founded in Utah in 2002, Raser Technologies originally operated in the energy and infrastructure space, where projects demanded heavy capital, deep technical expertise, and patience for long return cycles. That background matters, because it shows Raser Technologies was built in a difficult, asset-heavy environment long before it became associated with AI infrastructure.