Updated hourlyHourly refreshSun, Oct 25, 2026
AI · Industrial
Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era. Building on years of successful cooperation, the companies will work together to accelerate the development and deployment […]
Sep 8 · 09:18·Samsung
Semiconductors
ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
Sep 8 · 06:04·GlobeNewswire
Finance · SaaS
STOCKHOLM, Sept. 8, 2026 -- Autoliv, Inc. (NYSE: ALV) (SSE: ALIVsdb), the worldwide leader in automotive safety systems, is advancing the development of virtual testing through its Human Body Model (HBM) Safety Suite. The platform is designed to support the development of...
Sep 8 · 06:00·PR Newswire
Finance · AI
HONGKONG/BEIJING, Sept 8, 2026 - September 7, 2026, Crealights (01191.HK) today officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries (NASDAQ: GFS, "GF"), a leading global semiconductor manufacturer. Leveraging GF's industry-leading silicon photonics technology, Crealights will vigorously advance the engineering deployment and mass production of its 6.4T NPO (Near-Package Optics) products, accelerating the industrialization of next-generation AI silicon photonic interconnect technologies. This strategic move will empower Crealights to consolidate its domestic market position while continuously expanding its footprint in North America and its global business landscape, marking a new phase in the company's global commercialization journey.
Currently, global AI computing clusters are rapidly evolving from horizontal scaling (Scale-out) to vertical scaling (Scale-up). Facing the extreme demands of 10,000-card-scale hyperscale data centers for bandwidth density, power efficiency, and latency, Near-Package Optics (NPO) and Co-Packaged Optics (CPO) have emerged as mainstream solutions to overcome next-generation AI interconnect bottlenecks. By integrating and packaging the optical engine directly adjacent to the compute chip, these technologies significantly shorten the optoelectronic signal transmission path. Backed by its comprehensive and mature full-stack silicon photonic technology moat in both NPO and CPO, Crealights has taken the lead in launching 3.2T and 6.4T NPO optical engine products, demonstrating a robust technological advantage in next-generation high-speed AI interconnects.
To comprehensively solidify the technological foundation for high-density optical interconnects in next-generation AI systems, Crealights has entered into a deep partnership with GlobalFoundries (GF). By deeply integrating GF's silicon photonics platform with SCALE™ Co-Packaged Optics (CPO) solutions, Crealights continues to build a comprehensive advantage integrating photonic integration, high-performance RF CMOS, advanced optical devices, and fiber optic connectivity. Currently, Crealights is collaborating with GF to establish a broad ecosystem of partners spanning design, packaging, connectivity, and system layers, fully supporting the deployment and implementation of diverse next-generation optical architectures.
Meanwhile, leveraging GF’s scalable global manufacturing footprint and proven high-volume production capabilities, Crealights has established a "dual-track" global manufacturing system that operates in parallel both domestically and internationally. Through the efficient synergy of capacity at home and abroad, this strong alliance has not only significantly shortened the R&D cycle for next-generation optical interconnect products, but also achieved end-to-end integration across the entire chain—from local chip design to scaled delivery for customers in North America and worldwide. Together, they are paving a clear path from technology development to large-scale commercialization, effectively addressing the increasingly urgent demand for optical connectivity in AI computing clusters and hyperscale data centers.
A spokesperson for Crealights stated: "Having consolidated our position in the domestic AI computing infrastructure market, Crealights is now driving its global expansion with core NPO and CPO technologies. Adding GF's global manufacturing network and silicon photonics process technology to our current silicon photonics ecosystem ensures a stable supply of next-generation silicon photonic products and completes the commercial closed-loop from local R&D to global delivery, continuously providing core interconnect solutions for large-scale AI computing clusters worldwide."
Thomas Barber, Vice President of Communications Infrastructure and Data Center End Markets at GlobalFoundries, commented: "Crealights' comprehensive full-stack silicon photonic design capabilities are highly aligned with GF's strengths in scaled wafer manufacturing. Through global capacity synergy and advanced packaging technology empowerment, both parties will drive the large-scale market deployment of Crealights' products in North America and globally, jointly promoting the widespread application of silicon photonic technology in global AI computing infrastructure."
Looking ahead, Crealights will continue to deepen their collaboration with GF across three key areas: joint R&D of cutting-edge technologies, global manufacturing capacity synergy, and the industrialization of NPO and CPO, as well as the co-building of the industry ecosystem. This will drive the global scaled deployment of silicon photonic solutions, unlocking more technological possibilities for AI-driven diverse application scenarios.
About Crealights
Crealights is a globally leading provider of AI silicon photonic interconnect solutions, dedicated to delivering high-speed, low-power optical interconnect products for AI data centers and hyperscale computing clusters. The company possesses end-to-end technical capabilities spanning silicon photonic chip design, wafer testing, and optical module manufacturing. Its core product portfolio covers 400G, 800G and 1.6T optical modules, Active Optical Cables (AOC), as well as NPO and CPO optical engines. Backed by its deep domestic industry foundation and global capacity layout, Crealights has become a key player in global AI computing interconnects.For more information, visit www.crealights.com.
About GlobalFoundries
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, please follow the WeChat Official Account: GLOBALFOUNDRIES_CN.
Media Contact
Ms. Claire Zhang
TEL: (852) 5427 3696
E-mail: projectcrealights.list@everbloom.com.cn
Sep 8 · 05:00·ACN Newswire
AI · Education
AMD will bring its AI Engage Developer Program to the University of Delhi with a goal of training as many as 10,000 students with hands-on AI skills over the next year.
Sep 8 · 00:00·AMD
Semiconductors
ASML reports transactions under its current share buyback program
Sep 7 · 12:00·GlobeNewswire
Finance · AI
HONG KONG, Sept 7, 2026 - Crealights Technology Co., Ltd. (“Crealights” or the “Company”, Stock Code: 1191.HK) has been officially included as a constituent stock of the Hang Seng Composite Index, becoming eligible for the Stock Connect trading scheme starting today. Mainland investors can now trade the Company’s shares directly through the Stock Connect channels, which is expected to further broaden the Company’s investor base and enhance its share trading liquidity.
This inclusion follows the Hang Seng Index Company's quarterly review results for the period ended June 30, 2026, announced on August 21, 2026. The inclusion deepens the Company’s connection with the onshore capital market, which is expected to attract greater long-term capital interest and provide more diversified capital market support for the Company’s long-term value growth.
Continuous Financial Deliverables and Accelerated Product Structure Upgrades
The Company released its post-listing interim results on August 28. During the reporting period, total revenue reached RMB798.5 million, representing a year-on-year increase of 14.4% and a half-on-half growth of 52.7%. The revenue contribution from silicon photonics products surged significantly from 15.3% in the same period last year to 39.0%, as the Company’s business structure continues to upgrade toward higher-speed and higher-value-added solutions.
With 800G silicon photonics modules entering the volume shipment stage—supporting maximum transmission distances of up to approximately two kilometers—the Company’s large-scale commercial application capabilities in silicon photonics technology have been further validated. During the reporting period, R&D expenses increased by 58.5% year-on-year to RMB67.8 million, raising its proportion of total revenue to 8.5%. These investments were primarily channeled into continuous R&D for high-speed optical interconnects and next-generation silicon photonics products, securing technical reserves for subsequent product iteration and commercialization.
Multi-Dimensional Growth Drivers to Capture Long-Cycle AI Infrastructure Dividends
The accelerated construction of AI data centers has driven a sustained surge in demand for high-speed optical interconnects. The global market for AI optical modules is projected to maintain a compound annual growth rate of approximately 30% over the next five years, unlocking long-term growth opportunities for the silicon photonics and high-speed optical interconnect industries. Leveraging its end-to-end technological capabilities spanning silicon photonics chip design to optical module manufacturing, and bolstered by the secured supply of 10 million DSP chips, the Company has successfully consolidated its supply chain advantages.
On the product front, the Company’s 800G silicon photonics optical modules have achieved volume shipments, and 1.6T products are scheduled to enter large-scale mass production in the second half of 2026. Meanwhile, the Company is actively deploying next-generation high-speed interconnection solutions such as PCIe 6.0/7.0 silicon photonics AOCs and 3.2T/6.4T NPO/CPO products. On the capacity and manufacturing front, it continues to advance expansion and AI-powered smart manufacturing to further improve mass production efficiency and yield rates. On the client side, it is deepening domestic JDM cooperation while continuously breaking through major North American core customers.
Looking back at the first half of 2026, multiple key milestones were densely delivered, and long-term momentum is set to be continuously released. Entering the second half of the year, the Company will persistently enhance its competitiveness across capacity, manufacturing processes, products, and clients, capturing the long-term growth opportunities of the high-speed optical interconnect industry. This inclusion in Stock Connect marks a new milestone for the Company to connect with a broader capital market and march toward long-term value growth.
About Crealights Technology Co., Ltd. (1191.HK)
Crealights Technology Co., Ltd. is a joint-stock company incorporated in the People's Republic of China with limited liability, whose shares are listed on the Main Board of The Stock Exchange of Hong Kong Limited (Stock Code: 1191.HK). Rooted in the forefront of optical communications, the Company focuses on the R&D, manufacturing, and sales of high-speed optical interconnection products, dedicated to providing high-performance and highly reliable optical communication solutions for global data centers, cloud computing, and telecommunication network customers. Led by its founder and CEO, Dr. Chaoyang Hu, the Company has established a solid market position and an exceptional industry reputation in the high-speed optical transmission field, underpinned by outstanding R&D innovation capabilities, rigorous quality management, and a comprehensive supply chain layout.
Sep 7 · 05:37·ACN Newswire
AI · Semiconductors
BERLIN, Sept. 4, 2026 -- MINISFORUM, a Global Edge Computing Solution Brand & System Integrator, today unveiled two new local AI computing solutions powered by the AMD Ryzen™ AI MAX+ PRO 495 processor: the AI Mini Workstation MS-S1 MAX-P495 and the AI Agent NAS N5 MAX-P495....
Sep 4 · 04:00·PR Newswire
AI · Semiconductors
BERLIN, Sept. 3, 2026 -- ACEMAGIC will exhibit its latest computing products at IFA 2026, taking place from September 4 to 8 at Messe Berlin, Hall 6.2, Booth 128. Among the products on display is the F9A AI mini workstation powered by the AMD Ryzen AI Max+ PRO 495 processor....
Sep 4 · 01:25·PR Newswire
Finance · Semiconductors
IRVINE, Calif., Sept. 03, 2026 -- Skyworks Solutions, Inc. (Nasdaq: SWKS), an innovator of high-performance analog and mixed-signal semiconductors connecting people, places and things, today announced that executives will participate in a fireside chat at the Goldman Sachs Communacopia and Technology Conference in San Francisco at 2:25p.m. PDT on Sept. 10, 2026.
Sep 3 · 12:01·GlobeNewswire
Crypto · AI
HONG KONG, Sept 3, 2026 - On September 3, Xunce Technology (3317.HK) officially launched the TokenCloud all-in-one AI model training and deployment computing power platform. As the hardware resources and infrastructure that facilitate the conversion of data resources into tokens, TokenCloud builds a four-tier, synergistic ecosystem based on heterogeneous computing devices, powered by mainstream algorithmic models, fueled by multi-source internal and external data, and serving vertical industry clients. It is dedicated to establishing a full-chain value pathway from data to tokens, enabling every piece of data to securely and efficiently unlock its intelligent value, and helping industries across the board transform data resources into genuine AI productivity.
The launch of TokenCloud marks Xunce Technology’s formal establishment of a full-chain product closed-loop encompassing “computing power—data—tokens—models—applications.” This achievement signifies a leap from a “digital foundation” to an “AI productivity platform,” securing a strategic vantage point in the token economy era while providing the industry with a model for AI infrastructure that bridges the entire “data-to-token” value chain.
Building a Scenario-Driven, End-to-End Closed Loop to Provide Out-of-the-Box AI Infrastructure
As enterprise AI applications shift from “proof of technical feasibility” to “competition in engineering efficiency,” systemic challenges—such as computing power shortages, difficulties in model selection, hardware compatibility issues, challenges in optimized deployment, and significant security concerns—are becoming the biggest bottlenecks hindering AI implementation.
TokenCloud was created precisely to address these pain points. Positioned as the core “hardware and energy foundation” at the upstream of the token industry chain, it adheres to the principle of “ensuring every unit of computing power precisely serves every enterprise AI scenario.” It has built a complete closed-loop process spanning “scenario identification → model selection → hardware matching → training optimization → secure delivery.” Based on business scenarios and tasks, it intelligently recommends the optimal model and matches it with the most suitable hardware. It then uses distillation optimization to enable lightweight, “specialized” models to achieve accelerated inference with high accuracy, all the way through to secure delivery. With each step seamlessly linked, it provides enterprise customers with out-of-the-box AI infrastructure.
In terms of product design, TokenCloud adopts a “full-chain visualization” philosophy, integrating the previously disparate processes of model selection, computing power configuration, security management, and cost assessment in AI deployment into a unified decision-making platform. Comprising five core modules—solution selection, model distillation, data security management, computing power acceleration, and computing resource management—this platform shifts enterprise AI deployment from “rule-of-thumb” approaches to “data-driven decision-making.” It ensures that the return on investment for every computing power allocation is clearly quantifiable, achieving a dynamic balance among performance, cost, and security.
Four Core Capabilities Build Competitive Barriers and Enable Deep Synergy Between Models and Computing Power
The actual value of a token is determined by four key metrics: first-character latency, generation speed, concurrent processing capacity, and service stability. Through Hardware-Software Co-Optimization, TokenCloud enables the large-scale supply of high-quality tokens—ensuring that every piece of data unleashes its maximum token value through the optimal combination of models and hardware.
Specifically, TokenCloud has established industry-leading technological barriers through four core capabilities: a heterogeneous hardware platform, Cloud-Edge Collaboration Architecture, model evaluation and optimization, and secure isolation:
Heterogeneous Hardware Platform—Integrates diverse computing resources such as GPUs, NPUs, FPGAs, and CPUs to enable unified management and intelligent scheduling across architectures. It supports full-scenario coverage ranging from hundreds to tens of thousands of cards, abstracting underlying, disparate hardware resources into unified computing units.
Cloud-Edge Synergy Architecture—Establishes a hybrid deployment model combining “cloud computing power and on-premises computing power,” enabling elastic scaling to handle large-scale training and high-concurrency inference while ensuring that enterprises’ raw data remains within secure domains. This allows enterprises to enjoy cloud computing power while maintaining full data sovereignty at all times.
Model Evaluation and Optimization System—Establishes a comprehensive evaluation framework covering foundational capabilities, scenario adaptation, engineering optimization, and ecosystem value. It supports task-specific distillation optimization, transferring the core capabilities of large models to lightweight scenario-specific models, thereby significantly reducing inference latency and hardware costs while maintaining high accuracy.
Of particular importance is computing power acceleration—while chip computing power continues to rise, actual effective throughput remains far below theoretical peak values. Through end-to-end acceleration capabilities, TokenCloud significantly reduces first-token latency and enhances concurrent processing capacity, transforming acceleration cards from “waiting for computation” to “continuous computation.” This enables enterprises to support larger business volumes without additional hardware, achieving the optimal balance between accuracy, speed, cost, and deployment efficiency, and enabling the large-scale supply of high-quality tokens.
Security Isolation Mechanism—We build a multi-layered security protection system where data visibility is tiered and data flow is fully traceable throughout its entire journey. Highly sensitive data is 100% locked within the enterprise’s local security domain, with a three-pronged approach combining multi-tenant isolation, encrypted transmission, and access control.
Unlike simple computing power rental platforms or model service platforms on the market, TokenCloud achieves deep synergy between models and computing power—the platform centrally determines the degree of model distillation and the hardware for deployment, ensuring the optimal balance of accuracy, speed, cost, and efficiency. It provides enterprise customers with a comprehensive, one-stop service solution—from model selection and hardware matching to distillation optimization—covering the entire “computing power—data—Token—model—application” chain to accelerate the implementation of enterprise AI.
Software and Hardware Synergy Closes the Full-Path Loop; Full-Stack AI Products Accelerate Industry Adoption
The launch of TokenCloud has enabled Xunce Technology’s full-path product ecosystem to form a complete commercial loop. Previously, the company had introduced the world’s first TokenOS operating system; the two systems have clearly defined roles and operate in synergy.
TokenOS focuses on data capabilities, transforming enterprises’ multi-source, heterogeneous data into standardized scenario-based Tokens in real time, thereby addressing the issue of “data usability.” TokenCloud focuses on model training and deployment, as well as “data + model” integration capabilities. It integrates computing power scheduling, model inference optimization, and the refinement, tuning, and orchestration of enterprise-level small models, bridging the entire chain from data ingestion to application deployment and providing hardware service support for Token generation.
Through this synergy between software and hardware, combined with the underlying AIDP data resource processing service system and the top-level TokenRouters model outcomes service and scenario integration and exchange center, the two solutions together form a complete “computing power—data—Token—model—application” closed-loop ecosystem. This enables enterprises to significantly reduce deployment costs and improve matching efficiency through the synergy of computing power, data, and models. Xunce Technology has also undergone a comprehensive upgrade from an AI real-time data infrastructure service provider to an integrated AI-to-B infrastructure service provider.
Furthermore, Xunce Technology has partnered with multiple domestic GPU manufacturers to focus on the integration of “computing power and data.” As the localization of the full AI stack enters the stage of systematic engineering optimization, TokenCloud has become a key hub connecting domestic heterogeneous computing power with enterprise AI applications, offering significant strategic value within the ecosystem.
Currently, the company has expanded into eleven high-value industries, including finance, telecommunications, power, energy, high-end manufacturing, biomedicine, robotics training, commercial space, urban operations, the low-altitude economy, and smart vehicles. In the first half of 2026, the Token business model was successfully implemented in high-value scenarios such as biomedicine, energy dispatch, and industrial quality inspection, laying the groundwork for cross-industry replication.
The ultimate goal of computing power is not to simply stack chips, but to ensure that every piece of data can be securely and efficiently converted into token value. As AI transitions from the “model competition” phase to the “deployment competition” phase, enterprises need not isolated computing power or isolated models, but rather an integrated infrastructure capable of combining computing power, data, and models to truly adapt to enterprise business scenarios. Positioned as an integrated AI infrastructure, TokenCloud enables computing power to serve models, models to serve scenarios, and scenarios to generate value, thereby laying a solid computing power foundation for the AI transformation of China’s myriad industries.
Sep 3 · 09:00·ACN Newswire
AI · Industrial
Glasgow expansion will increase InP manufacturing capacity to more than 100 million CW DFB lasers annually, supporting anticipated AI infrastructure customer ramps KISTA, Sweden, Sept. 3, 2026 -- Sivers Semiconductors AB (STO: SIVE) today announced a USD 30 million strategic...
Sep 3 · 06:16·PR Newswire