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Press Release Database
Recent press releases, indexed by topic.
Education · Semiconductors
As the semiconductor industry continues to drive innovation across nearly every aspect of modern life, Intel is investing in the next generation of talent through the launch of the Semiconductor Education Pathways Program (SEPP) — a comprehensive workforce development initiative designed to strengthen education pathways from K-12 through post-secondary education and into semiconductor careers.SEPP is …
The post Creating Pathways to Semiconductor Careers: Intel Launches SEPP appeared first on Newsroom.
Aug 6 · 19:30·Intel
AI · Semiconductors
Samsung Electronics a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterprise storage and relevant advanced semiconductor technologies, Samsung presented its latest AI memory portfolio and technology roadmap, including a preview of […]
Aug 5 · 04:30·Samsung
AI · Semiconductors
Industry’s broadest portfolio: New Marvell® Bravera® and Photonic Fabric™ innovations build on Marvell Structera™ CXL memory leadership across AI storage, rack-scale memory expansion and pooling, and pod-level optical shared memory. Overcoming memory bottlenecks: Increased access to high-capacity, high-bandwidth memory across AI infrastructure helps address growing KV cache demands, reduce GPU stalls, improve utiliza
Aug 4 · 13:00·Marvell Technology
Finance · Semiconductors
Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions,...
Aug 3 · 12:00·Broadcom
AI · Semiconductors
As AI demands unprecedented "brain power," the semiconductor industry is moving past the era of relying on single, massive chips. Advanced packaging is the essential craft of interconnecting multiple specialized chips together. This allows them to function as a single, powerful unit that runs faster handling the massive workloads of the future.Intel’s been doing advanced …
The post Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors appeared first on Newsroom.
Jul 29 · 15:00·Intel
Finance · AI
Qualcomm Incorporated (NASDAQ: QCOM) today announced that it has completed its acquisition of Modular Inc, a leading innovator in AI-native software...
Jul 29 · 13:01·Qualcomm
Industrial · Semiconductors
What’s New: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology and manufacturing in the United States, establishing a foundation for expanded trusted domestic semiconductor manufacturing.“The collaboration between the DoW and Intel on the Trusted & Assured Microelectronics …
The post Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave appeared first on Newsroom.
Jul 28 · 15:00·Intel
AI · Semiconductors
Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MOU was announced during the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and Head of Samsung […]
Jul 25 · 14:32·Samsung
AI · Semiconductors
SANTA CLARA, Calif. & CHANGSHA, China — Intel Corporation and Lens Technology today announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging. Through this work, the companies intend to explore opportunities to accelerate the development of glass substrate-based packaging solutions that can help enable higher performance, increased interconnect density, and improved …
The post Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era appeared first on Newsroom.
Jul 24 · 16:46·Intel
Finance · Semiconductors
Intel Corporation’s second-quarter 2026 earnings news release and presentation are available on the company’s Investor Relations website. The earnings conference call for investors begins at 2 p.m. PDT today; a public webcast will be available at www.intc.com.More: Earnings News Release | Earnings Call Comments from CEO Lip-Bu Tan and CFO Dave Zinsner
The post Intel Reports Second-Quarter 2026 Financial Results appeared first on Newsroom.
Jul 23 · 20:01·Intel
Finance · Industrial
SANTA CLARA AND SUNNYVALE, Calif. – July 21, 2026 – Intel Corporation (NASDAQ: INTC) and Fortinet (NASDAQ: FTNT), today announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6). Expanding a long-standing relationship between the two companies, this collaboration combines Fortinet’s proprietary, purpose-built security processor expertise with Intel’s advanced design, packaging, and manufacturing capabilities …
The post Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience appeared first on Newsroom.
Jul 21 · 13:00·Intel
Semiconductors
Apple announced a new six-year commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies.
Jul 8 · 10:00·Apple